EEWORLDEEWORLDEEWORLD

Part Number

Search

0716612568

Description
CONN PLUG 68POS 1.27MM GOLD R/A
CategoryThe connector   
File Size186KB,2 Pages
ManufacturerMolex Premise Network
Environmental Compliance
Download Datasheet Parametric Compare View All

0716612568 Online Shopping

Suppliers Part Number Price MOQ In stock  
0716612568 - - View Buy Now

0716612568 Overview

CONN PLUG 68POS 1.27MM GOLD R/A

0716612568 Parametric

Parameter NameAttribute value
Connector typePlug, central contact strip
Number of pins68
spacing0.050"(1.27mm)
Number of rows2
Installation typeThrough hole, right angle
characteristicboard guide
Contact platinggold
Contact plating thickness30.0µin(0.76µm)
Joint stack height-
board height0.295"(7.50mm)

0716612568 Related Products

0716612568 0716612513 0716612580 0716612540 0716612511 0716612518
Description CONN PLUG 68POS 1.27MM GOLD R/A CONN PLUG 130POS 1.27MM GOLD R/A CONN PLUG 80POS 1.27MM GOLD R/A CONN PLUG 40POS 1.27MM GOLD R/A CONN PLUG 100POS 1.27MM GOLD R/A CONN PLUG 68POS 1.27MM GOLD R/A
Connector type Plug, central contact strip Plug, central contact strip Plug, central contact strip Plug, central contact strip Plug, central contact strip Plug, central contact strip
Number of pins 68 130 80 40 100 68
spacing 0.050"(1.27mm) 0.050"(1.27mm) 0.050"(1.27mm) 0.050"(1.27mm) 0.050"(1.27mm) 0.050"(1.27mm)
Number of rows 2 2 2 2 2 2
Installation type Through hole, right angle Through hole, right angle Through hole, right angle Through hole, right angle Through hole, right angle Through hole, right angle
characteristic board guide board guide board guide board guide board guide board guide
Contact plating gold gold gold gold gold gold
Contact plating thickness 30.0µin(0.76µm) 30.0µin(0.76µm) 30.0µin(0.76µm) 30.0µin(0.76µm) 30.0µin(0.76µm) 30.0µin(0.76µm)
board height 0.295"(7.50mm) 0.295"(7.50mm) 0.295"(7.50mm) 0.295"(7.50mm) 0.295"(7.50mm) 0.295"(7.50mm)
Who has the Chinese information of this chip TPS7A1601QDGNRQ1_
Please share...
1203166639 Electronics Design Contest
After customizing the OS using platform builder, can I download it to my PDA?
Or is the PDA OS already burned in and cannot be modified? Then how can the so-called Windows CE OS development be added to the existing OS? For example, can it be added to my existing PDA OS (Windows...
莽原 Embedded System
Who has the serial port receiving and sending program in lin-sci mode, interrupt mode
Who has the serial port receiving and sending program in lin-sci mode, interrupt mode...
越狱兔哥哥 DSP and ARM Processors
NXP ARM Cortex M0/M3 IAP Application
Most of my recent projects have used the IAP function, and I encountered many problems in using it. I also posted different posts about the problems I encountered:1.LPC1100 processor implements IAP fu...
zhaojun_xf NXP MCU
[X-NUCLEO-IKS01A2 Review] Glider with Bluetooth connection
1. The evaluation plan includes the design of Bluetooth connection and glider, but during the test, the parameters read by mbed are always the initial values, without any changes. It should be because...
北方 MEMS sensors
A Engineer's Guide to Instrumentation Amplifiers
A Engineer's Guide to Instrumentation Amplifiers...
ming1005 MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 51  735  1449  1109  1840  2  15  30  23  38 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号