2Gb: x16, x32 Mobile LPDDR SDRAM
Features
Mobile Low-Power DDR SDRAM
MT46H128M16LF – 32 Meg x 16 x 4 Banks
MT46H64M32LF – 16 Meg x 32 x 4 Banks
MT46H128M32L2 – 16 Meg x 32 x 4 Banks x 2
MT46H256M32L4 – 32 Meg x 16 x 4 Banks x 4
MT46H256M32R4 – 32 Meg x 16 x 4 Banks x 4
Features
•
V
DD
/V
DDQ
= 1.70–1.95V
•
Bidirectional data strobe per byte of data (DQS)
•
Internal, pipelined double data rate (DDR)
architecture; two data accesses per clock cycle
•
Differential clock inputs (CK and CK#)
•
Commands entered on each positive CK edge
•
DQS edge-aligned with data for READs; center-
aligned with data for WRITEs
•
4 internal banks for concurrent operation
•
Data masks (DM) for masking write data; one mask
per byte
•
Programmable burst lengths (BL): 2, 4, 8, or 16
•
Concurrent auto precharge option is supported
•
Auto refresh and self refresh modes
•
1.8V LVCMOS-compatible inputs
•
Temperature-compensated self refresh (TCSR)
•
Partial-array self refresh (PASR)
•
Deep power-down (DPD)
•
Status read register (SRR)
•
Selectable output drive strength (DS)
•
Clock stop capability
•
64ms refresh; 32ms for the automotive temperature
range
Table 1: Key Timing Parameters (CL = 3)
Speed Grade
-5
-54
-6
-75
Clock Rate
200 MHz
185 MHz
166 MHz
133 MHz
Access Time
5.0ns
5.0ns
5.0ns
6.0ns
Options
•
V
DD
/V
DDQ
–
1.8V/1.8V
•
Configuration
–
128 Meg x 16 (32 Meg x 16 x 4 banks)
–
64 Meg x 32 (16 Meg x 32 x 4 banks)
•
Addressing
–
JEDEC-standard
–
Reduced page-size
1
–
4-die stack reduced page-size
2
–
2-die stack standard
–
4-die stack standard
•
Plastic "green" package
–
60-ball VFBGA (10mm x 11.5mm)
3
–
90-ball VFBGA (10mm x 13mm)
4
•
PoP (plastic "green" package)
–
168-ball VFBGA (12mm x 12mm)
4
–
168-ball WFBGA (12mm x 12mm)
4
–
168-ball WFBGA (12mm x 12mm)
4
–
240-ball WFBGA (14mm x 14mm)
4
•
Timing – cycle time
–
5ns @ CL = 3 (200 MHz)
–
5.4ns @ CL = 3 (185 MHz)
–
6ns @ CL = 3 (166 MHz)
–
7.5ns @ CL = 3 (133 MHz)
•
Power
–
Standard I
DD2
/I
DD6
•
Operating temperature range
–
Commercial (0˚ to +70˚C)
–
Industrial (–40˚C to +85˚C)
–
Automotive (–40˚C to +105˚C)
1
•
Design revision
Notes:
1.
2.
3.
4.
Marking
H
128M16
64M32
LF
LG
R4
L2
L4
CK
CM
JV
KQ
MA
MC
-5
-54
-6
-75
None
None
IT
AT
:A
Contact factory for availability.
Available in the 168-ball JV package only.
Available only for x16 configuration.
Available only for x32 configuration.
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2gb_ddr_mobile_sdram_t69m.pdf - Rev. M 11/10 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
2Gb: x16, x32 Mobile LPDDR SDRAM
Features
Table 2: Configuration Addressing – 2Gb
Architecture
Configuration
Refresh count
Row addressing
Column addressing
128 Meg x 16
8K
16K A[13:0]
2K A11, A[9:0]
64 Meg x 32
8K
16K A[13:0]
1K A[9:0]
Reduced Page-Size
Option 128 Meg x 16
32 Meg x 16 x 4 banks
8K
32K A[14:0]
1K A[9:0]
Reduced Page-Size
Option 64 Meg x 32
16 Meg x 32 x 4 banks
8K
32K A[14:0]
512 A[8:0]
32 Meg x 16 x 4 banks 16 Meg x 32 x 4 banks
See Package Block Diagrams (page 17) for descriptions of signal connections and die configurations for each
respective architecture.
