100% pin-to-pin drop-in replacement to quartz-based XO
Excellent total frequency stability as low as ±20 ppm
Operating temperature from -40°C to 85°C. For 125°C and/
or -55°C options, refer to
SiT8919
and
SiT8921
Low power consumption of 4.9 mA typical at 1.8V
Standby mode for longer battery life
Fast startup time of 5 ms
LVCMOS/HCMOS compatible output
Industry-standard packages: 2.0 x 1.6, 2.5 x 2.0, 3.2 x 2.5,
5.0 x 3.2, 7.0 x 5.0 mm x mm
Instant samples with
Time Machine II
and
Field Programmable
Oscillators
RoHS and REACH compliant, Pb-free, Halogen-free and
Antimony-free
For AEC-Q100 oscillators, refer to
SiT8924
and
SiT8925
Ideal for GPON/EPON, network switches, routers,
servers, embedded systems
Ideal for Ethernet, PCI-E, DDR, etc.
Electrical Characteristics
All Min and Max limits are specified over temperature and rated operating voltage with 15 pF output load unless otherwise
stated. Typical values are at 25°C and nominal supply voltage.
Table 1. Electrical Characteristics
Parameters
Output Frequency Range
Frequency Stability
Symbol
f
F_stab
Min.
115
-20
-25
-50
Operating Temperature Range
T_use
-20
-40
Supply Voltage
Vdd
1.62
2.25
2.52
2.7
2.97
2.25
Current Consumption
Idd
–
–
–
OE Disable Current
Standby Current
I_OD
I_std
–
–
–
–
–
Duty Cycle
Rise/Fall Time
DC
Tr, Tf
45
–
–
–
Output High Voltage
Output Low Voltage
VOH
VOL
90%
–
Typ.
–
–
–
–
–
–
1.8
2.5
2.8
3.0
3.3
–
6.2
5.5
4.9
–
–
2.6
1.4
0.6
–
1
1.3
0.8
–
–
Max.
137
+20
+25
+50
+70
+85
1.98
2.75
3.08
3.3
3.63
3.63
7.5
6.4
5.6
4.2
4.0
4.3
2.5
1.3
55
2
2.5
2
–
10%
Unit
MHz
ppm
ppm
ppm
°C
°C
V
V
V
V
V
V
mA
mA
mA
mA
mA
A
A
A
%
ns
ns
ns
Vdd
Vdd
No load condition, f = 125 MHz, Vdd = 2.8V, 3.0V, 3.3V or
2.25 to 3.63V
No load condition, f = 125 MHz, Vdd = 2.5V
No load condition, f = 125 MHz, Vdd = 1.8V
Vdd = 2.5V to 3.3V, OE = GND, Output in high-Z state
Vdd = 1.8V, OE = GND, Output in high-Z state
ST = GND, Vdd = 2.8V to 3.3V, Output is weakly pulled down
̅ ̅̅
ST = GND, Vdd = 2.5V, Output is weakly pulled down
̅ ̅̅
ST = GND, Vdd = 1.8V, Output is weakly pulled down
̅ ̅̅
All Vdds
Vdd = 2.5V, 2.8V, 3.0V or 3.3V, 20% - 80%
Vdd =1.8V, 20% - 80%
Vdd = 2.25V - 3.63V, 20% - 80%
IOH = -4 mA (Vdd = 3.0V or 3.3V)
IOL = 4 mA (Vdd = 3.0V or 3.3V)
Inclusive of Initial tolerance at 25°C, 1
st
year aging at 25°C,
and variations over operating temperature, rated power
supply voltage and load.
Condition
Frequency Range
Frequency Stability and Aging
Operating Temperature Range
Extended Commercial
Industrial
Contact
SiTime
for 1.5V support
Supply Voltage and Current Consumption
LVCMOS Output Characteristics
Rev 1.04
January 30, 2018
www.sitime.com
SiT8009B
High Frequency, Low Power Oscillator
Table 1. Electrical Characteristics (continued)
Parameters
Input High Voltage
Input Low Voltage
Input Pull-up Impedance
Symbol
Min.
Typ.
–
–
87
Max.
