TPA711DGNG4 datasheet, PDF - EEWORLD Datasheet

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TPA711DGNG4: Description700-mW Mono, Class-AB Audio Amplifier with Mono Headphone Drive 8-MSOP-PowerPAD -40 to 85; CategoryAnalog mixed-signal IC Consumption circuit; File Size1MB，39 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance; Related ProductsFound15parts with similar functions to TPA711DGNG4

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TPA711DGNG4 Overview

700-mW Mono, Class-AB Audio Amplifier with Mono Headphone Drive 8-MSOP-PowerPAD -40 to 85

TPA711DGNG4 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	MSOP
package instruction	HTSSOP, TSSOP8,.19
Contacts	8
Reach Compliance Code	compli
ECCN code	EAR99
Nominal bandwidth	4 kHz
Commercial integrated circuit types	AUDIO AMPLIFIER
harmonic distortion	0.3%
JESD-30 code	S-PDSO-G8
JESD-609 code	e4
length	3 mm
Humidity sensitivity level	1
Number of channels	1
Number of functions	1
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Nominal output power	0.7 W
Package body material	PLASTIC/EPOXY
encapsulated code	HTSSOP
Encapsulate equivalent code	TSSOP8,.19
Package shape	SQUARE
Package form	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3.3/5 V
Certification status	Not Qualified
Maximum seat height	1.1 mm
Maximum slew rate	1.25 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3 mm

TPA711DGNG4 Related Products

	TPA711DGNG4	TPA711DGN	TPA711D	TPA711DR	TPA711DGNR	TPA711DG4
Description	700-mW Mono, Class-AB Audio Amplifier with Mono Headphone Drive 8-MSOP-PowerPAD -40 to 85	700-mW Mono, Class-AB Audio Amplifier with Mono Headphone Drive 8-MSOP-PowerPAD -40 to 85	700-mW Mono, Class-AB Audio Amplifier with Mono Headphone Drive 8-SOIC -40 to 85	700-mW Mono, Class-AB Audio Amplifier with Mono Headphone Drive 8-SOIC -40 to 85	700-mW Mono, Class-AB Audio Amplifier with Mono Headphone Drive 8-MSOP-PowerPAD -40 to 85	700-mW Mono, Class-AB Audio Amplifier with Mono Headphone Drive 8-SOIC -40 to 85
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	MSOP	MSOP	SOIC	SOIC	MSOP	SOIC
package instruction	HTSSOP, TSSOP8,.19	HTSSOP, TSSOP8,.19	SOP, SOP8,.25	SOP, SOP8,.25	HTSSOP, TSSOP8,.19	SOP, SOP8,.25
Contacts	8	8	8	8	8	8
Reach Compliance Code	compli	compli	compli	compli	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Nominal bandwidth	4 kHz	4 kHz	4 kHz	4 kHz	4 kHz	4 kHz
Commercial integrated circuit types	AUDIO AMPLIFIER	AUDIO AMPLIFIER	AUDIO AMPLIFIER	AUDIO AMPLIFIER	AUDIO AMPLIFIER	AUDIO AMPLIFIER
harmonic distortion	0.3%	0.3%	0.3%	0.3%	0.3%	0.3%
JESD-30 code	S-PDSO-G8	S-PDSO-G8	R-PDSO-G8	R-PDSO-G8	S-PDSO-G8	R-PDSO-G8
JESD-609 code	e4	e4	e4	e4	e4	e4
length	3 mm	3 mm	4.9 mm	4.9 mm	3 mm	4.9 mm
Humidity sensitivity level	1	1	1	1	1	1
Number of channels	1	1	1	1	1	1
Number of functions	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Nominal output power	0.7 W	0.7 W	0.35 W	0.35 W	0.7 W	0.35 W
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HTSSOP	HTSSOP	SOP	SOP	HTSSOP	SOP
Encapsulate equivalent code	TSSOP8,.19	TSSOP8,.19	SOP8,.25	SOP8,.25	TSSOP8,.19	SOP8,.25
Package shape	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260
power supply	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.1 mm	1.1 mm	1.75 mm	1.75 mm	1.1 mm	1.75 mm
Maximum slew rate	1.25 mA	1.25 mA	1.25 mA	1.25 mA	1.25 mA	1.25 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	1.27 mm	1.27 mm	0.65 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	3 mm	3 mm	3.9 mm	3.9 mm	3 mm	3.9 mm
Maker	Texas Instruments	-	-	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	-	Lead free	Lead free	Lead free	Lead free	Lead free
Factory Lead Time	-	1 week	1 week	6 weeks	1 week	6 weeks

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