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DIP324-001BLF

Description
CONN IC DIP SOCKET 24POS GOLD
CategoryThe connector   
File Size102KB,1 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
Environmental Compliance
Download Datasheet Parametric View All

DIP324-001BLF Overview

CONN IC DIP SOCKET 24POS GOLD

DIP324-001BLF Parametric

Parameter NameAttribute value
typeDIP, 0.3" (7.62mm) line spacing
Number of pins or pins (grid)24(2 x 12)
Spacing - Mating0.100"(2.54mm)
Contact surface treatment - matinggold
Contact Surface Treatment Thickness - Mating30.0µin(0.76µm)
Contact Material - Matingcopper beryllium
Installation typeThrough hole
characteristicopen framework
Terminationwelding
spacing-column0.100"(2.54mm)
Contact Surface Preparation - Columntin
Contact Surface Treatment Thickness - Column200.0µin(5.08µm)
Contact Material - Pillarbrass
Shell materialPolydimethylcyclohexyl terephthalate (PCT), polyester, glass fiber reinforced
Operating temperature-
Termination post length0.125"(3.18mm)
Material flammability ratingUL94 V-0
Contact resistance-
PDM: Rev:F
STATUS:
Released
Printed: Sep 28, 2009
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