4
PCB Layout Drawing
for Mini Size Module
PIN LEGEND
Mini
Pin
Number
Neutral
EMI
Symbol
Function
Symbol
Function
FARM
Pin Dia.
(Inches / mm)
0.254
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
0.131
0.027
0.050
TYP
0.230
0.027
0.115
7 x Ø 0.233
FREE OF SOLDER MASK
0.102
Ø 0.016 NON PLATED THRU
7 PL
0.328
0.265
0.050
TYP
2.096
53,24
SEE DETAIL A
PCB
SURFMATE INPUT
CONNECTOR
0.250
6,36
0.063
1,59
0.536
13,61
4
MODULE
6 x ø0.064
±
0.003
1,63
±0,08
(#52 DRILL)
5
6
7
8
9
1.900
48,26
1.600
40,64
3
2
1
0.56
MAX
0.138
0.467
0.266
0.313
0.340
1
2
3
4
5
6
7
8
9
Line
– Out
Enable
Strap
BUS OK
+ OUT
+
PC
PR
–
–
–S
SC
+S
+
+IN
N
Prim. Control EMI GRD
Parallel
NC
–IN
L
–OUT
–
– Sense
EN
Sec. Control
ST
+Sense
BOK
+Out
+
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.150 / 3,81
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.150 / 3,81
38°
w
0.440
11,18
PCB
0.06
1,6
4 x ø 0.130
±
0.003
3,30
±
0,08
PLATED THRU HOLE
FOR STANDOFF MTG
MODULE
EXCHANGE
TOOL-
BOTH ENDS
(PARTIAL)
0.063
1,59
0.300
7,62
0.536
13,61
0.097
2,47
0.251
6,36
2 x 0.125
±
0.002
3,18
±
0,05
0.400
10,16
0.700
17,78
SEE DETAIL B
1.000
25,4
0.250
6,35
3
1
2
0.15
3,8
0.38
9,5
0.80
±
0.03
20,3
±
0,8
1.400
35,56
1.900
±
0.002
48,26
±
0,05
w
PCB MOUNTING SPECIFICATIONS
(ALSO SEE EXCHANGE TOOL DETAILS IN RIGHT VIEWS)
0.027
0.065
2.000
50,8
0.300
7,62
0.027
Ø 0.032
±
0.003
16 VIA HOLES
0.027
0.069
Ø 0.032
±
0.003
3 VIA HOLES
w
.
DETAIL A
v
(MIRROR IMAGE TO OTHER SIDE)
ALL DIMENSIONS IN INCHES
4
3
2
1
i
0.265
6,73
2.430
61,72
5
1.98
50,3
6 7 8
9
c
Ø 0.032
±
0.003
29 VIA HOLES
0.027
r
0.226
0.230
TYP
Ø 0.032
±
0.003
3 VIA HOLES
.
0.034
0.115
0.065
0.027
0.065
c
55°
0.152
0.80
20,3
0.202
0.069
o
7 x Ø 0.016
0.604
0.350
0.491
12,47
m
0.340
0.266
EXCHANGE TOOL
HOOK AREA, 4 PLCS
(BOTH ENDS-SEE VIEWS)
MODULE
EXCHANGE
TOOL
MODULE
BASEPLATE
PCB
15°
1.25
31,6
SURFMATE OUTPUT
CONNECTOR
0.277
0.050
TYP
0.027
0.050
TYP
0.034
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
0.159
0.318
2 x Ø 0.316
FREE OF SOLDER MASK
DETAIL B
0.006
REF
0,15
(MIRROR IMAGE TO OTHER SIDE)
ALL DIMENSIONS IN INCHES
BOTTOM OF
CAP TO TOP
OF PCB
DETAIL C
All dimensions are
Inch
or
Inch / Metric
ANSI / IPC-D-300 specifications apply for Class “B” boards.
Recommended PCB construction:
Multilayer 3oz Cu with internal power and ground planes. Pad geometry and minimum number
of via holes for connection to power and ground planes shown in Details “A” & “B” for high
current applications. Pads to be covered with solder mask except in circular area shown in
Detail “A” & “B”. Final pad height above laminate to be 0.004" +/- 0.0004".
Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad).
PRODUCT APPLICATION SPECIFICATIONS
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