EEWORLDEEWORLDEEWORLD

Part Number

Search

BCS-133-L-D-DE-031

Description
BOX CONNECTOR SOCKET STRIP
CategoryThe connector   
File Size616KB,1 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
Download Datasheet Parametric View All

BCS-133-L-D-DE-031 Overview

BOX CONNECTOR SOCKET STRIP

BCS-133-L-D-DE-031 Parametric

Parameter NameAttribute value
Connector typesocket, bottom or top plug-in
Contact typefemale socket
styleboard to board
Number of pins66
Number of pins loaded65
Spacing - Mating0.100"(2.54mm)
Number of rows2
Line spacing - patching0.100"(2.54mm)
Installation typeThrough hole
Terminationwelding
Fastening typepush-pull
Contact surface treatment - matinggold
Contact Surface Treatment Thickness - Mating10.0µin(0.25µm)
Insulation colorblack
Insulation height0.290"(7.37mm)
Contact length - terminal0.120"(3.05mm)
Operating temperature-55°C ~ 125°C
Material flammability ratingUL94 V-0
Contact Surface Preparation - Columntin
Joint stack height-
Intrusion protection-
characteristic-
Rated current4.6A/contact
Rated voltage475VAC
application-
Insulation MaterialsLiquid crystal polymer (LCP), glass fiber reinforced
Contact shapeSquare
Contact materialPhosphor bronze
Contact Surface Treatment Thickness - Column-
F-219
BCS–108–L–D–HE
BCS–110–L–S–DE
10 YEAR MFG
WITH 30 µ" GOLD
BCS–110–L–S–HE
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
BCS–115–L–D–TE
BCS–112–L–D–PE
(2.54 mm) .100"
BCS SERIES
TIGER CLAW PASS-THROUGH SOCKET
Mates with:
TSW, MTSW, HTSW,
HMTSW, TSS, ZSS,
DW, EW, ZW, HW, TSM,
MTLW, PHT
BCS
1
NO. PINS
PER ROW
PLATING
OPTION
ROW
OPTION
ENTRY
OPTION
OTHER
OPTION
SPECIFICATIONS
For complete specifications
see www.samtec.com?BCS
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating (BCS/TSW):
4.6 A per pin
(2 pins powered)
Voltage Rating:
475 VAC
(-TE/-DE/-PE mated with TSM)
450 VAC
(-HE mated with TSW)
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
(4.34 mm) .171" to
(7.24 mm) .285" from top,
(5.64 mm) .222" plus
board thickness minimum
from bottom.
–HE is (4.34 mm) .171"
to (6.35 mm) .250"
RoHS Compliant:
Yes
Lead–Free Solderable:
Yes
= Gold flash on contact,
Matte Tin on tail
–F
–L
= Single
–S
–D
–“XXX”
= Polarized
Position
(–BE not
available)
= Double
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
01 thru 50
–TE
01
02
(2.54)
.100
(0.89) .035 SQ TYP
02
(0.25)
.010
(3.05)
.120
(2.54)
.100
= Top
Entry
(5.08)
.200
01
(2.54)
.100
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
(7.37)
.290
(2.54) .100 x No. of Positions
(3.05)
.120
(0.25)
.010
(1.78)
.070
(4.06)
.160
= Top Entry
(For Bottom
Entry specify
–DE–BE)
Cannot be
used with plated
through-holes
–DE
FILE NO. E111594
(0.48)
.019
(2.54)
.100
(0.51)
.020
(5.08)
.200
(3.25)
.128
(0.25)
.010
(7.62)
.300
= Pass-
through
Entry
(For Bottom
Entry specify
–PE–BE)
–PE
ALSO AVAILABLE
(MOQ Required)
• Other platings
APPLICATIONS
BCS
TSW
(0.89) .035 SQ TYP
(2.79)
.110
(3.18)
.125
(8.13) .320
(0.25)
.010
(5.33)
.210
(5.72)
.225
(3.18)
.125
(7.87) .310
HORIZONTAL
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
= Horizontal
Entry
–HE
(2.54)
.100
(0.51)
.020
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
USB communication design example based on CH559 MCU Android AOA protocol
Wired communication between the MCU and the Android system can be achieved through the Micro USB interface on the Android device. There are two main ways: ① The Android device acts as the host, and th...
宋元浩 Domestic Chip Exchange
How to measure the power consumption of MSP430? [TI FAE sharing]
[align=left][color=#000] As we all know, MSP430 is famous for its ultra-low power consumption. However, many users have reported that in actual applications, when measuring the power consumption of MS...
莫妮卡 Microcontroller MCU
A/D conversion problem
I am a novice, this is my first time to post a help thread, please forgive me, I also hope to get help from you all, the A/D I use is 0804, the input A/D voltage signal is adjusted by the potentiomete...
zq1030 MCU
Elan MCU selection table
The latest Taiwan Elan MCU selection table....
cto MCU
Linux timing processing issues
[align=left]Linux needs to set a 10s timer, which counts down by seconds, and starts a thread every second to compare the data status of the sender and the receiver. How can this be achieved?...
青城山下 Linux and Android
Bluetooth BLE protocol layer notes
BLE protocol: PHY layer: 1Mbps adaptive frequency hopping GFSK (Gaussian frequency shift keying), running in the license-free 2.4GHz band. LL control layer: control the chip to work in one of the five...
nanstone ARM Technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1559  929  1187  2482  2382  32  19  24  50  48 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号