F-219
CLE–125–01–G–DV
CLE–108–01–G–DV
CLE–130–01–G–DV
(0.80 mm) .0315"
CLE SERIES
COST-EFFECTIVE MICRO SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?CLE
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
BeCu
Plating:
Au over 50 µ" (1.27 µm) Ni
Current Rating (CLE/FTE):
2.7 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
Top Entry = (1.73 mm) .068"
to (3.18 mm) .125" with
(0.38 mm) .015" wipe, or
pass-through
Bottom Entry = (3.23 mm) .127"
minimum plus board thickness
Normal Force:
75 grams (0.73 N)
Max Cycles:
100 with 10 µ" (0.25 µm) Au
RoHS Compliant:
Yes
Mates with:
FTE, AW
Ideal for
pass-through
applications
OPTIONS
–TR OPTION
–P OPTION
(0.80 mm) .0315"
micro pitch
Surface
Mount
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (04-65)
(0.15 mm) .006" max (66-90)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
CLE
1
NO. PINS
PER ROW
01
PLATING
OPTION
DV
OPTIONS
04 thru 90
= 10 µ" (0.25 µm) Gold
–G
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
= Alignment Pin
(4 positions minimum)
Metal or plastic at
Samtec discretion.
–A
No. of positions x
(0.80) .0315 + (0.38) .015
(0.80)
.0315
02
= (3.50 mm) .138" DIA
Polyimide film
Pick & Place Pad
(8 positions minimum)
–K
FILE NO. E111594
(3.18)
.125
(1.20)
.047
(0.30)
.012
01
(4.39)
.173
x
(6.35)
.250
(3.51)
.138
–P OPTION
= Metal Pick &
Place Pad
(8 positions minimum)
–P
= Tape & Reel
Packaging
–TR
(3.12)
.123
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
(3.30)
.130
(4.83)
.190
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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Embedded System
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