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W19B320ATB7H

Description
IC FLASH 32M PARALLEL 48TFBGA
Categorystorage    storage   
File Size479KB,53 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Environmental Compliance
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W19B320ATB7H Overview

IC FLASH 32M PARALLEL 48TFBGA

W19B320ATB7H Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerWinbond Electronics Corporation
Parts packaging codeBGA
package instruction6 X 8 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-48
Contacts48
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time70 ns
Spare memory width8
startup blockTOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B48
JESD-609 codee1
length8 mm
memory density33554432 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size8,63
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-20 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA48,12X18,20
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size8K,64K
Maximum standby current0.000005 A
Maximum slew rate0.045 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width6 mm
W19B320AT/B Data Sheet
4M
×
8/2M
×
16 BITS
3V FLEXIBLE BANK FLASH MEMORY
Table of Contents-
1.
2.
3.
4.
5.
6.
GENERAL DESCRIPTION ......................................................................................................... 4
FEATURES ................................................................................................................................. 4
PIN CONFIGURATIONS ............................................................................................................ 5
BLOCK DIAGRAM ...................................................................................................................... 6
PIN DESCRIPTION..................................................................................................................... 6
FUNCTIONAL DESCRIPTION ................................................................................................... 7
6.1
Device Bus Operation..................................................................................................... 7
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
6.1.6
6.1.7
6.1.8
6.1.9
6.1.10
6.1.11
6.1.12
6.1.13
6.1.14
Word/Byte Configuration ..................................................................................................7
Reading Array Data ..........................................................................................................7
Writing Commands/Command Sequences.......................................................................7
Simultaneous Read/Write Operations with Zero Latency .................................................8
Standby Mode ..................................................................................................................8
Automatic Sleep Mode .....................................................................................................8
#RESET: Hardware Reset Pin..........................................................................................9
Output Disable Mode........................................................................................................9
Autoselect Mode...............................................................................................................9
Sector/Sector Block Protection and Unprotection...........................................................9
Write Protect (#WP) .....................................................................................................10
Temporary Sector Unprotect ........................................................................................10
Security Sector Flash Memory Region .........................................................................10
Hardware Data Protection ............................................................................................11
Reading Array Data ........................................................................................................12
Reset Command.............................................................................................................12
AUTOSELECT Command Sequence .............................................................................13
Byte/Word Program Command Sequence......................................................................13
Unlock Bypass Command Sequence .............................................................................14
Chip Erase Command Sequence ...................................................................................14
Sector Erase Command Sequence ................................................................................14
Erase Suspend/Erase Resume Commands ...................................................................15
DQ7: #Data Polling.........................................................................................................16
RY/#BY: Ready/#Busy ...................................................................................................16
DQ6: Toggle Bit I............................................................................................................16
6.2
Command Definitions ................................................................................................... 12
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.7
6.2.8
6.3
Write Operation Status ................................................................................................. 16
6.3.1
6.3.2
6.3.3
-1-
Publication Release Date: December 27, 2005
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