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BM10JC-30DS-0.4V(53)

Description
CONN RECEPT 30POS 0.4MM SMD GOLD
CategoryThe connector   
File Size393KB,12 Pages
ManufacturerHirose Electric
Environmental Compliance
Download Datasheet Parametric View All

BM10JC-30DS-0.4V(53) Overview

CONN RECEPT 30POS 0.4MM SMD GOLD

BM10JC-30DS-0.4V(53) Parametric

Parameter NameAttribute value
Connector typeSocket with central contact
Number of pins30
spacing0.016"(0.40mm)
Number of rows2
Installation typesurface mount
characteristicFixed solder tail
Contact platinggold
Contact plating thickness2.00µin(0.051µm)
Joint stack height0.8mm
board height0.031"(0.80mm)
0.4 mm Contact Pitch,Stacking Height 0.6mm 0.8mm Board-to-Board /Board-to-FPC Connectors
BM10 Series
Decrease in the board-occupied area
Series:
pos.
BM10
Oct.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
BM10
×
×
figure.1
High contact reliability
■Features
Header contact
Main contact
point
Auxiliary lock
point
1.H i g h e r d e n s i t y o f t h e b o a r d - m o u n t e d
components
Extremely small board mounting pattern and low abovethe-
board profile makes the connectors ideally suited for small
device applications.
Globally unrivalled compact depth:when mated 2.98mm
Header 2.46mm
Length - world’s smallest class:10.4mm
H=0.8
Receptacle contact
Main contact
point
Header contact
Receptacle contact
Lock
H=0.6
figure.2
2.Reliable electrical and mechanical connection
Despite its small mated height, unique contact configuration,
with a 2-point contacts and effective mating length of
0.2mm(height 0.8mm)and 0.1mm(height 0.6mm), assures
highly reliable connection while confirming a complete mating
with a definite tactile feel.
Splatter protection
3.Large self-alignment distance
The connectors will self-align within 0.3 mm.
4.Built-in shock absorbing feature
The protrusions and indents in the insulator bodies protect the
connectors from failures when exposed to sudden impact.
5.Solder wicking prevention
Nickel barriers prevent un-intentional solder wicking.
6.Contamination protection
Insulator walls protect the contact areas against flux splatter or
other physical particles contamination.
7.Conducive traces on the PCB can run under
the connector
No exposed contacts on the bottom of the connector.
figure.3
2010.9
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