EEWORLDEEWORLDEEWORLD

Part Number

Search

891672

Description
FLUX - WATER SOLUBLE LEAD FREE
CategoryTools and equipment   
File Size92KB,3 Pages
ManufacturerMulticore
Download Datasheet Parametric View All

891672 Overview

FLUX - WATER SOLUBLE LEAD FREE

891672 Parametric

Parameter NameAttribute value
typeFlux - Lead-free, water-soluble
form-
shelf life6 months
Shelf life start dateManufacturing date
Storage/refrigeration temperature-
delivery information-
Remark-
Technical Data Sheet
LOCTITE WS 300
July-2016
PRODUCT DESCRIPTION
LOCTITE
WS
300
provides the
characteristics:
Alloy
Alloy melting range, ºC
Powder Size Coding
IPC Equivalent
Powder Particle Size, µm
Metal Loading (Weight %)
Malcom Viscosity @ 25ºC, Pa.s
@ Shear Rate of 6 s
-1
Slump, J-STD-005, mm
RT, 15 minutes
0.33 x 2.03 mm pads
0.63 x 2.03 mm pads
150°C, 15 minutes
0.33 x 2.03 mm pads
0.63 x 2.03 mm pads
Initial tack force, gF
97SC
217
DAP
Type 4
38-15
88
1,525
following
product
Application
Technology
Water-Wash Soldering
Lead-Free Solder Paste
LOCTITE WS 300 is a lead-free water washable solder paste for
printing and reflow in air or nitrogen atmospheres where process yield
is critical. LOCTITE WS 300 solder paste offers excellent open time
and good soldering activity over a wide range of reflow profiles and
surface finishes. LOCTITE WS 300 is available with 96SC & 97SC
SnAgCu alloys. Other Pb-free alloys may be available on request.
IPC A21 Pattern
0.15
0.33
0.15
0.33
39.5
FEATURES AND BENEFITS
● Effective over a wide range of printer cycle times and print
speeds
● Excellent printer open time and between print abandon time
● Long component tack time
● Excellent slump resistance
● Effective over a wide range of reflow profiles in air or nitrogen
● Residues removed with de-ionized water rinse processing
TYPICAL PROPERTIES
Solder Paste Typical Properties
Alloys
96SC, 97SC
Alloy melting range, ºC
217
Powder Size Coding
AGS
IPC Equivalent (ANSI/J-STD 005)
Type 3
Powder Particle Size, µm
45-20
Metal Loading (Weight %)
88
-1
Malcom Viscosity at 6 s @ 25°C, P
1,450
Brookfield Viscosity TF spindle, 25°C, 5rpm after 590,000
2 minutes, mPa∙s
Thixotropic Index (Ti), 25°C
0.66
(Ti = log(viscosity @ 1.8s
-1
/ viscosity @ 18s
-1
)
Slump, J-STD-005, mm
IPC A21 Pattern
RT, 15 minutes
0.33 x 2.03 mm pads
0.15
0.63 x 2.03 mm pads
0.33
150°C, 15 minutes
0.33 x 2.03 mm pads
0.15
0.63 x 2.03 mm pads
0.33
Initial tack force, gF
39.5
Alloy
Alloy melting range, ºC
Powder Size Coding
IPC Equivalent
Powder Particle Size, µm
Metal Loading (Weight %)
Malcom Viscosity @ 25ºC, Pa.s
@ Shear Rate of 6 s
-1
Brookfield Viscosity @ 25ºC, mPa.s
Spindle TF, Speed 5 rpm, 2 minutes
Thixotropic Index (Ti)
Ti = log (1.8/18 s
-1
)
96SC
217
AGS
Type 3
45-20
84
430
292,000
0.68
Solder Powder:
Careful control of the atomisation process for production of solder
powders for LOCTITE WS 300 solder pastes ensures that the solder
powder is produced to a quality level that exceeds IPC/J-STD-006 &
EN29453 requirements for sphericity, size distribution, impurities and
oxide levels. Minimum order requirements may apply to certain alloys
and powder sizes.
DIRECTIONS FOR USE
Reflow:
LOCTITE WS 300 has been formulated for reflow in air over a wide
range of temperature profiles. A minimum peak temperature of
230-235°C is required. The diagram below shows a reflow profile that
has been used successfully. Other profiles may also give good results,
depending on board design factors.
Packaging issues of double-row pluggable connectors
I want to find the 3D package file, i.e. .stp file, of a double-row pluggable connector like the one shown in the picture. This should be a product of Phoenix Contact However, on its official website,...
shaorc PCB Design
How to increase output current by connecting NPN transistor in parallel with LDO
LTC3042 has a reference circuit that connects an NPN transistor at the output. The input of the reference circuit is 5V and the output is 2V, providing a maximum current of 1A. I have never seen this ...
littleshrimp Power technology
msp430g2553 insufficient memory and interrupt algorithm timing issues
I use msp430g2553 to make an energy detection device. I enter an interrupt every 20us, and perform sampling and ANF phase-locked algorithm calculations in the interrupt. Now there are two problems tha...
追梦人weijian Microcontroller MCU
EEWORLD thanks you——Chang Changze 1
[table=98%] [tr][td] [align=left][size=14px][font=微软雅黑][size=3]Activity (II): Post a message in any forum section with the title "EEWORLD Thanks for Having You - Username" according to the following r...
常见泽1 Talking
Japanese auto parts giant exposed to large-scale fraud for 20 years! Affecting 10 Japanese automakers...
Following the Denso fuel pump flameout scandal and Takata defective airbag recall scandal, Japanese auto parts manufacturers were once again exposed for product data fraud. According to media reports,...
eric_wang Automotive Electronics
The Basics: Capacitors and Inductors
The Basics: Capacitors and Inductors...
linda_xia Discrete Device

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2612  2617  1889  2181  2221  53  39  44  45  46 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号