Multilayer Ceramic Capacitors
Multilayer Ceramic Capacitors
Series:
ECJ, ECY, ECD
Handling Precautions
Safety Precautions
Multilayer Ceramic Chip Capacitors (hereafter referred to as “Capacitors”) should be used for general purpose
applications found in consumer electronics (audio/visual, home, office, information & communication) equipment.
When subjected to severe electrical, environmental, and/or mechanical stress beyond the specifications, as noted
in the Ratings and Specified Conditions section, the capacitor may fail in a short circuit mode or in an open-circuit
mode. This case results in a burn-out, smoke or flaming.
For products which require high safety levels, please carefully consider how a single malfunction can affect your
product. In order to ensure the safety in the case of a single malfunction, please design products with fail-safe,
such as setting up protecting circuits, etc.
●
For the following applications and conditions, please contact us for additional specifications not found in this document.
· When your application may have difficulty complying with the safety or handling precautions specified below.
· For any applications where a malfunction with this product may directly or indirectly cause hazardous
conditions which could result in death or injury;
1
2
3
4
5
6
7
8
9
J
Aircraft and Aerospace Equipment (artificial satellite, rocket, etc.)
Submarine Equipment (submarine repeating equipment, etc.)
Transportation Equipment (motor vehicles, airplanes, trains, ship, traffic signal controllers, etc.)
Power Generation Control Equipment (atomic power, hydroelectric power, thermal power plant control system, etc.)
Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.)
Information Processing Equipment (large scale computer systems, etc.)
Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.)
Rotary Motion Equipment
Security Systems
And any similar types of equipment
■
Operating Conditions and Circuit Design
1. Circuit Design
1.1 Operating Temperature and Storage Temperature
The specifi ed “Operating Temperature Range” found
in the specifi cations is the absolute maximum and
minimum temperature rating. Every Capacitor shall be
operated within the specified “Operating Temperature
Range”.
The capacitors mounted on PCB shall be stored
without operating within the specified “ Storage
Temperature Range” in the Specifications.
1.4 Temperature Rise due to Dielectric Loss of
the Capacitors
The “Operating Temperature Range” mentioned above
shall include a maximum surface temperature rise of
20 °C, which is caused by the Dielectric loss of the
Capacitor and applied electrical stresses such as
voltage, frequency and wave form. It is recommended
to measure and check the “Surface Temperature of the
Capacitor” in the application at room temperature (up
to 25 °C).
1.2 Design of Voltage Application
Capacitors shall not be operated in excess of the
specified “Rated Voltage” in the Specification.
If voltage ratings are exceeded, the Capacitors could
result in failure or damage. The designed peak DC and
AC voltages applied to the Capacitors, shall be within
the specified “Rated Voltage”.
In case of AC of pulse voltage, the peak voltage shall
be within the specified “Rated Voltage”. If high frequency
voltage or fast rising pulse voltages are continuously
applied, even when within the “Rated Voltage”, consider
that the reliability of the Capacitor may change. Continuous
application of those types of voltages can affects the life of
the Capacitors.
1.5 Environmental Restrictions
The Capacitors shall not be operated and/or stored
under the following conditions.
(1) Environmental conditions
(a) Under direct exposure to water or salt water
(b) Under conditions where water can condense
and/or dew can form
(c) Under conditions containing corrosive gases
such as hydrogen sulfide, sulfurous acid, chlorine
and ammonia
(2) Mechanical conditions
Under severe conditions of vibration or impact beyond
the specified conditions found in the Specifications
1.3 Charging and Discharging Current
The Capacitors shall not be operated beyond the specified
“Maximum Charging/Discharging Current Ratings” in
the specifications. For safety reasons Panasonic does
not recommend use in applications with low impedance
circuitry such as “secondary power circuits”.
1.6 DC Voltage Characteristics
The Capacitors (Class 2) employ dielectric ceramics with
dielectric constant having voltage dependency, and if
the applied DC voltage is high, capacitance may broadly
change. For the specifi ed capacitance, the following
should be confirmed.