–
30%
150
Unit
Pin 1, OE or ST
̅ ̅̅
Pin 1, OE or ST
̅ ̅̅
Pin 1, OE logic high or logic low, or ST logic high
Condition
Input Characteristics
VIH
VIL
Z_in
70%
–
50
2
Startup Time
Enable/Disable Time
Resume Time
RMS Period Jitter
T_start
T_oe
T_resume
T_jitt
–
–
–
–
–
Peak-to-peak Period Jitter
T_pk
–
–
RMS Phase Jitter (random)
T_phj
–
–
Vdd
Vdd
k
–
–
Pin 1, ST logic low
̅ ̅̅
M
Startup and Resume Timing
–
–
–
5
122
5
Jitter
1.9
1.8
12
14
0.5
1.3
3
4
25
30
0.9
2
ps
ps
ps
ps
ps
ps
f = 125 MHz, Vdd = 2.5V, 2.8V, 3.0V or 3.3V
f = 125 MHz, Vdd = 1.8V
f = 125 MHz, Vdd = 2.5V, 2.8V, 3.0V or 3.3V
f = 125 MHz, Vdd = 1.8V
Integration bandwidth = 900 kHz to 7.5 MHz
Integration bandwidth = 12 kHz to 20 MHz
ms
ns
ms
Measured from the time Vdd reaches its rated minimum value
f = 137 MHz. For other frequencies, T_oe = 100 ns + 3 * cycles
Measured from the time ST pin crosses 50% threshold
̅ ̅̅
Table 2. Pin Description
Pin
Symbol
[1]
Functionality
Output Enable
H : specified frequency output
L: output is high impedance. Only output driver is disabled.
H
[1]
: specified frequency output
L: output is low (weak pull down). Device goes to sleep mode. Supply
current reduces to I_std.
Any voltage between 0 and Vdd or Open
[1]
: Specified frequency
output. Pin 1 has no function.
Electrical ground
Oscillator output
Power supply voltage
[2]
OE/ST/NC
Top View
1
OE/ST /NC
̅ ̅̅
Standby
No Connect
2
3
4
GND
OUT
VDD
Power
Output
Power
Figure 1. Pin Assignments
Notes:
1. In OE or ST mode, a pull-up resistor of 10 kΩ or less is recommended if pin 1 is not externally driven. If pin 1 needs to be left floating, use the NC option.
̅ ̅̅
2. A capacitor of value 0.1 µF or higher between Vdd and GND is required.
Rev 1.04
Page 2 of 17
www.sitime.com
SiT8009B
High Frequency, Low Power Oscillator
Table 3. Absolute Maximum Limits
Attempted operation outside the absolute maximum ratings may cause permanent damage to the part.
Actual performance of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings.
Parameter
Storage Temperature
Vdd
Electrostatic Discharge
Soldering Temperature (follow standard Pb free
soldering guidelines)
Junction Temperature
[3]
Min.
-65
-0.5
–
–
–
Max.
150
4
2000
260
150
Unit
°C
V
V
°C
°C
Note:
3. Exceeding this temperature for extended period of time may damage the device.
Table 4. Thermal Consideration
[4]
Package
7050
5032
3225
2520
2016
Note:
4. Refer to JESD51 for
JA
and
JC
definitions, and reference layout used to determine the
JA
and
JC
values in the above table.
JA, 4 Layer Board
(°C/W)
142
97
109
117
152
JA, 2 Layer Board
(°C/W)
273
199
212
222
252
JC, Bottom
(°C/W)
30
24
27
26
36
Table 5. Maximum Operating Junction Temperature
[5]
Max Operating Temperature (ambient)
70°C
85°C
Maximum Operating Junction Temperature
80°C
95°C
Note:
5. Datasheet specifications are not guaranteed if junction temperature exceeds the maximum operating junction temperature.
Table 6. Environmental Compliance
Parameter
Mechanical Shock
Mechanical Vibration
Temperature Cycle
Solderability
Moisture Sensitivity Level
Condition/Test Method
MIL-STD-883F, Method 2002
MIL-STD-883F, Method 2007
JESD22, Method A104
MIL-STD-883F, Method 2003
MSL1 @ 260°C
Rev 1.04
Page 3 of 17
www.sitime.com
SiT8009B
High Frequency, Low Power Oscillator
Test Circuit and Waveform
[6]
Vdd
Vout
Test Point
tr
4
Power
Supply
0.1 uF
1
2
3
15pF
(including probe
and fixture
capacitance)
tf
80% Vdd
50%
20% Vdd
High Pulse
(TH)
Period
Low Pulse
(TL)
Vdd
OE/ST Function
1 kΩ
Figure 2. Test Circuit
Note:
6. Duty Cycle is computed as Duty Cycle = TH/Period.
Figure 3. Waveform
Timing Diagrams
90% Vdd
Vdd
Vdd
50% Vdd
[7]
Pin 4 Voltage
T_start
No Glitch
during start up
ST Voltage
T_resume
CLK Output
HZ
T_start: Time to start from power-off
CLK Output
HZ
T_resume: Time to resume from ST
Figure 4. Startup Timing (OE/ ST̅ Mode)
̅ ̅
Figure 5. Standby Resume Timing ( ST̅ Mode Only)
̅ ̅
Vdd
50% Vdd
OE Voltage
T_oe
Vdd
OE Voltage
50% Vdd
T_oe
CLK Output
HZ
T_oe: Time to re-enable the clock output
CLK Output
HZ
T_oe: Time to put the output in High Z mode
Figure 6. OE Enable Timing (OE Mode Only)
Figure 7. OE Disable Timing (OE Mode Only)
Note:
7. SiT8009 has “no runt” pulses and “no glitch” output during startup or resume.
[i=s]This post was last edited by damiaa on 2015-8-15 21:45[/i] Received the board, set up the environment and ran the demo: 1. Prepare the emulator, introduce who is R7F0C809: RL78G10 variant: Chines...
[i=s] This post was last edited by Tobey on 2016-8-18 05:39 [/i] Recently I need to port an ADC bare-bones program to the RTX operating system, and I encountered the following problem that I cannot so...
After soldering the main components of the Hercules-based industrial "safety" control system, power it on for a test! The board is a good match for the XDS100V2!...
I recently used LPC1768 to do a project, using the RT-THREAD operating system. Since RAM1 is tight, I want to expand RAM2. According to the advice of the experts on the Internet, I checked the RAM2 me...
1 Introduction
The integration of sensor technology and RFID has just started. As one of the world's major manufacturing and consumer countries, China should seize this opportunit...[Details]
This article discusses how to use an ultra-low-power RF transceiver chip from Zarlink Semiconductor for pacemakers, neurostimulators, drug pumps, and other such implantable medical devices t...[Details]
PCI (Perip heral Component Interconnect) is an advanced high-performance 32/64-bit local bus that supports linear burst transmission and has a maximum data transmission rate of 132MB/s. At the same...[Details]
As mobile phones have evolved from simple voice communication tools to multimedia devices that integrate communication, imaging, and gaming, application processors are replacing baseband chips as t...[Details]
Signal sources have developed to a very wide range today. We can classify them according to the frequency range: ultra-low frequency (0.1m~1kHz), audio (20Hz~20kHz), video (20kHz~10MHz), radio fre...[Details]
Multimedia communication terminal equipment has a wide range of application prospects and can be applied to various fields such as video conferencing, videophone, PDA, digital television, etc. Therefo...[Details]
1 Introduction
Intelligent software agents are software programs that can perform specific tasks for users, have a certain degree of intelligence, can autonomously perform some tasks, and ...[Details]
Abstract:
Under high dynamic conditions, combined with GEC's twelve-channel correlator GP2021, this paper discusses the structural design of GPS receivers and the key technologies inv...[Details]
Abstract: In many SCART applications, due to the complex signal switching requirements, dedicated ICs are usually used to implement SCART connections. This will bring cost pressure to single SCART ...[Details]
For mobile phone products, using low-cost components in design is only the first step to make the price competitive. The cost of the production process, especially the cost incurred during the fina...[Details]
Abstract: This paper analyzes the technical characteristics of mobile streaming media and the core technical protocol of mobile streaming media - H.264 protocol, and explains the two major domesti...[Details]
After being widely adopted in applications such as backlighting of portable products with small and medium-sized screens, light-emitting diodes (LEDs) have entered the field of general lighting in ...[Details]
The dual-field-of-view infrared optical system can simultaneously provide two images with different magnifications and fields of view. The large field of view in the system has a lower resolution a...[Details]
In view of the fact that a single ordinary type of fire detection alarm can no longer meet the demand, the use of multiple sensors to comprehensively collect various abnormal information before a f...[Details]
With the popularity of Apple iPhone and Nintendo Wii game consoles, accelerometers have been widely used in consumer electronic devices. For example, drop protection in notebooks, automatic screen ...[Details]