F-219
BSE–020–01–F–D–A
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 50 µ" GOLD
BTE–040–02–L–D–A
BTE–060–02–F–D–A
(0.80 mm) .0315"
BTE, BSE SERIES
BASIC BLADE & BEAM HEADER & SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?BTE or
www.samtec.com?BSE
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
2 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
225 VAC with 5 mm Stack Height
Max Cycles:
100
RoHS Compliant:
Yes
BTE
Mates with:
BSE
NO. OF POSITIONS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
LEAD
STYLE
PLATING
OPTION
D
A
OTHER
OPTION
–020, –040, –060,
–080, –100, –120
01
= Gold Flash on contact,
Matte Tin on tail
–F
–L
= (7.00 mm) .275" DIA
Polyimide Film Pick
& Place Pad
–K
No. of positions x (0.80) .0315
+ (4.00) .1575
(5.97)
.235
A
(4.27)
.168
(7.21)
.284
–01
–02
= 10 µ" (0.25 µm) Gold
on contact,
Matte Tin on tail
= Tape & Reel
(80 positions maximum)
–TR
(3.94)
.155
02
(0.80) .0315
(0.76)
.030
(7.11)
.280
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-080)
(0.15 mm) .006" max (100-120)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
Board Stacking:
For applications requiring more
than two connectors per board
or 80 positions or higher,
contact ipg@samtec.com
A
(0.20)
.008
= Electro-Polished
Selective
50 µ" (1.27 µm) min Au
over 150 µ" (3.81 µm)
Ni on Signal Pins in
contact area, Matte Tin
over 50 µ" (1.27 µm) min
Ni on all solder tails
*Note:
–C Plating passes
10 year MFG testing
–C*
POWER/SIGNAL
APPLICATION
MATED HEIGHT
LEAD STYLE MATED HEIGHT*
(8.00) .315
*Processing conditions will
affect mated height.
(0.89)
.035
DIA
–01
–02
(5.00) .197
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
FILE NO. E111594
BSE
Mates with:
BTE
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
A
OTHER
OPTION
ALSO AVAILABLE
(MOQ Required)
•
•
•
•
30 µ" (0.76 µm) Gold
Edge Mount Capability
Friction Lock option
11 mm, 14 mm, 16.10 mm,
19.10 mm, 22 mm, 25 mm
and 30 mm Stack Height
(Caution: Some automatic
placement/inspection
machines may have
component height restrictions.
Please consult machinery
specifications.)
–020, –040, –060,
–080, –100, –120
= Gold Flash on contact,
Matte Tin on tail
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
–F
–L
= Tape & Reel
(80 positions
maximum)
–TR
No. of positions x (0.80) .0315
+ (5.27) .2075
02
(6.22)
.245
01
(3.81) (7.24)
.150 .285
(0.80) .0315
(3.25)
.128
(1.78)
.070
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on Signal Pins in
contact area, Matte Tin over
50 µ" (1.27 µm) min Ni on all solder tails
*Note:
–C Plating passes 10 year MFG testing
–C*
(7.49)
.295
(0.76)
.030
(0.89)
.035
DIA
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
(3.05)
.120
(0.15)
.006
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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Microcontroller MCU
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