Figure 1: 2Gb Mobile LPDDR Part Numbering
MT 46
Micron Technology
Product Family
46 = Mobile LPDDR
H
64M32 LF CK -6
IT
:A
Design Revision
:A = First generation
Operating Temperature
Blank = Commercial (0°C to +70°C)
IT = Industrial (–40°C to +85°C)
AT = Automotive (–40°C to +105°C)
Operating Voltage
H = 1.8/1.8V
Configuration
128 Meg x 16
64 Meg x 32
128 Meg x 32
256 Meg x 32
Power
Blank = Standard I
DD2
/I
DD6
Cycle Time (CL = 3)
-5 = 5ns
t
CK
-54 = 5.4ns
t
CK
-6 = 6ns
t
CK
-75 = 7.5ns
t
CK
Addressing
LF = JEDEC-standard addressing
L2 = 2-die stack standard addressing
L4 = 4-die stack standard addressing
LG = Reduced page-size
R4 = 4-die stack reduced page-size addressing
Package Codes
CK = 60-ball (10mm x 11.5mm) VFBGA, “green”
CM = 90-ball (10mm x 13mm) VFBGA, “green”
JV = 168-ball (12mm x 12mm) VFBGA, “green”
KQ = 168-ball (12mm x 12mm) WFBGA, “green”
MA = 168-ball (12mm x 12mm) WFBGA, “green”
MC = 240-ball (14mm x 14mm) WFBGA, “green”
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. Micron’s FBGA part marking decoder is available at
www.micron.com/decoder.
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2gb_ddr_mobile_sdram_t69m.pdf - Rev. M 11/10 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
2Gb: x16, x32 Mobile LPDDR SDRAM
Features
General Description ......................................................................................................................................... 8
Functional Block Diagrams ............................................................................................................................... 9
Ball Assignments ........................................................................................................................................... 11
Ball Descriptions ............................................................................................................................................ 15
Package Block Diagrams ................................................................................................................................. 17
Package Dimensions ...................................................................................................................................... 20
Electrical Specifications .................................................................................................................................. 26
Electrical Specifications – I
DD
Parameters ........................................................................................................ 29
Electrical Specifications – AC Operating Conditions ......................................................................................... 35
Output Drive Characteristics ........................................................................................................................... 40
Functional Description ................................................................................................................................... 43
Commands .................................................................................................................................................... 44
DESELECT ................................................................................................................................................ 45
NO OPERATION ........................................................................................................................................ 45
LOAD MODE REGISTER ............................................................................................................................ 45
ACTIVE ..................................................................................................................................................... 45
READ ........................................................................................................................................................ 46
WRITE ...................................................................................................................................................... 47
PRECHARGE ............................................................................................................................................. 48
BURST TERMINATE .................................................................................................................................. 49
AUTO REFRESH ........................................................................................................................................ 49
SELF REFRESH ........................................................................................................................................... 50
DEEP POWER-DOWN ................................................................................................................................ 50
Truth Tables ................................................................................................................................................... 51
State Diagram ................................................................................................................................................ 56
Initialization .................................................................................................................................................. 57
Standard Mode Register .................................................................................................................................. 60
Burst Length .............................................................................................................................................. 61
Burst Type ................................................................................................................................................. 61
CAS Latency .............................................................................................................................................. 62
Operating Mode ......................................................................................................................................... 63
Extended Mode Register ................................................................................................................................. 64
Temperature-Compensated Self Refresh .................................................................................................... 64
Partial-Array Self Refresh ........................................................................................................................... 65
Output Drive Strength ................................................................................................................................ 65
Status Read Register ....................................................................................................................................... 66
Bank/Row Activation ...................................................................................................................................... 68
READ Operation ............................................................................................................................................. 69
WRITE Operation ........................................................................................................................................... 80
PRECHARGE Operation .................................................................................................................................. 92
Auto Precharge ............................................................................................................................................... 92
Concurrent Auto Precharge ........................................................................................................................ 93
AUTO REFRESH Operation ............................................................................................................................. 98
SELF REFRESH Operation .............................................................................................................................. 99
Power-Down ................................................................................................................................................. 100
Deep Power-Down ................................................................................................................................... 102
Clock Change Frequency ............................................................................................................................... 104
Revision History ............................................................................................................................................ 105
Rev. M – 11/10 ........................................................................................................................................... 105
Rev. L – 09/10 ............................................................................................................................................ 105
Contents
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