00 Sep. 2008
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EC48 –
Multilayer Ceramic Capacitors
(1) If capacitance change caused by the applied voltage
is within the allowable range, or if its application allows
unlimited capacitance change.
(2) DC voltage characteristics demonstrate that even
if the applied voltage is under the rated voltage,
the capacitance change rate increases with higher
voltage (Capacitance down). Accordingly, when the
Capacitors are used for circuits with a narrow allowable
capacitance range such as time constant circuits, we
recommend applying a lower voltage after taking
capacitance aging and the above into account.
Capacitance change - DC voltage
oC/C
(%)
0
of the Capacitors may be effective in getting the
resonance under control with other equipment such as
printed circuit boards. Attaching the Capacitors to
the printed circuit board by an adhesive may also
be effective.
2. Design of Printed Circuit Board
2.1 Selection of Printed Circuit Board
When the Capacitors are mounted and soldered on
an “Alumina Substrate”, the substrate infl uences the
Capacitors’ reliability against “Temperature Cycles”
and “Heat shock” due to the difference in the thermal
expansion coefficient between them. Confirm that the
actual board used does not deteriorate the characteristics
of the Capacitors.
2.2 Design of Land Pattern
(1) Recommended land dimensions are shown below.
Use the proper amount of solder in order to prevent
cracking. Using too much solder places excessive
stress on the Capacitors.
0
DC voltage (V)
Recommended land dimensions (Ex.)
1.7 Capacitance Aging
The ceramic dielectrics of the Capacitors (Class 2) have
capacitance aging. Accordingly, when the Capacitors
are used for circuits which require a narrow allowable
capacitance range, such as time constant circuits, pay
special attention to capacitance aging before use.
Under Ordinary Temperature
oC/C
(%)
0
<
High Capacitance, For General Electronic
Equipment, Low ProfileType, Wide-width Type,
100V·200V series, 630V series, High-Q capacitors
LAND
SMD
LAND
>
Before and After Heat treatment
oC/C
(%)
0
b
a
c
Solder resist
b
a
Unit (mm)
Component Dimensions
log T
Time (h)
Heat Treatment
Time (h)
log T
Size
L
0201
0.6
1.0
1.0
1.6
2.0
3.2
3.2
1.25
1.6
0402
0402
½1
a
W
0.3
0.5
0.5
0.8
1.6
2.5
2.0
3.2
T
0.3
0.5
0.5
b
c
c
0.2 to 0.3 0.25 to 0.3 0.2 to 0.3
0.4 to 0.5 0.4 to 0.5 0.4 to 0.5
0.5 to 0.6 0.4 to 0.5 0.5 to 0.6
1.8 Piezoelectricity
Dielectrics used for the Capacitors (Class 2) may
cause the following Piezoelectricity (or Electrostriction).
(1) If the signal of a specific frequency is applied to
the Capacitors, electric and acoustic noise may be
generated by resonating the characteristic frequen-
cy, which is determined by the dimensions of the
Capacitor.
As a measure to prevent this phenomenon, changing
the size of the Capacitor is effective in changing its
resonance frequency.
In addition, changing the materials of the Capacitors
to the Low - loss type, which has no (or less)
piezoelectricity, or to use Class 1 dielectrics which
have no (or less) piezoelectricity.
(2) Vibration or impact applied to the Capacitors may
cause noise because mechanical force is converted
to electrical signals (Especially to circuitry around
an amplifier unit).
As a measure to prevent this phenomenon, changing
the materials of the Capacitor to the Low-loss type,
which has no (or less) piezoelectricity, or to Class1 is
also available.
(3) If a “whining sound” is generated it does not
indicate a problem with product performance
and reliability, however, check if this undesirable
phenomenon generates noise in your application.
