SMT Power Inductors
Shielded Drum Core - P1166NL Series
Height: 3.8mm Max
Footprint: 7.5mm x 7.5mm Max
Current Rating: up to 5.5A
Inductance Range: .44µH to 750µH
Electrical Specifications @ 25°C - Operating Temperature -40°C to +130°C
Part
2, 3
Number
P1166.681NL **
P1166.102NL
P1166.162NL
P1166.302NL
P1166.482NL
P1166.682NL
P1166.103NL
P1166.123NL **
P1166.153NL **
P1166.183NL **
P1166.223NL
P1166.273NL **
P1166.333NL **
P1166.393NL **
P1166.473NL
P1166.563NL **
P1166.683NL **
P1166.823NL **
P1166.104NL
P1166.124NL **
P1166.154NL
P1166.184NL **
P1166.224NL
P1166.274NL **
P1166.334NL
P1166.394NL **
P1166.474NL **
P1166.564NL **
P1166.684NL **
P1166.824NL
P1166.105NL
Inductance
@ 0A
DC
(μH
±20%)
0.68*
1.00*
1.60*
3.00*
4.80*
6.80*
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
Inductance
@ Irated
(μH) MIN
0.44
0.65
1.0
2.0
3.1
4.4
7.5
9.0
11.3
13.5
16.5
20.3
24.8
29.3
35.3
42.0
51.0
61.5
75.0
90.0
113
135
165
203
248
293
353
420
510
615
750
DCR
(mΩ)
Irated
5
(A
DC
)
5.5
4.9
4.0
2.8
2.4
2.1
1.6
1.5
1.4
1.2
1.2
1.0
0.94
0.86
0.83
0.73
0.67
0.60
0.56
0.53
0.46
0.39
0.35
0.32
0.31
0.26
0.25
0.23
0.20
0.17
0.15
TYP
5.0
6.2
7.8
19
25
32
58
62
74
100
106
146
167
183
206
271
303
411
464
528
695
992
1210
1407
1580
2178
2400
2705
3658
5021
6720
MAX
6.0
7.5
11
23
31
40
70
78
92
124
126
180
205
211
260
340
370
500
580
645
860
1190
1480
1750
1880
2600
2910
3400
4450
6200
8000
Saturation
6
Current
-25% (A)
5.9
5.2
4.0
3.0
2.4
2.1
1.8
1.7
1.5
1.4
1.2
1.1
1.0
0.86
0.83
0.73
0.67
0.61
0.56
0.55
0.46
0.42
0.37
0.32
0.31
0.29
0.26
0.23
0.21
0.20
0.16
Heating
7
Current
+40°C (A)
5.5
4.9
4.4
2.8
2.5
2.2
1.6
1.5
1.4
1.2
1.2
1.0
0.94
0.90
0.85
0.74
0.70
0.60
0.57
0.53
0.46
0.39
0.35
0.33
0.31
0.26
0.25
0.23
0.20
0.17
0.15
Core Loss
8
Factor
(K2)
380
440
570
780
990
1200
1400
1500
1700
1800
2000
2300
2400
2700
2900
3300
3600
4000
4300
4700
5300
5800
6400
7100
7800
8500
9500
10000
11000
13000
14000
SRF
(MHz)
>40
>40
>40
>40
>40
38
29
25
22
21
20
17
15
13
12
11
9.5
8.0
7.5
7.0
6.3
5.6
5.1
4.6
4.1
3.9
3.6
3.1
2.7
2.5
1.3
*
Inductance is at 0A
DC
tolerance on indicated part numbers is
±30%;
tolerance is
±20%
on all other parts.
** Contact Pulse for availability
34
power.pulseelectronics.com
NOTES FROM TABLE:
(See page 43)
http://www.power.pulseelectronics.com/contact
SMP2007 (07/17)
SMT Power Inductors
Shielded Drum Core - P1166NL Series
Mechanical
P1166.XXXNL
Schematic
Weight
.....................0.7 grams
Tape & Reel
..............1200/reel
Dimensions:
Inches
mm
Unless otherwise specified,
all tolerances are
±
.010
0,25
Notes from Tables:
(pages 27 - 42)
1. Unless otherwise specified, all testing is made at 100kHz, 0.1VAC.
2. Optional Tape & Reel packaging can be ordered by adding a “T”
suffix to the part number (i.e P1166.102NL becomes P1166.102NLT).
Pulse complies with industry standard Tape and Tape & Reel
specification EIA481.
3. The “NL” suffix indicates an RoHS-compliant part numer. Non-NL
suffixed parts are not necessarily RoHS compliant, but are electrically
and mechanically equivalent to NL versions. If a part number does not
have the “NL” version, but an RoHS compliant version is required, please
contact Pulse for availability.
4. Temperature of the component (ambient plus temperature rise) must be
within specified operating temperature range.
5. The rated current (Irated) as listed is either the saturation current or the
heating current depending on which value is lower.
6. The saturation current, Isat, is the current at which the component inductance
drops by the indicated percentage (typical) at an ambient temperature of 25C.
This current is determined by placing the component in the specified ambient
environment and applying a short duration pulse current (to eliminate self-
heating effects) to the component.
7. The heating current, Idc, is the DC current required to raise the component
temperature by the indicated delta (approximately). The heating current is
determined by mounting the component on a typical PCB and applying
current for 30 minutes. The temperature is measured by placing the
thermocouple on top of the unit under test.
7. In high volt*time (Et) or ripple current applications, additional heating in the
component can occur due to core losses in the inductor which may necessitate
derating the current in order to limit the temperature rise of the component. In
order to determine the approximate total loss (or temperature rise) for a given
application, both copper losses and core losses should be taken into account.
Estimated Temperature Rise:
Trise = [Total loss (mW) / K0]
.833
(°C)
Total Loss = Copper loss + Core loss (mW)
Copper loss = I
RMS 2
x DCR (Typical) (mW)
Irms = [I
DC2
+
ΔI
2
/12]
1/2
(A)
Core loss = K1 x f (kHz)
1.23
x Bac (Ga)
2.38
(mW)
Bac (peak to peak flux density) = K2 x
ΔI
(Ga)
[= K2/L (μH) x Et (V-μSec) (Ga)]
where f varies between 25kHz and 1MHz, and Bac is
less than 2500 Gauss.
K2 is a core size and winding dependent value and is
given for each p/n in the proceeding datasheets. K0 &
K1 are platform and material dependant constants and
are given in the table below for each platform.
43
power.pulseelectronics.com
SMP2007 (07/17)
http://www.power.pulseelectronics.com/contact
PCB Design
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