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MT36JSZF51272PIY-1G1XX

Description
DDR DRAM Module, 512MX72, CMOS, LEAD FREE, MO-269, RDIMM-240
Categorystorage    storage   
File Size402KB,18 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Environmental Compliance
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MT36JSZF51272PIY-1G1XX Overview

DDR DRAM Module, 512MX72, CMOS, LEAD FREE, MO-269, RDIMM-240

MT36JSZF51272PIY-1G1XX Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeDIMM
package instructionDIMM,
Contacts240
Reach Compliance Codecompli
ECCN codeEAR99
access modeDUAL BANK PAGE BURST
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-XDMA-N240
JESD-609 codee4
memory density38654705664 bi
Memory IC TypeDDR DRAM MODULE
memory width72
Number of functions1
Number of ports1
Number of terminals240
word count536870912 words
character code512000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512MX72
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
self refreshYES
Maximum supply voltage (Vsup)1.575 V
Minimum supply voltage (Vsup)1.425 V
Nominal supply voltage (Vsup)1.5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceGold (Au)
Terminal formNO LEAD
Terminal locationDUAL
Maximum time at peak reflow temperature30
Base Number Matches1
4GB (x72, ECC, DR) 240-Pin DDR3 SDRAM RDIMM
Features
DDR3 SDRAM RDIMM
MT36JSZF51272P - 4GB
Features
DDR3 functionality and operations supported as
defined in the component data sheet
240-pin, registered dual in-line memory module
(RDIMM)
Fast data transfer rates: PC3-12800, PC3-10600,
PC3-8500, or PC3-6400
Heat spreader
4GB (512 Meg x 72)
V
DD
= 1.5V ±0.075V
V
DDSPD
= +3.0V to +3.6V
Supports ECC error detection and correction
Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
Dual rank
On-board I
2
C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
8 internal device banks
Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Gold edge contacts
Lead-free
Fly-by topology
Terminated control, command, and address bus
Table 1: Key Timing Parameters
Speed
Grade
-1G6
-1G4
-1G1
-1G0
-80B
Industry
Nomenclature
PC3-12800
PC3-10600
PC3-8500
PC3-8500
PC3-6400
Data Rate (MT/s)
CL = 11 CL = 10
1600
1333
1333
CL = 9
1333
1333
CL = 8
1066
1066
1066
1066
CL = 7
1066
1066
1066
CL = 6
800
800
800
800
800
CL = 5
667
667
667
667
667
t
RCD
t
RP
t
RC
Figure 1: 240-Pin RDIMM (MO-269 R/C J)
Module height: 30.0mm (1.181in)
Options
Operating
Commercial (0°C
T
A
+70°C)
Industrial (–40°C
T
A
+85°C)
Package
240-pin DIMM (lead-free)
Frequency/CAS latency
1.25ns @ CL = 11 (DDR3-12800)
1.5ns @ CL = 9 (DDR3-1333)
1.87ns @ CL = 7 (DDR3-1066)
Note:
temperature
1
Marking
None
I
Y
-1G6
-1G4
-1G1
1. Contact Micron for industrial temperature
module offerings.
(ns)
13.125
13.125
13.125
15
15
(ns)
13.125
13.125
13.125
15
15
(ns)
48.125
49.125
50.625
52.5
52.5
PDF: 09005aef830b8963
jszf36c512x72p.pdf – Rev. C 1/11 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2008 Micron Technology, Inc. All rights reserved.

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Description DDR DRAM Module, 512MX72, CMOS, LEAD FREE, MO-269, RDIMM-240 DDR DRAM Module, 512MX72, CMOS, LEAD FREE, MO-269, RDIMM-240 DDR DRAM Module, 512MX72, CMOS, LEAD FREE, MO-269, RDIMM-240 DDR DRAM Module, 512MX72, CMOS, LEAD FREE, MO-269, RDIMM-240 DDR DRAM Module, 512MX72, CMOS, LEAD FREE, MO-269, RDIMM-240 DDR DRAM Module, 512MX72, CMOS, LEAD FREE, MO-269, RDIMM-240 DDR DRAM Module, 512MX72, CMOS, LEAD FREE, MO-269, RDIMM-240
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Parts packaging code DIMM DIMM DIMM DIMM DIMM DIMM DIMM
package instruction DIMM, DIMM, DIMM, DIMM, DIMM, DIMM, DIMM,
Contacts 240 240 240 240 240 240 240
Reach Compliance Code compli compli compli compli compli compli unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code R-XDMA-N240 R-XDMA-N240 R-XDMA-N240 R-XDMA-N240 R-XDMA-N240 R-XDMA-N240 R-XDMA-N240
JESD-609 code e4 e4 e4 e4 e4 e4 e4
memory density 38654705664 bi 38654705664 bi 38654705664 bi 38654705664 bi 38654705664 bi 38654705664 bi 38654705664 bit
Memory IC Type DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE
memory width 72 72 72 72 72 72 72
Number of functions 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1
Number of terminals 240 240 240 240 240 240 240
word count 536870912 words 536870912 words 536870912 words 536870912 words 536870912 words 536870912 words 536870912 words
character code 512000000 512000000 512000000 512000000 512000000 512000000 512000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C 70 °C 85 °C 70 °C 70 °C
organize 512MX72 512MX72 512MX72 512MX72 512MX72 512MX72 512MX72
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM DIMM DIMM DIMM DIMM DIMM
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
self refresh YES YES YES YES YES YES YES
Maximum supply voltage (Vsup) 1.575 V 1.575 V 1.575 V 1.575 V 1.575 V 1.575 V 1.575 V
Minimum supply voltage (Vsup) 1.425 V 1.425 V 1.425 V 1.425 V 1.425 V 1.425 V 1.425 V
Nominal supply voltage (Vsup) 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
surface mount NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface Gold (Au) Gold (Au) Gold (Au) Gold (Au) Gold (Au) Gold (Au) Gold (Au)
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 30 30 30
Base Number Matches 1 1 1 1 1 1 1
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