DIP632-001BLF datasheet, PDF - EEWORLD Datasheet

DIP632-001BLF: DescriptionCONN IC DIP SOCKET 32POS GOLD; CategoryThe connector; File Size102KB，1 Pages; ManufacturerAmphenol; Websitehttp://www.amphenol.com/; Environmental Compliance

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DIP632-001BLF Overview

CONN IC DIP SOCKET 32POS GOLD

Parameter Name	Attribute value
type	DIP, 0.6" (15.24mm) line spacing
Number of pins or pins (grid)	32（2 x 16）
Spacing - Mating	0.100"（2.54mm）
Contact surface treatment - mating	gold
Contact Surface Treatment Thickness - Mating	30.0µin（0.76µm）
Contact Material - Mating	copper beryllium
Installation type	Through hole
characteristic	open framework
Termination	welding
spacing-column	0.100"（2.54mm）
Contact Surface Preparation - Column	tin
Contact Surface Treatment Thickness - Column	200.0µin（5.08µm）
Contact Material - Pillar	brass
Shell material	Polydimethylcyclohexyl terephthalate (PCT), polyester, glass fiber reinforced
Operating temperature	-
Termination post length	0.125"（3.18mm）
Material flammability rating	UL94 V-0
Contact resistance	-

PDM: Rev:F

STATUS:

Released

Printed: Sep 28, 2009

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