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FZ800R12KS4B2NOSA1

Description
MODULE IGBT A-IHM130-1
CategoryDiscrete semiconductor    The transistor   
File Size381KB,8 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Download Datasheet Parametric Compare View All

FZ800R12KS4B2NOSA1 Overview

MODULE IGBT A-IHM130-1

FZ800R12KS4B2NOSA1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerInfineon
package instructionFLANGE MOUNT, R-XUFM-X7
Reach Compliance Codenot_compliant
ECCN codeEAR99
Factory Lead Time24 weeks
Shell connectionISOLATED
Maximum collector current (IC)1200 A
Collector-emitter maximum voltage1200 V
ConfigurationCOMPLEX
JESD-30 codeR-XUFM-X7
Number of components2
Number of terminals7
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
surface mountNO
Terminal formUNSPECIFIED
Terminal locationUPPER
Maximum time at peak reflow temperatureNOT SPECIFIED
Transistor component materialsSILICON
Nominal off time (toff)660 ns
Nominal on time (ton)225 ns
Base Number Matches1
TechnischeInformation/TechnicalInformation
IGBT-Module
IGBT-modules
FZ800R12KS4_B2
HochleistungsmodulmitAlSiCBodenplatteundschnellemIGBT2fürhochfrequentesSchalten
HighPowerModulewithAlSiCbaseplateandshorttailIGBT2forhighswitchingfrequency
IGBT,Wechselrichter/IGBT,Inverter
HöchstzulässigeWerte/MaximumRatedValues
Kollektor-Emitter-Sperrspannung
Collector-emittervoltage
Kollektor-Dauergleichstrom
ContinuousDCcollectorcurrent
PeriodischerKollektor-Spitzenstrom
Repetitivepeakcollectorcurrent
Gesamt-Verlustleistung
Totalpowerdissipation
Gate-Emitter-Spitzenspannung
Gate-emitterpeakvoltage
T
vj
= 25°C
T
C
= 80°C, T
vj max
= 150°C
T
C
= 25°C, T
vj max
= 150°C
t
P
= 1 ms
T
C
= 25°C, T
vj max
= 150°C

V
CES

1200
800
1200
1600
7,60
+/-20
min.
T
vj
= 25°C
T
vj
= 125°C
V
CE sat
V
GEth
Q
G
R
Gint
C
ies
C
res
I
CES
I
GES
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 25°C
T
vj
= 125°C
t
d on
4,5







typ.
3,20
3,85
5,5
8,40
0,56
52,0
3,40


0,10
0,125
0,09
0,10
0,53
0,59
0,06
0,07
max.
3,70
6,5




5,0
400

V
V
V
µC
nF
nF
mA
nA
µs
µs
µs
µs
µs
µs
µs
µs
mJ
mJ
mJ
mJ

V

A
A
I
C nom

I
C
I
CRM
P
tot
V
GES




A

kW

V
CharakteristischeWerte/CharacteristicValues
Kollektor-Emitter-Sättigungsspannung
Collector-emittersaturationvoltage
Gate-Schwellenspannung
Gatethresholdvoltage
Gateladung
Gatecharge
InternerGatewiderstand
Internalgateresistor
Eingangskapazität
Inputcapacitance
Rückwirkungskapazität
Reversetransfercapacitance
Kollektor-Emitter-Reststrom
Collector-emittercut-offcurrent
Gate-Emitter-Reststrom
Gate-emitterleakagecurrent
Einschaltverzögerungszeit,induktiveLast
Turn-ondelaytime,inductiveload
Anstiegszeit,induktiveLast
Risetime,inductiveload
Abschaltverzögerungszeit,induktiveLast
Turn-offdelaytime,inductiveload
Fallzeit,induktiveLast
Falltime,inductiveload
EinschaltverlustenergieproPuls
Turn-onenergylossperpulse
AbschaltverlustenergieproPuls
Turn-offenergylossperpulse
Kurzschlußverhalten
SCdata
Wärmewiderstand,ChipbisGehäuse
Thermalresistance,junctiontocase
I
C
= 800 A, V
GE
= 15 V
I
C
= 800 A, V
GE
= 15 V
I
C
= 32,0 mA, V
CE
= V
GE
, T
vj
= 25°C
V
GE
= -15 V ... +15 V, V
CE
= 600V
T
vj
= 25°C
f = 1 MHz, T
vj
= 25°C, V
CE
= 25 V, V
GE
= 0 V
f = 1 MHz, T
vj
= 25°C, V
CE
= 25 V, V
GE
= 0 V
V
CE
= 1200 V, V
GE
= 0 V, T
vj
= 25°C
V
CE
= 0 V, V
GE
= 20 V, T
vj
= 25°C
I
C
= 800 A, V
CE
= 600 V
V
GE
= ±15 V
R
Gon
= 1,3
I
C
= 800 A, V
CE
= 600 V
V
GE
= ±15 V
R
Gon
= 1,3
I
C
= 800 A, V
CE
= 600 V
V
GE
= ±15 V
R
Goff
= 1,3
I
C
= 800 A, V
CE
= 600 V
V
GE
= ±15 V
R
Goff
= 1,3
I
C
= 800 A, V
CE
= 600 V, L
S
= 60 nH
V
GE
= ±15 V
R
Gon
= 1,3
I
C
= 800 A, V
CE
= 600 V, L
S
= 60 nH
V
GE
= ±15 V
R
Goff
= 1,3
V
GE
15 V, V
CC
= 900 V
V
CEmax
= V
CES
-L
sCE
·di/dt
proIGBT/perIGBT
t
r


t
d off


t
f


E
on

76,0

E
off
I
SC
R
thJC
R
thCH
T
vj op




-40
58,0


t
P
10 µs, T
vj
= 125°C
6000

13,5

A
16,5 K/kW
K/kW
125
°C
Wärmewiderstand,GehäusebisKühlkörper proIGBT/perIGBT
Thermalresistance,casetoheatsink
λ
Paste
=1W/(m·K)/λ
grease
=1W/(m·K)
TemperaturimSchaltbetrieb
Temperatureunderswitchingconditions

preparedby:WB
approvedby:PL
dateofpublication:2013-11-25
revision:3.2
1

FZ800R12KS4B2NOSA1 Related Products

FZ800R12KS4B2NOSA1 FZ800R12KS4_B2
Description MODULE IGBT A-IHM130-1 Thermal Interface Products Soft PGS - IGBT Mod Infineon
Is it Rohs certified? incompatible incompatible
Maker Infineon Infineon
package instruction FLANGE MOUNT, R-XUFM-X7 MODULE-7
Reach Compliance Code not_compliant unknown
ECCN code EAR99 EAR99
Shell connection ISOLATED ISOLATED
Maximum collector current (IC) 1200 A 1200 A
Collector-emitter maximum voltage 1200 V 1200 V
Configuration COMPLEX COMPLEX
JESD-30 code R-XUFM-X7 R-XUFM-X7
Number of components 2 2
Number of terminals 7 7
Package body material UNSPECIFIED UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR
Package form FLANGE MOUNT FLANGE MOUNT
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
Polarity/channel type N-CHANNEL N-CHANNEL
surface mount NO NO
Terminal form UNSPECIFIED UNSPECIFIED
Terminal location UPPER UPPER
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
Transistor component materials SILICON SILICON
Nominal off time (toff) 660 ns 660 ns
Nominal on time (ton) 225 ns 225 ns
Base Number Matches 1 1
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