To prevent this phenomenon, changing the Capacitor’s
characteristics, such as size and shape, as
shown in (1) & (2) above can be effective.
In addition, changing the mounting direction
0603
0805
1206
1210
0508
0612
0.45 to 0.8 0.8 to 1.0 0.6 to 0.8 0.6 to 0.8
0.6 to 1.6 1.8 to 2.2 1.0 to 1.2 1.0 to 1.3
0.85 to 2.5 1.8 to 2.2 1.0 to 1.2 1.8 to 2.3
0.85
0.85
0.5 to 0.7 0.5 to 0.6 1.4 to 1.9
0.8 to 1.0 0.6 to 0.7 2.5 to 3.0
1.25 0.6 to 1.25 0.8 to 1.2 0.8 to 1.0 0.8 to 1.0
½1
The following value is applied as a dimensional tolerance :
+0.15/-0.05 mm (L, W and T).
<2Array type, 4 Array type>
c
SMD
c
a
b
P
LAND
P/2
P
Unit (mm)
Component
Dimensions
a
b
c
P
L
W
T
0.6 0.3 to 0.4 0.45 to 0.55 0.3 to 0.4 0.54 to 0.74
0504
2 Array 1.37 1.0 0.8 0.3 to 0.6 0.4 to 0.7 0.46 to 0.56 0.71 to 0.91
Size
0805
4 Array 2.0 1.25 0.85 0.55 to 0.75 0.5 to 0.6 0.2 to 0.3 0.4 to 0.6
1206
4 Array 3.2
1.6 0.85 0.9 to 1.1 0.7 to 0.9 0.35 to 0.45 0.7 to 0.9
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Sep. 2008
– EC49 –
b
a
Multilayer Ceramic Capacitors
(2) The size of lands shall be designed to have equal
spacing between the right and left sides. If the
amount of solder on the right land is different from that
on the left land, the component may be cracked by
stress since the side with a larger amount of solder
solidifies later during cooling.
E
D
Perforation
C
Recommended Amount of Solder
(a) Excessive amount (b) Proper amount
(c) Insufficient amount
A
Slit
Magnitude of stress A>B=C>D>E
B
2.3 Applications of Solder Resist
(1) Solder resist shall be utilized to equalize the amounts
of solder on both sides.
(2) Solder resist shall be used to divide the pattern for the
following cases;
· Components are arranged closely.
· The Capacitor is mounted near a component with
lead wires.
· The Capacitor is placed near a chassis.
See the table below.
(3) The magnitude of mechanical stress applied to the
Capacitors when the circuit board is divided is in the
order of push back < slit < V-groove < perforation.
Also take into account the layout of the Capacitors
and the dividing/breaking method.
2.5 Mounting Density and Spaces
If components are arranged in too narrow a space, the
components can be affected by solder bridges and
solder balls. The space between components should
be carefully determined.
Prohibited Applications and Recommended Applications
Item
Prohibited
applications
The lead wire of a component
with lead wires
Mixed mounting
with a component
with lead wires
Chassis
Solder
(Ground solder)
Electrode pattern
A lead wire of
Retro-fitted component
Soldering iron
Improved applications
by pattern division
Solder resist
■
Precautions for Assembly
1. Storage
(1) The Capacitors shall be stored between 5 - 40 °C
and 20 - 70 % RH, not under severe conditions of
high temperature and humidity.
(2) If stored in a place that is humid, dusty, or contains
corrosive gasses (hydrogen sulfide, sulfurous acid,
hydrogen chloride and ammonia, etc.), the solderability
of the terminal electrodes may deteriorate.
In addition, storage in a place subjected to heating
and/or exposure to direct sunlight will causes
deformed tapes and reels, and component sticking to
tapes, both of which can result in mounting problems.
(3) Do not store components longer than 6 months.
Check the solderability of products that have been
stored for more than 6 months before use.
