588-3/4-3 datasheet, PDF - EEWORLD Datasheet

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588-3/4-3: Description3M THERMAL BONDING FILM 588-; Categoryaccessories; File Size73KB，8 Pages; Manufacturer3M; Websitehttp://3M.com/esd

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588-3/4-3 Overview

3M THERMAL BONDING FILM 588-

588-3/4-3 Parametric

Parameter Name	Attribute value
type	adhesive film
characteristic	Thermal or solvent activation
Supporting products/related products	Multipurpose
delivery information	-

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Technical Data

March 2015

™

Thermal Bonding Film 588

Product Description

3M™ Thermal Bonding Film 588 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can

be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.

3M TBF 588 must be stored at or below 4°C (40°F) for maximum storage life.

Key Features

• Flexible

• Heat or solvent activation

• Heat crosslinkable option

• Can be die-cut

Typical Physical Properties

Note:

The following technical information and data should be considered representative or typical only and should not

be used for specification purposes.

Product

Base Resin

Adhesive Thickness

Tack

Color

Construction

3M™ Thermal Bonding Film 588

Nitrile phenolic

6 mil (0.15 mm)

None

Yellow

6 mil adhesive

5 mil polyolefin liner

Before Crosslinking

Tensile (psi)

Elongation (%)

Modulus (psi)

2 Lb. Dead Load Overlap Shear Heat Resistance

• Tensile and elongation conducted on Sintech 5/GL at 0.2"/minute speed. ASTM D638.

• 2 lb. dead load overlap shear conducted in oven environment (reference ASTM D4502-85).

After Crosslinking

2,700

21,800

>149°C (300°F)

2,300

250

6,700

85°C (180°F)

™

Thermal Bonding Film 588

Application Equipment Suggestions

Note:

Appropriate application equipment can enhance bonding film performance. We suggest the following equipment

for the user’s evaluation in light of the user’s particular purpose and method of application.

The type of application equipment used to bond 3M™ Thermal Bonding Film 588 will depend on the application involved

and on the type of equipment available to the user. Thin films and flexible substrates can be bonded using a heated roll

laminator where heat and pressure can be varied to suit the application. Larger, thicker substrates can be bonded using

a heated static press or, in some cases, an autoclave. For applications where a shaped adhesive is to be transferred to

a flat or three-dimensional part, a hot shoe or thermode method may be appropriate.

It is recommended that whatever method of bonding is chosen by the user, the optimum bonding conditions

should be predetermined with substrates specific to user’s application.

Directions For Use – Heat Activation

To make a bond using 3M TBF 588, remove the liner and place the adhesive film between the two substrates. The bond

is then made through heat and pressure using a heated press, a hot roll laminator, a hot shoe thermode method or

similar equipment.

Alternatively, the adhesive can be first tacked (lightly bonded) to one of the substrates using low heat, the liner can then

be removed and second substrate placed to the exposed adhesive surface, and a bond made using heat and pressure.

Suggested TACKING Conditions

38°C to 49°C (100°F to 120°F) bondline temperature

2-5 seconds dwell time

5-20 psi pressure

For optimum bonding, the heat, pressure and dwell time for using 3M TBF 588 will depend upon the type and thickness

of the substrates being bonded together.

A suggested starting point, however, is to use the bonding conditions described below.

Suggested BEGINNING Bonding Conditions

107°C to 149°C (225°F to 300°F) bondline temperature

2-5 seconds dwell time

15-20 psi pressure

(2)

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