BCM
®
in a VIA™ Package
Bus Converter
BCM3814x60E10A5yzz
®
S
C
US
C
NRTL
US
Isolated Fixed-Ratio DC-DC Converter
Features & Benefits
•
Up to 150A continuous low-voltage-side current
•
Fixed transformation ratio (K) of 1/6
•
Up to
769W/in
3
power density
•
97.2% peak efficiency
•
Integrated ceramic capacitance filtering
•
Parallel operation for multi-kW arrays
•
OV, OC, UV, short circuit and thermal protection
•
3814 package
•
High MTBF
•
Thermally enhanced VIA package
•
PMBus
TM
management interface
V
HI
= 54V (36 – 60V)
V
LO
= 9V (6 – 10V)
(
no load
)
Product Ratings
I
LO
= up to 150A
K = 1/6
Product Description
The BCM3814x60E10A5yzz in a VIA package is a high-efficiency
Bus Converter, operating from a 36 to 60V
DC
high-voltage bus to
deliver an isolated 6 to 10V
DC
unregulated, low voltage.
This unique ultra-low-profile module incorporates DC-DC
conversion, integrated filtering and PMBus™ commands and
controls in a chassis- or PCB-mount form factor.
The BCM offers low noise, fast transient response and industry
leading efficiency and power density. A low-voltage-side
referenced PMBus-compatible telemetry and control interface
provides access to the BCM’s configuration, fault monitoring and
other telemetry functions.
Leveraging the thermal and density benefits of Vicor VIA packaging
technology, the BCM module offers flexible thermal management
options with very low top- and bottom-side thermal impedances.
When combined with downstream Vicor DC-DC conversion
components and regulators, the BCM allows the Power Design
Engineer to employ a simple, low-profile design, which will
differentiate the end system without compromising on cost or
performance metrics.
Typical Applications
•
DC Power Distribution
•
Information and Communication
Technology (ICT) Equipment
•
High-End Computing Systems
•
Automated Test Equipment
•
Industrial Systems
•
High-Density Energy Systems
•
Transportation
Size:
3.76 x 1.40 x 0.37in
[95.59 x 35.54 x 9.40mm]
Part Ordering Information
Product
Function
BCM
BCM =
Bus Converter
Module
[a]
Package
Length
38
Length in
Inches x 10
Package
Width
14
Width in
Inches x 10
Package
Type
x
B
= Board VIA
V
= Chassis VIA
High‑Side
Max
Max
Max
Voltage
Product Grade
High‑Side
Low‑Side Low‑Side
Range
(Case Temperature)
Voltage
Voltage Current
Ratio
60
E
10
A5
y
C
= –20 to 100°C
[a]
T
= –40 to 100°C
[a]
Option Field
zz
02
= Chassis/PMBus
06
= Short Pin/PMBus
10
= Long Pin/PMBus
Internal Reference
High-temperature current derating may apply; See Figure 1, specified thermal operating area.
BCM
®
in a VIA™ Package
Page 1 of 41
Rev 2.0
09/2018
BCM3814x60E10A5yzz
Pin Configuration
1
+HI
10
–LO
TOP VIEW
12
–LO
3
+LO
5
6
7
8
9
+LO
4
EXT BIAS
SCL
SDA
SGND
ADDR
PMBus™
–HI
2
–LO
11
–LO
13
BCM3814 in a VIA Package - Chassis (Lug) Mount
11
–LO
TOP VIEW
13
–LO
4
+LO
9
8
7
6
5
+LO
3
ADDR
SGND
SDA
SCL
EXT BIAS
2
–HI
PMBus™
+HI
1
–LO
10
–LO
12
BCM3814 in a VIA Package - Board (PCB) Mount
Note:
The dot on the VIA housing indicates the location of the signal pin 9.
Pin Descriptions
Pin Number
1
2
3, 4
5
6
7
8
9
10, 11, 12, 13
Signal Name
+HI
–HI
+LO
EXT BIAS
SCL
SDA
SGND
ADDR
–LO
Type
HIGH SIDE POWER
HIGH SIDE POWER
RETURN
LOW SIDE
POWER
INPUT
INPUT
INPUT/OUTPUT
LOW SIDE
SIGNAL RETURN
INPUT
LOW SIDE
POWER RETURN
Function
High-voltage-side positive power terminal
High-voltage-side negative power terminal
Low voltage side positive power terminal
5V supply input
I
2
C™ Clock, PMBus™ Compatible
I
2
C Data, PMBus Compatible
Signal Ground
Address assignment – Resistor based
Low voltage side negative power terminal
Notes:
All signal pins (5, 6, 7, 8, 9) are referenced to the low-voltage side and isolated from the high-voltage side.
Keep SGND signal separated from the low-voltage-side power return terminal (–LO) in electrical design.
BCM
®
in a VIA™ Package
Page 4 of 41
Rev 2.0
09/2018
BCM3814x60E10A5yzz
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter
+HI to –HI
HI_DC or LO_DC Slew Rate
+LO to –LO
EXT BIAS to SGND
SCL to SGND
SDA to SGND
ADDR to SGND
Basic insulation (high-voltage side to case)
Isolation Voltage /
Dielectric Withstand
[b]
Comments
Min
–1
Max
80
1
Unit
V
V/µs
V
V
A
V
V
V
V
DC
V
DC
V
DC
–1
–0.3
15
10
0.15
–0.3
–0.3
–0.3
1500
1500
N/A
5.5
5.5
3.6
Basic insulation (high-voltage side to low-voltage side)
[b]
Functional insulation (low-voltage side to case)
The absolute maximum rating listed above for the dielectric withstand (high-voltage side to the low-voltage side) refers to the VIA package. The internal
safety approved isolating component (ChiP™) provides basic insulation (2250V) from the high-voltage side to the low-voltage side. However, the VIA
package itself can only be tested at a basic insulation value (1500V).
BCM
®
in a VIA™ Package
Page 5 of 41
Rev 2.0
09/2018
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