(4) High dielectric constant capacitors (Class 2, characteristic
B, X7R, X5R and F, Y5V) change in capacitance
with the passage of time, (Capacitance aging), due
to the inherent characteristics of ceramic dielectric
materials.
The capacitance change can be reversed to the initial
value at the time of shipping by heat treatment (See
1. Circuit Design, 1-7. Capacitance aging)
(5) When the initial capacitance is measured, the
Capacitors shall be heat-treated at 150 +0/-10
°C for 1 hour and then subjected to ordinary
temperature and humidity for 48±4 hours before
measuring the initial values.
Arrangement
near chassis
Solder resist
Retro-fitting of
component with
lead wires
Solder resist
Lateral
arrangement
Land
Portion to be
excessively soldered
Solder resist
2.4 Component Layout
The Capacitors/components shall be placed on the PC
board so as to have both electrodes subjected to uniform
stresses, or to position the component electrodes at right
angles to the grid glove or bending line. This should be
done to avoid cracking the Capacitors from bending of
the PC board after or during placing/mounting on the PC
board.
(1) To minimize mechanical stress caused by warp or
bending of a PC board, please follow the recommended
Capacitors’ layout below.
Prohibited layout
Recommended layout
2. Adhesives for Mounting
(1) The amount and viscosity of an adhesive for mounting
shall be such that the adhesive shall not flow off on
the land during its curing.
(2) If the amount of adhesive is insufficient for mounting,
the Capacitor may fall off after or during soldering.
(3) If the adhesive is too low in its viscosity, the Capacitors
may be out of alignment after or during soldering.
(4) Adhesives for mounting can be cured by ultraviolet
or infrared radiation. In order to prevent the terminal
electrodes of the Capacitors from oxidizing, curing
shall be done under the following conditions: 160 °C
max., for 2 minutes max.
Layout the Capacitor sideways
against the stressing direction
(2) The following drawing is for reference since
m e cha nic a l stress near the dividing/breaking
position of a PC board varies depending on the
mounting position of the Capacitors.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Sep. 2008
– EC50 –
Multilayer Ceramic Capacitors
(5) Insufficient curing may cause the Capacitor to fall
off after or during soldering. In addition, insulation
resistance between terminal electrodes may deteriorate
due to moisture absorption. In order to prevent these
problems, please observe proper curing conditions.
5. Soldering
5.1 Flow Soldering
For fl ow soldering, abnormal and large thermal and
mechanical stress, caused by the “Temperature Gradient”
between the mounted Capacitors and melted solder in a
soldering bath may be applied directly to the Capacitors,
resulting in failure and damage of the Capacitors.
Therefore it is essential that soldering process follow
these recommended conditions.
(1) Application of Soldering flux:
The soldering flux shall be applied to the mounted
Capacitors thinly and uniformly by foaming method.
(2) Preheating:
The mounted Capacitors/ Components shall be
pre-heated suffi ciently so that the “Temperature
Gradient” between the Capacitors/Components
and the melted solder shall be 150 °C max. (100
to 130 °C)
(3) Immersion into Soldering Bath:
The Capacitors shall be immersed into a soldering
bath of 240 to 260 °C for 3 to 5 seconds.
(4) Gradual Cooling:
The Capacitors shall be cooled gradually to room
ambient temperature at cooling temperature rates of
8 °C/s max. from 250 °C to 170 °C and 4 °C/s max.
from 170 °C to 130 °C.
(5) Flux Cleaning:
When the Capacitors are immersed into a cleaning
solvent, be sure that the surface temperatures of
the devices do not exceed 100 °C.
(6) Performing flow soldering once under the conditions
shown in the figure below [Recommended profile of
Flow soldering (Ex)] will not cause any problems.
However, pay attention to the possible warp and
bending of the PC board.
3. Chip Mounting Consideration
(1) When mounting the Capacitors/components on a
PC board, the Capacitor bodies shall be free from
excessive impact loads such as mechanical impact
or stress due to the positioning, pushing force and
displacement of vacuum nozzles during mounting.
