EEWORLDEEWORLDEEWORLD

Part Number

Search

BBS-128-G-C

Description
INTERCONNECT STRIPS
CategoryThe connector    The connector   
File Size157KB,1 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
Download Datasheet Parametric View All

BBS-128-G-C Online Shopping

Suppliers Part Number Price MOQ In stock  
BBS-128-G-C - - View Buy Now

BBS-128-G-C Overview

INTERCONNECT STRIPS

BBS-128-G-C Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSAMTEC
package instructionROHS COMPLIANT
Reach Compliance Codenot_compliant
ECCN codeEAR99
Factory Lead Time2 weeks
Samacsys Description28 Position .100" Single Row, Screw Machine Terminal Strip
body length2.8 inch
Body/casing typeRECEPTACLE
Connector typeBOARD CONNECTOR
Contact to complete cooperationGOLD (20) OVER NICKEL (50)
Contact completed and terminatedGold (Au) - with Nickel (Ni) barrier
Contact point genderMALE
Contact materialBRASS/PHOSPHOR BRONZE
contact modeRECTANGULAR
Contact styleRND PIN-SKT
DIN complianceNO
Filter functionNO
IEC complianceNO
Insulator colorBLACK
insulator materialGLASS FILLED POLYESTER
JESD-609 codee4
MIL complianceNO
Plug contact pitch0.1 inch
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number1
Number of rows loaded1
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
OptionsGENERAL PURPOSE
PCB contact patternRECTANGULAR
Plating thickness20u inch
GuidelineUL
reliabilityCOMMERCIAL
Terminal length0.125 inch
Terminal pitch2.54 mm
Termination typeSOLDER
Total number of contacts28
F-218
BDL–110–G–F
BBL–112–T–E
BBD–130–T–B
BHS–125–G–A
(2.54 mm) .100"
BBS–116–G–C
BBS, BBL, BHS, BBD, BDL SERIES
MACHINED BOARD STACKING STRIPS
Mates with:
SS, SD, HSS, SL, SDL,
ESS, ESD
TYPE
STRIP
1
NO. PINS
PER ROW
PLATING
OPTION
LEAD
STYLE
FEATURES
Low-profile design
achieves (3.89 mm)
.153" board spacings
when mated with SL
Series.
Approach the reliability
of a permanent
connection with the
flexibility of a separable
connection.
= Standard Single Row
BBS
BBL
(2.54) .100 x No. of Positions
(2.54)
.100
(2.54) .100 TYP
(1.27)
.050
=20 µ" (0.51 µm)
Gold
–G
–T
=Tin
= Low-Profile Single Row
(2.54)
.100
SPECIFICATIONS
For complete specifications
see www.samtec.com?BBS,
www.samtec.com?BBL,
www.samtec.com?BHS
www.samtec.com?BBD or
www.samtec.com?BDL
Insulator Material:
Black Glass Filled Polyester
(BBS, BBD, BBL)
Black High Temp Nylon
(BDL)
Black Liquid Crystal Polymer
(BHS)
Temperature Range:
-55 °C to +125 °C
Terminal Material:
Phosphor Bronze or Brass
Plating:
Au or Sn over 50 µ" (1.27 µm) Ni
RoHS Compliant:
Yes
Lead-Free Solderable:
Wave only
(BBS, BBD, BBL, BDL)
Wave, or reflow with
all Au (BHS)
= High Temp Single Row
BHS
BBL body available with
Styles –E & –F only.
BBS
BHS
BBL
(2.54) .100 x No. of Positions
= Standard Double Row
BBD
BDL
(5.08)
.200
(2.54) .100 TYP
(2.54)
.100
(1.27)
.050
01 thru 32
= BBS & BBL
(2.54)
.100
01 thru 36
BDL body available with
Styles –E & –F only.
= Low-Profile Double Row
BBD
= BBD, BDL & BHS
BDL
Z = (5.33 mm) .210"
–A
Z = (8.51 mm) .335"
–B
Z = (14.86 mm) .585"
–C
Z = (1.78 mm) .070"
–E
Z = (2.16 mm) .085"
–F
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
(3.18)
.125
(0.46)
.018
DIA
(1.27)
.050
(1.78)
.070
DIA
(1.27)
.050 DIA
(0.46)
.018
DIA
Style E:
(2.74)
.108
Style F:
(3.18)
.125
(0.46)
.018 DIA
Z
Z
(1.78)
.070 DIA
(0.46)
.018 DIA
(3.18)
.125
FILE NO. E111594
BBL
Series
(3.18)
.125
Z
BBD
Series
BDL
Series
BBS and BHS
Series
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
About MOS tube packaging
I have been using power amplifier tubes recently, there are two types of them, one is CS package and the other is AP package. What is the difference between these two packages?...
secondlife110 Analog electronics
Useful AVR eBooks
Useful AVR eBooks...
我是教大的 Microchip MCU
How to save the data of DSP and Labview serial communication in real time using Excel?
Has anyone in the forum used labview? How can I save the data of DSP and labview serial communication in real time using Excel?...
安_然 Microcontroller MCU
Question: USB bulk transfer and speed issues
Hello everyone, I recently worked on a USB host project of LPC2378+ISP1161, and encountered a few problems to ask everyone: 1. When transferring data in batches, the following situation often occurs (...
zxfen12 Embedded System
Accurate PSRR Measurement Method
[p=20, null, left][color=rgb(73, 73, 73)][font=Verdana, sans-serif][size=3][backcolor=white][b]Introduction[/b] In theory, the power supply rejection ratio (PSRR) measurement is relatively simple. A v...
wstt Analogue and Mixed Signal
Problems with communicating with PC via rapi (urgent)
This is the first time I write an interface that communicates with a PC through RAPI. I encountered the following problem. Could you please give me some advice? The lower computer continuously writes ...
杨彪 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2737  273  2191  1258  2765  56  6  45  26  52 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号