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DTO025C22R00JTE3

Description
RES SMD 22 OHM 5% 25W TO252
CategoryPassive components   
File Size185KB,6 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
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RES SMD 22 OHM 5% 25W TO252

DTO025C22R00JTE3 Parametric

Parameter NameAttribute value
resistance22 Ohms
Tolerance±5%
Power (W)25W
componentthick film
characteristicAutomotive grade AEC-Q200, non-inductive
Temperature Coefficient±150ppm/°C
Operating temperature-55°C ~ 150°C
Package/casingTO-252-3, DPak (2 leads + tab), SC-63
Supplier device packagingTO-252,(D-Pak)
size/dimensions0.320" long x 0.110" wide (8.12mm x 2.79mm)
Height - Installation (maximum)0.033"(0.84mm)
Number of terminals3
failure rate-
DTO25
www.vishay.com
Vishay Sfernice
Surface Mounted Power Resistor Thick Film Technology
FEATURES
• AEC-Q200 qualified
• 25 W at 25 °C case temperature
• Surface mounted resistor - TO-252 (DPAK) style
package
• Wide resistance range: 0.016
to 700 k
• Non inductive
• Resistor isolated from metal tab
• Solder reflow secure at 270 °C / 10 s, MSL = 1
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
DESIGN SUPPORT TOOLS
Models
Available
click logo to get started
DIMENSIONS
in millimeters
8.2
0.8 ± 0.1
1
2.8
10°
6.35
Footprint recommendation for
solderable contact area:
7.87
6.82
7.3
12.4
1.4 +0.2 /-0
0.8 ± 0.1
0.6 ± 0.1
1.6 ± 0.1
1.2
5.08
1.8
3.81 1.78
2.54 2.54
1.65
1.65
Tolerance unspecified: ± 0.3
Notes
• For the assembly, we recommend the lead (Pb)-free thermal profile as per J-STD-020C
• Power dissipation is 3.2 W at an ambient temperature of 25 °C when mounted on a double sided copper board using FR4 HTG, 70 μm of
copper, 39 mm x 30 mm x 1.6 mm, with thermal vias
• For other information about dissipation, see the Application Note 52027: “Thermal Management on SMD Thick Film Resistors (D2TO20,
D2TO35, DTO25)”
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
DTO25
SIZE
TO-252 (DPAK)
RESISTANCE
RANGE
0.016 to 700K
RATED POWER LIMITING ELEMENT
TOLERANCE
P
25 °C
VOLTAGE
U
L
±%
W
V
25
500
1, 2, 5, 10
TEMPERATURE
COEFFICIENT
± ppm/°C
150
CRITICAL
RESISTANCE
10K
MECHANICAL SPECIFICATIONS
Mechanical Protection
Resistive Element
Substrate
Connections
Weight
Molded
Thick film
Alumina
Tinned copper, Ni under layer
2 g max.
ELECTRICAL SPECIFICATIONS
Tolerances
From 0.016
to 0.047
:
± 5 % and ± 10 %
> 0.047
to 0.1
:
± 2 % to ± 10 %
0.11
:
± 1 % to ± 10 %
25 W at +25 °C case
temperature R
TH (j - c)
: 5 °C/W
See Special Feature table
± 150 ppm/°C
1500 V
RMS
- 1 min - 15 mA max.
(between terminals and board)
10
4
M
0.1 μH
Power Rating and Thermal
Resistance
Temperature Coefficient
Dielectric Strength
Insulation Resistance
Inductance
ENVIRONMENTAL SPECIFICATIONS
Temperature Range
Climatic Category
Flammability
-55 °C to +150 °C
55 / 150 / 56
IEC 60695-11-5
2 applications 30 s
separated by 60 s
Revision: 28-Sep-2018
Document Number: 51054
1
For technical questions, contact:
sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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