(2) Maintenance and inspection of the Chip Mounter
must be performed regularly.
(3) If the bottom dead center of the vacuum nozzle
is too low, the Capacitor will crack from excessive
force during mounting.
The following precautions and recommendations are
for your reference.
(a) Set and adjust the bottom dead center of the
vacuum nozzles to the upper surface of the PC
board after correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle
during mounting to 1 to 3 N in static load.
(c) For double surface mounting, apply a supporting
pin on the rear surface of the PC board to suppress
the bending of the PC board in order to minimize
the impact of the vacuum nozzles. Typical examples
are shown in the table below.
Item
Prohibited mounting
Recommended
mounting
The supporting pin does not necessarily
have to be positioned beneath the Capacitor.
Single surface
mouting
Crack
Supporting pin
Recommended profile for Flow soldering [Ex.]
260
240
Temperature(˚C)
oT
Soldering
Gradual cooling
(at ordinary temperature)
Double surface
mounting
Separation of Solder Crack
Supporting pin
(d) Adjust the vacuum nozzles so that their bottom
dead center during mounting is not too low.
(4) The closing dimensions of the positioning chucks
shall be controlled. Maintenance and replacement
of positioning chucks shall be performed regularly
to prevent chipping or cracking of the Capacitors
caused by mechanical impact during positioning
due to worn positioning chucks.
(5) Maximum stroke of the nozzle shall be adjusted
so that the maximum bending of PC board does
not exceed 0.5 mm at 90 mm span. The PC board
shall be supported by an adequate number of
supporting pins.
0
60 to 120 s
3 to 5 s
Time
<Allowable temperature difference
oT>
Size
Temp. Tol
0603 to 1206, 0508, 0612
oT
<
150 °C
For products specified in individual specifications, avoid
flow soldering.
5.2 Reflow Soldering
The reflow soldering temperature conditions are each
temperature curves of Preheating, Temp. rise, Heating,
Peak and Gradual cooling. Large temperature difference
caused by rapid heat application to the Capacitors may
lead to excessive thermal stresses, contributing to the
thermal cracks. The Preheating temperature requires
controlling with great care so that tombstone phenomenon
may be prevented.
4. Selection of Soldering Flux
Soldering flux may seriously affect the performance of the
Capacitors. The following shall be confirmed before use.
(1) The soldering fl ux should have a halogen based
content of 0.1 wt. % (converted to chlorine) or below.
Do not use soldering flux with strong acid.
(2) When applying water-soluble soldering fl ux, wash
the Capacitors sufficiently because the soldering flux
residue on the surface of PC boards may deteriorate
the insulation resistance on the Capacitors surface.
Item
1
Preheating
Temperature
Period or Speed
140 to 180 °C
60 to 120 sec
Preheating temp to
2 to 5 °C/sec
2
Temp. rise
Peak temp.
220 °C min.
60 sec max.
3
Heating
260 °C max.
10 sec max.
4
Peak
1 to 4 °C/sec
5
Gradual cooling Peak temp. to 140 °C
00 Sep. 2008
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EC51 –
Multilayer Ceramic Capacitors
Recommended profile of Reflow soldering [Ex.]
260
Temperature (°C)
220
180
140
T
2 Temp. rise
5 Gradual
cooling
4 Peak
(2) Condition 2 (without preheating)
Hand soldering can be performed without preheating,
by following the conditions below:
(a) Soldering iron tip shall never directly touch
the ceramic and terminal electrodes of the
Capacitors.
(b) The lands are suffi ciently preheated with a
soldering iron tip before sliding the soldering
iron tip to the terminal electrodes of the
Capacitor for soldering.
1 Preheating
3 Heating
Time
60 to 120 sec
60 sec max.
<Allowable temperature difference
oT>
Size
Temp. Tol
0201 to 1206, 0508, 0612, 0504
oT
<
150 °C
1210
oT
<
130 °C
The rapid cooling (forced cooling) during Gradual
cooling part should be avoided, because this may
cause defects such as the thermal cracks, etc.
