A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
Has anyone done FPGA-DSP communication? I use the EMIF interface. I use the internal fifo on the FPGA. How do I connect the fifo interface to the DSP pins? My current result is that the receiving is n...
SystemVerilog is a hardware description and verification language (HDVL). It is based on the IEEE1364-2001 Verilog hardware description language (HDL) and has been extended to include C language data ...
After the program is successfully burned, the trigger pin of the CPLD is always in a high-impedance state. The entire circuit is triggered as soon as it is powered on. I want to know whether it is a p...
On July 21, it was held in the multifunctional conference room on the 6th floor of Building 1 of Shanghai University of Urban Management (50 meters straight after entering the door). Three topics: The...
[size=3][font=宋体]C language is the main tool for developing embedded applications, but C language is not specially designed for embedded systems. Many embedded systems have more stringent requirements...
Tesla and BYD, vying for dominance in the global electric vehicle market, are reportedly considering adopting Samsung's AMOLED (active-matrix organic light-emitting diode) technology for their next...[Details]
The problem of dynamic sealing of equipment always exists with the operation of the equipment. Today, we have specially sorted out the various commonly used sealing forms, usage scope and character...[Details]
introduction
With the development of digital and network technologies, broadcasting technology has become increasingly diversified, with the most significant trend being the transition from an...[Details]
When we travel in cities, we all find that electric vehicles have many advantages. As a means of transportation, they can also fulfill their mission well. Now, more and more residential communities...[Details]
Capable of providing precise and efficient thermal management for artificial intelligence computing power, intelligent sensing and autonomous driving systems
Shenzhen, ...[Details]
Coal mines typically contain gas and coal dust. When gas and coal dust reach a certain concentration, they can cause explosions. Electrical equipment generates arcs during normal operation or durin...[Details]
Bosch has released a new SoC series to support L2+ advanced driver assistance functions. The chip integrates high resolution and long-range detection capabilities, and has built-in support for neur...[Details]
With the support and encouragement of national policies, some Internet car manufacturers have also joined the new energy vehicle manufacturing industry. From the perspective of new car manufacturer...[Details]
Compiled from semiengineering
The industry is increasingly concerned about power consumption in AI, but there are no simple solutions. This requires a deep understanding of software and ...[Details]
introduction
In recent years, with the increasing number of high-rise buildings, the demand for elevators has also increased. Currently, the elevators we use most often use LED dot array displ...[Details]
The practice of warming up a car originated with gasoline-powered vehicles. Warming up the engine allows it to enter a better working state and ensures good lubrication. This has become a habit for...[Details]
As in-vehicle audio and video entertainment features become increasingly diverse, the demand for digital transmission of audio and video information is urgent. Traditional protocols such as IEEE 13...[Details]
It’s a collaborative blueprint designed to address integration complexities and create scalable solutions through Arm’s automotive innovation ecosystem.
The transformation of future mo...[Details]
Challenges come from multiple dimensions, and data centers on wheels require more rigorous testing.
Comparing the past, present, and future of automobiles, one clear trend emerges: cars ...[Details]
Preface
Embedded systems have been widely used in mobile phones, wristbands, tablet computers, and other devices. However, due to the limited processing performance of their central processing...[Details]