|
TPA311DGNR |
TPA311D |
TPA311DGN |
TPA311DRG4 |
TPA311DR |
TPA311DGNRG4 |
TPA311DGNG4 |
TPA311DG4 |
| Description |
350-mW Mono Class-AB Audio Amplifier 8-MSOP-PowerPAD |
350-mW Mono Class-AB Audio Amplifier 8-SOIC |
350-mW Mono Class-AB Audio Amplifier 8-MSOP-PowerPAD |
350-mW Mono Class-AB Audio Amplifier 8-SOIC |
350-mW Mono Class-AB Audio Amplifier 8-SOIC |
350-mW Mono Class-AB Audio Amplifier 8-MSOP-PowerPAD |
350-mW Mono Class-AB Audio Amplifier 8-MSOP-PowerPAD |
350-mW Mono Class-AB Audio Amplifier 8-SOIC |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
MSOP |
SOIC |
MSOP |
SOIC |
SOIC |
MSOP |
MSOP |
SOIC |
| package instruction |
MSOP-8 |
SOIC-8 |
HTSSOP, TSSOP8,.19 |
SOP, SOP8,.25 |
SOIC-8 |
HTSSOP, TSSOP8,.19 |
MSOP-8 |
SOP, SOP8,.25 |
| Contacts |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
| Reach Compliance Code |
compliant |
compliant |
compliant |
compli |
compliant |
compli |
compliant |
compli |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Nominal bandwidth |
10 kHz |
10 kHz |
10 kHz |
10 kHz |
10 kHz |
10 kHz |
10 kHz |
10 kHz |
| Commercial integrated circuit types |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
| harmonic distortion |
0.5% |
0.5% |
0.5% |
0.5% |
0.5% |
0.5% |
0.5% |
0.5% |
| JESD-30 code |
S-PDSO-G8 |
R-PDSO-G8 |
S-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
S-PDSO-G8 |
S-PDSO-G8 |
R-PDSO-G8 |
| JESD-609 code |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
| length |
3 mm |
4.9 mm |
3 mm |
4.9 mm |
4.9 mm |
3 mm |
3 mm |
4.9 mm |
| Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of channels |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Nominal output power |
0.7 W |
0.7 W |
0.7 W |
0.7 W |
0.7 W |
0.7 W |
0.7 W |
0.7 W |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
HTSSOP |
SOP |
HTSSOP |
SOP |
SOP |
HTSSOP |
HTSSOP |
SOP |
| Encapsulate equivalent code |
TSSOP8,.19 |
SOP8,.25 |
TSSOP8,.19 |
SOP8,.25 |
SOP8,.25 |
TSSOP8,.19 |
TSSOP8,.19 |
SOP8,.25 |
| Package shape |
SQUARE |
RECTANGULAR |
SQUARE |
RECTANGULAR |
RECTANGULAR |
SQUARE |
SQUARE |
RECTANGULAR |
| Package form |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
| power supply |
3.3/5 V |
3.3/5 V |
3.3/5 V |
3.3/5 V |
3.3/5 V |
3.3/5 V |
3.3/5 V |
3.3/5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.1 mm |
1.75 mm |
1.1 mm |
1.75 mm |
1.75 mm |
1.1 mm |
1.1 mm |
1.75 mm |
| Maximum slew rate |
1.5 mA |
1.5 mA |
1.5 mA |
1.5 mA |
1.5 mA |
1.5 mA |
1.5 mA |
1.5 mA |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
| surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
| Terminal pitch |
0.65 mm |
1.27 mm |
0.65 mm |
1.27 mm |
1.27 mm |
0.65 mm |
0.65 mm |
1.27 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
3 mm |
3.9 mm |
3 mm |
3.9 mm |
3.9 mm |
3 mm |
3 mm |
3.9 mm |
| Is it lead-free? |
Lead free |
Lead free |
Lead free |
- |
Lead free |
Lead free |
Lead free |
- |
| Factory Lead Time |
1 week |
6 weeks |
1 week |
- |
6 weeks |
6 weeks |
6 weeks |
1 week |
| Samacsys Description |
Audio Amplifiers 0.35-W Mono Audio Power Amplifier |
3.91mm TPA311D, Audio Amplifier Class-AB mono/stereo 1.4MHz +85°C 8-Pin SOIC |
TPA311DGN, Speaker Audio Amplifier Class-AB mono/stereo 1.4MHz +85 °C 8-Pin HTSSOP EP, MSOP EP |
- |
350-mW Mono Class-AB Audio Amplifier |
- |
Audio Amplifiers 0.35-W Mono Audio Power Amplifier |
- |