Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type
Commercial Grade
1
Bulk Bag
7" Reel/Unmarked
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch
2
13" Reel/Unmarked/2 mm pitch
2
7" Reel
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch
2
13" Reel/Unmarked/2 mm pitch
2
1
1
Packaging/Grade
Ordering Code (C-Spec)
Not Required (Blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
7082
Automotive Grade
3
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
3190
3191
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked.
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
3
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L” x W”) and thickness dimension. See “Chip Thickness/Tape & Reel
Packaging Quantities” and “Tape & Reel Packaging Information”.
3
For additional Information regarding “AUTO” C-Spec options, see “Automotive C-Spec Information”.
3
All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For
more information see “Capacitor Marking”.
Benefits
−55°C to +150°C operating temperature range
Lead (Pb)-Free, RoHS and REACH compliant
EIA 0402, 0603, 0805, 1206, 1210, and 1812 case sizes
DC voltage ratings of 10 V, 16 V, 25 V, 50 V and 100 V
Capacitance offerings ranging from 0.5 pF to 0.22 μF
Available capacitance tolerances of ±0.10 pF, ±0.25 pF,
±0.5 pF, ±1%, ±2%, ±5%, ±10%, and ±20%
• Extremely low ESR and ESL
• High thermal stability
• High ripple current capability
•
•
•
•
•
•
• No capacitance change with respect to applied rated DC
This issue of "Power Supply Technology Excellent Materials" selects 30 representative materials, totaling 530M. It mainly includes switching power supplies, transformers, high-frequency power supplies...
[i=s] This post was last edited by qq670300923 on 2016-8-9 16:40 [/i] I had planned to go to a training institution for a month of training recently, but it was too expensive, so I didn't sign up. I d...
The user guide gives this formula: Vout = Vref * DAC12_xDAT/4096; DAC12_xDAT uses straight binary data format, so how to calculate it if it is a hexadecimal number? And it seems that the routines prov...
The following figure is a picture of a 24-bit ADC. I found some information about dBFS. For a 24-bit ADC, dBFS = 20*log(code / 16777216). The maximum is 0dBFS and the minimum should be -144.49dBFS. Ho...
The intelligent driving community has its own rhythm. Some are busy pushing new versions and focusing on R&D, others are busy with publicity and promotion, and still others are immersed in mass pro...[Details]
1. Equipment Overview
Shell-and-tube heat exchangers are a common heat exchange device used in chemical evaporation and heating equipment. Currently, the tubesheets of shell-and-tube heat exch...[Details]
Nios II is a configurable 16-/32-bit RISC processor. Combined with a rich set of peripheral-specific instructions and hardware acceleration units, it provides a highly flexible and powerful SOPC sy...[Details]
Reflow soldering, a common soldering method in modern electronics manufacturing, primarily melts solder paste and pads to form solder joints. With technological advancements, soldering equipment ha...[Details]
What is "Car Electronic Fence"
Fleet managers can define a graphical area (regular or irregular) or divide it into administrative zones in Yamei Technology's vehicle backend management system ...[Details]
New energy vehicles are increasingly popular with consumers due to policies and energy conservation. Once you've purchased your vehicle, maintenance is essential. However, due to the different powe...[Details]
Today's security industry has entered the era of massive networking. Many enterprises, especially financial institutions, have established multi-level video surveillance networking platforms. Lever...[Details]
On August 25th, TSMC, the world's leading contract chip manufacturer, attracted significant attention for its decision to build a chip manufacturing facility in Arizona. TSMC primarily manufactures...[Details]
Common Mode Semiconductor has officially released its latest generation of power management ICs—the GM6506 series. This fully integrated high-frequency synchronous rectification step-down p...[Details]
Recently, Tesla released the "Tesla Car Voice Assistant Terms of Use", announcing that the car voice assistant will be connected to the Doubao large model (Skylark large model) and DeepSeek Chat pr...[Details]
For autonomous vehicles to safely navigate the road, they must identify far more complex objects than just traffic lights, pedestrians, and other familiar objects. Among these obstacles is a crucia...[Details]
The automotive industry in 2025 is undergoing a thorough intelligent reshuffle.
Geely wants to make changes in the field of AI cockpits: in the future, there will be no traditional smart...[Details]
Since its invention in the mid-1940s, the microwave oven has evolved from a humble beginning to commercial use, entering homes in the 1960s and rapidly gaining popularity. Its basic functionality a...[Details]
The digital TV set-top box consists of a tuner, QAM demodulator, TS demultiplexer, MPEG-2 decoder, PAUNTSC video encoder, embedded CPU system and peripheral interfaces, CA module, and uplink data m...[Details]
introduction
The concept of the smart home is gradually developing and gaining market acceptance. We believe its ultimate form lies in the interconnection of all home appliances through open i...[Details]