2Gb: x16, x32 Mobile LPDDR SDRAM
Features
Rev. K – 08/10 ............................................................................................................................................ 105
Rev. J – 06/10 ............................................................................................................................................. 105
Rev. H – 05/10 ........................................................................................................................................... 105
Rev. G – 04/10 ........................................................................................................................................... 105
Rev. F – 04/10 ............................................................................................................................................ 105
Rev. E – 03/10 ............................................................................................................................................ 105
Rev. D – 12/09 ........................................................................................................................................... 106
Rev. C – 09/09 ............................................................................................................................................ 106
Rev. B – 08/09 ............................................................................................................................................ 106
Rev. A – 07/09 ............................................................................................................................................ 106
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2gb_ddr_mobile_sdram_t69m.pdf - Rev. M 11/10 EN
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
2Gb: x16, x32 Mobile LPDDR SDRAM
Features
Figure 1: 2Gb Mobile LPDDR Part Numbering .................................................................................................. 2
Figure 2: Functional Block Diagram (x16) ......................................................................................................... 9
Figure 3: Functional Block Diagram (x32) ....................................................................................................... 10
Figure 4: 60-Ball VFBGA – Top View, x16 only ................................................................................................. 11
Figure 5: 90-Ball VFBGA – Top View, x32 only ................................................................................................. 12
Figure 6: 168-Ball FBGA – 12mm x 12mm (Top View), x32 only ........................................................................ 13
Figure 7: 240-Ball FBGA – 14mm x 14mm (Top View), x32 only ........................................................................ 14
Figure 8: Single Rank, Single Channel (1 Die) Package Block Diagram ............................................................. 17
Figure 9: Dual Rank, Single Channel (2 Die) Package Block Diagram ............................................................... 18
Figure 10: Dual Rank, Single Channel (4 Die) Package Block Diagram ............................................................. 19
Figure 11: 60-Ball VFBGA (10mm x 11.5mm), Package Code: CK ...................................................................... 20
Figure 12: 90-Ball VFBGA (10mm x 13mm), Package Code: CM ....................................................................... 21
Figure 13: 168-Ball VFBGA (12mm x 12mm), Package Code: JV ........................................................................ 22
Figure 14: 168-Ball WFBGA (12mm x 12mm), Package Code: KQ ..................................................................... 23
Figure 15: 168-Ball WFBGA (12mm x 12mm), Package Code: MA ..................................................................... 24
Figure 16: 240-Ball WFBGA (14mm x 14mm), Package Code: MC ..................................................................... 25
Figure 17: Typical Self Refresh Current vs. Temperature ................................................................................. 34
Figure 18: ACTIVE Command ........................................................................................................................ 46
Figure 19: READ Command ........................................................................................................................... 47
Figure 20: WRITE Command ......................................................................................................................... 48
Figure 21: PRECHARGE Command ................................................................................................................ 49
Figure 22: DEEP POWER-DOWN Command .................................................................................................. 50
Figure 23: Simplified State Diagram ............................................................................................................... 56
Figure 24: Initialize and Load Mode Registers ................................................................................................. 58
Figure 25: Alternate Initialization with CKE LOW ............................................................................................ 59
Figure 26: Standard Mode Register Definition ................................................................................................ 60
Figure 27: CAS Latency .................................................................................................................................. 63
Figure 28: Extended Mode Register ................................................................................................................ 64
Figure 29: Status Read Register Timing .......................................................................................................... 66
Figure 30: Status Register Definition .............................................................................................................. 67
Figure 31: READ Burst ................................................................................................................................... 70
Figure 32: Consecutive READ Bursts .............................................................................................................. 71
Figure 33: Nonconsecutive READ Bursts ........................................................................................................ 72
Figure 34: Random Read Accesses ................................................................................................................. 73
Figure 35: Terminating a READ Burst ............................................................................................................. 74
Figure 36: READ-to-WRITE ............................................................................................................................ 75
Figure 37: READ-to-PRECHARGE .................................................................................................................. 76
Figure 38: Data Output Timing –
t
DQSQ,
t
QH, and Data Valid Window (x16) ................................................... 77
Figure 39: Data Output Timing –
t
DQSQ,
t
QH, and Data Valid Window (x32) ................................................... 78
Figure 40: Data Output Timing –
t
AC and
t
DQSCK .......................................................................................... 79
Figure 41: Data Input Timing ......................................................................................................................... 81
Figure 42: Write – DM Operation ................................................................................................................... 82
Figure 43: WRITE Burst ................................................................................................................................. 83
Figure 44: Consecutive WRITE-to-WRITE ....................................................................................................... 84
Figure 45: Nonconsecutive WRITE-to-WRITE ................................................................................................. 84
Figure 46: Random WRITE Cycles .................................................................................................................. 85
Figure 47: WRITE-to-READ – Uninterrupting ................................................................................................. 86
Figure 48: WRITE-to-READ – Interrupting ...................................................................................................... 87
Figure 49: WRITE-to-READ – Odd Number of Data, Interrupting .................................................................... 88
Figure 50: WRITE-to-PRECHARGE – Uninterrupting ...................................................................................... 89
List of Figures
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
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