When the Capacitors are immersed into a cleaning
solvent, confi rm that the surface temperatures of the
devices do not exceed 100 °C.
Performing reflow soldering twice under the conditions
shown in the figure above [Recommended profi le of
Refl ow soldering (EX)] will not cause any problems.
However, pay attention to the possible warp and
bending of the PC board.
<Conditions of Hand soldering without preheating>
Item
Condition
0201 to 0805, 0508, 0504 1206, 1210, 0612
Size
Temperature of Iron tip
270 °C max.
250 °C max.
Wattage
20 W max.
Shape of Iron tip
φ3
mm max.
Soldering time with a
3 sec max.
soldering iron
6. Post Soldering Cleaning
6.1 Cleaning Solvent
S o ldering flu x residue may re main o n the P C
board if cleaned with an inappropriate solvent. This
may deteriorate the electrical characteristics and
reliability of the Capacitors.
6.2 Cleaning Conditions
Insufficient cleaning or excessive cleaning may impair the
electrical characteristics and reliability of the Capacitors.
(1) Insufficient cleaning can lead to:
(a) The halogen substance found in the residue of
soldering flux may cause the metal of terminal
electrodes to corrode.
(b) The halogen substance found in the residue of
soldering flux on the surface of the Capacitors
may change resistance values.
(c) Water-soluble soldering fl ux may have more
remarkable tendencies of (a) and (b) above
compared to those of rosin soldering fl ux.
(2) Excessive cleaning can lead to:
(a) Overuse of ultrasonic cleaning may deteriorate
the strength of the terminal electrodes or cause
cracking in the solder and /or ceramic bod-
ies of the Capacitors due to vibration of the PC
boards.
Please follow these conditions for Ultrasonic cleaning:
Ultrasonic wave output
: 20 W/L max.
Ultrasonic wave frequency
: 40 kHz max.
Ultrasonic wave cleaning time : 5 min max.
5.3 Hand Soldering
Hand soldering typically causes significant temperature
change, which may induce excessive thermal stresses
inside the Capacitors, resulting in the thermal cracks, etc.
In order to prevent any defects, the following should be
observed.
· The temperature of the soldering tips should be
controlled with special care.
· The direct contact of soldering tips with the Capacitors
and/or terminal electrodes should be avoided.
· Dismounted Capacitors shall not be reused.
(1) Condition 1 (with preheating)
(a) Soldering:
φ1.0
mm or below Thread eutectic solder with
soldering flux
½
in the core.
½
Rosin-based and non-activated flux is recommended.
(b) Preheating:
The Capacitors shall be preheated so that the
“Temperature Gradient” between the devices and
the tip of soldering iron is 150 °C or below.
(c) Temperature of Iron tip: 300 °C max.
(The required amount of solder shall be melted in
advance on the soldering tip.)
(d) Gradual Cooling:
After soldering, the Capacitors shall be cooled
gradually at room temperature.
6.3 Contamination of Cleaning Solvent
Cleaning with contaminated cleaning solvent may
cause the same results as insufficient cleaning due to
the high density of liberated halogen.
Recommended profile of Hand Soldering [Ex.]
Gradual cooling
oT
7. Inspection Process
When mounted PC boards are inspected with measur-
ing terminal pins, abnormal and excess mechanical
stress shall not be applied to the PC board or mount-
ed components, to prevent failure or damage to the de-
vices.
(1) Mounted PC boards shall be supported by an
adequate number of supporting pins with bend
settings of 90 mm span 0.5 mm max.
Preheating
60 to 120 sec
3 sec max.
<Allowable temperature difference
oT>
Size
Temp. Tol.
0201 to 1206, 0508, 0612, 0504
oT
<
150 °C
1210
oT
<
130 °C
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Sep. 2008
– EC52 –
Embedded System
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