EEWORLDEEWORLDEEWORLD

Part Number

Search

ATS-01G-179-C2-R0

Description
HEATSINK 35X35X30MM R-TAB T766
CategoryThermal management products   
File Size118KB,1 Pages
ManufacturerERP
Environmental Compliance
Download Datasheet Parametric View All

ATS-01G-179-C2-R0 Overview

HEATSINK 35X35X30MM R-TAB T766

ATS-01G-179-C2-R0 Parametric

Parameter NameAttribute value
typetop installation
cooling packageClassification (BGA, LGA, CPU, ASIC...)
Joining methodPush your feet
shapesquare, fins
length1.378"(35.00mm)
width1.378"(35.00mm)
diameter-
Height from base (fin height)1.181"(30.00mm)
Power dissipation at different temperature rises-
Thermal resistance at different forced airflows3.93°C/W @ 100 LFM
Thermal resistance under natural conditions-
Materialaluminum
Material platingblue anodized
pushPIN™ Heat Sink Assembly
ATS Part#:
ATS-01G-179-C2-R0
Description:
pushPIN™ HS ASMBLY,COARSE-PITCH,STRAIGHT, HOLE PATTERN:RIGHT-TABBED,BLUE,T766
Heat Sink Type:
pushPIN™ Heat Sink Assembly
Heat Sink Attachment:
pushPIN™ / Spring Kit
Features & Benefits
»
Quick Attachment – Push pins feature a flexible barb at the end designed to
engage with pre-drilled holes in a PCB.
»
Compression Springs add the necessary force to hold the assembly together
for secure attachment. Select from over 21 different springs to achieve
precise force required.
»
Push Pin Material available in brass or plastic in 10 sizes ranging from 9-
20mm in length. Stainless steel hardware kit available for more secure
attachment. Visit www.qats.com for available options.
»
Heat Sinks Designed for All Airflow Conditions. Select from over 112 fine
pitch HS designed for high velocity air flows and 98 course pitch HS
designed for low velocity air flow conditions.
»
Pre-assembled with phase-changing material for increased thermal
performance. Double-sided thermal tape and no TIM options available to
meet application-specific requirements.
»
Lightweight, aluminum HS extruded from AL6063 provide optimal heat
transfer with a blue anodized finish.
»
All components are RoHS and REACH compliant.
»
Industry standard hole pattern. Recommended through hole size is 3.175mm
For Illustration Purposes ONLY.
Bill of Material
Heat Sink:
ATS-CPX035035030-179-C2-R0
Push Pin:
Springs:
ATS-PP-08
ATS-PPS-01
Qty
1
2
2
Thermal Performance
100
AIR VELOCITY - LFM (m/s)
(0.5)
Thermal Resistance
°C/W
Unducted Flow
Ducted Flow
3.93
2.40
200
(1.0)
2.38
1.80
300
(1.5)
1.94
1.54
400
(2.0)
1.70
1.39
500
(2.5)
1.54
1.28
600
(3.0)
1.43
1.19
700
(3.5)
1.34
1.13
Fin
Pitch
COARSE-
PITCH
Fin
Type
STRAIGHT
Hole
Pattern
RIGHT-
TABBED
Product Detail
P/N
ATS-01G-179-C2-R0
A
35
Dimensions
B
C
E
35
30
40
F
40
NOTES:
Push Pin
ATS-PP-08
Spring
ATS-PPS-01
TIM
T766
Finish
BLUE ANODIZED
1) Dimension A is the length of the heat sink in the direction of the flow.
2) Dimension B is the width of the heat sink perpendicular to the flow direction.
3) Dimension C is the heat sink height from the bottom of the base to the top of the fin
field.
4) Dimension E is the distance between holes perpendicular to the direction of flow.
5) Dimension F is the distance between holes in the direction of flow.
6) Thermal performance data are provided for reference only. Actual performance may
vary by application.
7) ATS reserves the right tp update or change its products without notice to improve the
design or performance.
8) ATS certifies that this heat sink assemby is RoHS-6 and REACH compliant.
9) Contact ATS to learn about custom options available.
For Illustration Purposes ONLY.
For further technical information, please contact Advanced Thermal Solutions, Inc.
89-27 ACCESS ROAD, NORWOOD, MA 02062 USA | T: 781.769. 2800 F: 781.769.9979 | WWW.QATS.COM R2-0917
Application of Verilog HDL Language in FPGA/CPLD Development
[b]Abstract[/b]: Through design examples, the method of using Verilog HDL language to develop FPGA/CPLD is introduced in detail, and the superiority of using Verilog HDL language is shown by comparing...
songrisi FPGA/CPLD
If you are concerned about the safety of lithium batteries and polymer batteries, please take a look
[i=s] This post was last edited by qwqwqw2088 on 2016-8-18 09:07 [/i] [font=宋体][color=black][backcolor=white] There is no need to say much about the contents of lithium-ion and lithium-polymer batteri...
qwqwqw2088 Analogue and Mixed Signal
Idle Xilinx FPGA development board
A lot of idle boards are for sale [url]http://shop117037878.taobao.com/[/url] You can go to the store to have a look [img]http://www.eeboard.com/bbs/data/attachment/forum/201604/11/023940x79fx97wx9tlc...
PENGSHIFANG Buy&Sell
uint16 and unsigned int issues
In modular programming, define a function void LedDisplay(uint16 pBuff[]) in the .c file.Then declare this function in the .h file extern void LedDisplay(uint16 pBuff[]);uint16 is defined in a header ...
wangdabo Programming Basics
Wince ocx control registration problem
I used EVC4.0 to build an Active X project without adding any code. On the wince5.0 simulator, I copied the regsvrce and .ocx files in the x86 directory to the /windows directory. I ran regsvrce xxx.o...
lyn689 Embedded System
How to use bootm to boot kernel under U-BOOT
Note: u-boot is marked with: http://www.hhcn.com/cgi-bin/topic.cgi?forum=3&topic=651&show=0 u-boot-1.1.3 generated by the patch provided by keety Recently, people have been asking me about the problem...
绿茶 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 469  147  715  150  1088  10  3  15  4  22 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号