Configuration Memory, 256KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Altera (Intel) |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 8 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Is Samacsys | N |
| Other features | 4 WIRE INTERFACE TO FLEX 8000 DEVICES |
| Maximum clock frequency (fCLK) | 6 MHz |
| JESD-30 code | R-GDIP-T8 |
| JESD-609 code | e0 |
| length | 9.65 mm |
| memory density | 262144 bit |
| Memory IC Type | CONFIGURATION MEMORY |
| memory width | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 256KX1 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | SERIAL |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 5962-9474501MPA | BTA216B-600B | EPC1213PM8 | EPC1213LM20 | EPC1213D59628 | EPC1213DI8 | EPC1213DC8 | EPC1213DM883B8 | |
|---|---|---|---|---|---|---|---|---|
| Description | Configuration Memory, 256KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8 | Triacs high commutation | Configuration Memory, 208KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | Configuration Memory, 208KX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20 | Configuration Memory, 208KX1, Serial, CMOS, CDIP8, CERDIP-8 | Configuration Memory, 208KX1, Serial, CMOS, CDIP8, CERDIP-8 | Configuration Memory, 208KX1, Serial, CMOS, CDIP8, CERDIP-8 | Memory Circuit, 208KX1, CMOS, CDIP8, CERDIP-8 |
| Parts packaging code | DIP | - | DIP | QLCC | DIP | DIP | DIP | DIP |
| package instruction | DIP, | - | DIP, | QCCJ, | DIP, | DIP, | DIP, | DIP, |
| Contacts | 8 | - | 8 | 20 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | - | unknown | unknown | unknown | compliant | compliant | unknown |
| ECCN code | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| Other features | 4 WIRE INTERFACE TO FLEX 8000 DEVICES | - | 4 WIRE INTERFACE TO FLEX 8000 DEVICES | 4 WIRE INTERFACE TO FLEX 8000 DEVICES | 4 WIRE INTERFACE TO FLEX 8000 DEVICES | 4 WIRE INTERFACE TO FLEX 8000 DEVICES | 4 WIRE INTERFACE TO FLEX 8000 DEVICES | 4 WIRE INTERFACE TO FLEX 8000 DEVICES |
| JESD-30 code | R-GDIP-T8 | - | R-PDIP-T8 | S-PQCC-J20 | R-GDIP-T8 | R-GDIP-T8 | R-GDIP-T8 | R-GDIP-T8 |
| length | 9.65 mm | - | 9.398 mm | 8.9662 mm | 9.65 mm | 9.65 mm | 9.65 mm | 9.65 mm |
| memory density | 262144 bit | - | 212992 bit | 212992 bit | 212992 bit | 212992 bit | 212992 bit | 212992 bit |
| Memory IC Type | CONFIGURATION MEMORY | - | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | MEMORY CIRCUIT |
| memory width | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | - | 8 | 20 | 8 | 8 | 8 | 8 |
| word count | 262144 words | - | 212992 words | 212992 words | 212992 words | 212992 words | 212992 words | 212992 words |
| character code | 256000 | - | 208000 | 208000 | 208000 | 208000 | 208000 | 208000 |
| Operating mode | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 125 °C | - | 125 °C | 125 °C | 125 °C | 85 °C | 70 °C | 125 °C |
| Minimum operating temperature | -55 °C | - | -55 °C | -55 °C | -55 °C | -40 °C | - | -55 °C |
| organize | 256KX1 | - | 208KX1 | 208KX1 | 208KX1 | 208KX1 | 208KX1 | 208KX1 |
| Output characteristics | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | - | DIP | QCCJ | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | - | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | - | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | SERIAL | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | - | 4.318 mm | 4.57 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.25 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.75 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | - | NO | YES | NO | NO | NO | NO |
| technology | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | - | MILITARY | MILITARY | MILITARY | INDUSTRIAL | COMMERCIAL | MILITARY |
| Terminal form | THROUGH-HOLE | - | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | - | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | - | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
| width | 7.62 mm | - | 7.62 mm | 8.9662 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 | - |
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