1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Rochester Electronics |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| Maximum analog input voltage | 10 V |
| Minimum analog input voltage | -10 V |
| Maximum conversion time | 13 µs |
| Converter type | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 code | R-CDIP-T24 |
| JESD-609 code | e0 |
| Maximum linear error (EL) | 0.0122% |
| Nominal negative supply voltage | -15 V |
| Number of analog input channels | 1 |
| Number of digits | 12 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output bit code | BINARY |
| Output format | SERIAL, PARALLEL, WORD |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Sample and hold/Track and hold | SAMPLE |
| Nominal supply voltage | 15 V |
| surface mount | NO |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |

| AD5212TD | AD5214TD | AD5215BD | AD5215TD | AD5212BD | AD5214BD | |
|---|---|---|---|---|---|---|
| Description | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | ADC, Successive Approximation, | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, | DIP, | , | DIP, | DIP, | DIP, |
| Contacts | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Converter type | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| Output bit code | BINARY | BINARY | OFFSET BINARY | BINARY | BINARY | BINARY |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible | incompatible | incompatible |
| Maximum analog input voltage | 10 V | 5 V | - | 10 V | 10 V | 5 V |
| Minimum analog input voltage | -10 V | -5 V | - | -10 V | -10 V | -5 V |
| Maximum conversion time | 13 µs | 13 µs | - | 13 µs | 13 µs | 13 µs |
| JESD-30 code | R-CDIP-T24 | R-CDIP-T24 | - | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 |
| JESD-609 code | e0 | e0 | - | e0 | e0 | e0 |
| Maximum linear error (EL) | 0.0122% | 0.0122% | - | 0.0122% | 0.0122% | 0.0122% |
| Nominal negative supply voltage | -15 V | -15 V | - | -15 V | -15 V | -15 V |
| Number of analog input channels | 1 | 1 | - | 1 | 1 | 1 |
| Number of digits | 12 | 12 | - | 12 | 12 | 12 |
| Number of functions | 1 | 1 | - | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | - | 24 | 24 | 24 |
| Maximum operating temperature | 125 °C | 125 °C | - | 125 °C | 85 °C | 85 °C |
| Minimum operating temperature | -55 °C | -55 °C | - | -55 °C | -25 °C | -25 °C |
| Output format | SERIAL, PARALLEL, WORD | SERIAL, PARALLEL, WORD | - | SERIAL, PARALLEL, WORD | SERIAL, PARALLEL, WORD | SERIAL, PARALLEL, WORD |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | - | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Sample and hold/Track and hold | SAMPLE | SAMPLE | - | SAMPLE | SAMPLE | SAMPLE |
| Nominal supply voltage | 15 V | 15 V | - | 15 V | 15 V | 15 V |
| surface mount | NO | NO | - | NO | NO | NO |
| Temperature level | MILITARY | MILITARY | - | MILITARY | OTHER | OTHER |
| Terminal surface | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | - | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |