MLX75023 Time-of-Flight Sensor Array
Product Datasheet
Features & Benefits
1/3” optical Time-of-Flight sensor
(optical area = 4.8 x 3.6 mm
2
)
QVGA resolution, 320 x 240 pixels
15 x 15 µm DepthSense® pixels
Demodulation frequency up to 40 MHz
Two dual channel analog outputs
Typ. 0.15 A/W pixel responsivity
< 600 raw correlation frames per second
(typ. settings : 25 MS/s, Tint = 130 µs)
Typical system background light robustness
according to Table 1
Integrated optical filter
(min.80% transmission in range 800-900nm)
Ambient operating temperature ranges
of
-20
+85°C and -40 +105°C
Wafer level glass BGA package
(Dimensions : 6.6 x 5.5 x 0.6 mm)
AEC-Q100 qualification available!
Description
MLX75023 is a fully integrated optical time-of-flight
(TOF) camera sensor. Potential use cases include
gesture recognition, automotive driver monitoring,
surveillance & people counting, robot vision & more.
The sensor features 320 x 240 (QVGA) time-of-flight
pixels based on DepthSense® pixel technology. This
unique design allows up to 120 klux background light
rejection in typical application conditions. The
sensor features high-speed analog signal outputs
which enable a raw frame rate of up to 600 frames
per second. The sensor offers maximum
compatibility with MLX75123, Melexis’ dedicated
TOF companion chip. Combined with a modulated
light source, a system is capable of measuring
distance and reflectivity at full resolution. The
sensor is available in automotive and industrial
grades, both in a small glass BGA wafer level
package form factor which offers many integration
possibilities.
Figure 1: MLX75023
Illumination
LED
Laser
Modulation
Frequency
20 MHz
20 MHz
QVGA
Mode
> 40 klux
> 60 klux
QQVGA
Binning Mode
> 120 klux
> 120 klux
Table 1: Typical TOF system background light robustness
MLX75023 Time-of-Flight Sensor Array
Product Datasheet
Contents
Features & Benefits ................................................................................................................................... 1
Description ................................................................................................................................................ 1
1. Datasheet Changelog............................................................................................................................. 4
2. Ordering Information ............................................................................................................................ 5
3. Application System Architecture............................................................................................................ 6
4. Pinout Description ................................................................................................................................. 7
5. Typical Connection Diagram .................................................................................................................. 8
6. Electrical Characteristics ........................................................................................................................ 9
6.1. Absolute Maximum Ratings
2
.............................................................................................................. 9
6.2. Electrical Operating Conditions........................................................................................................ 10
6.3. Digital IO Characteristics .................................................................................................................. 10
6.4. Dynamic Characteristics ................................................................................................................... 11
6.5. ArrayBias ........................................................................................................................................... 11
6.6. Sensor Physical Characteristics ........................................................................................................ 11
6.7. Optical & TOF Characteristics........................................................................................................... 12
7. Interface .............................................................................................................................................. 13
7.1. Timing Diagram ................................................................................................................................. 13
7.1.1. Power Up ..................................................................................................................................... 13
7.1.2. Reset ............................................................................................................................................ 13
7.1.3. Integration................................................................................................................................... 14
7.1.4. Read-out ...................................................................................................................................... 14
7.2. Device Control ................................................................................................................................... 15
7.3. Test Column Specification ................................................................................................................ 16
7.4. Test Row Specification ...................................................................................................................... 17
8. Noise Considerations ........................................................................................................................... 18
9. Package ............................................................................................................................................... 19
9.1. Mechanical Dimensions & Cover Tape Specifications .................................................................... 19
9.2. Package Marking ............................................................................................................................... 19
9.3. Thermal Resistance ........................................................................................................................... 20
9.4. Optical Filter ...................................................................................................................................... 20
9.5. Shipping & Handling ......................................................................................................................... 21
9.6. PCB Footprint Recommendations .................................................................................................... 22
9.7. PCB Trace Layout Recommendation................................................................................................ 23
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MLX75023 Time-of-Flight Sensor Array
Product Datasheet
9.8. Sensor Reflow Profile ........................................................................................................................ 23
10. Depth & Confidence Calculation ........................................................................................................ 24
10.1. Correlation Measurement .............................................................................................................. 24
10.2. Active Illumination .......................................................................................................................... 25
10.3. Depth and Confidence Calculation ................................................................................................ 26
11. Reliability ........................................................................................................................................... 26
11.1. Board Level Reliability .................................................................................................................... 26
Disclaimer................................................................................................................................................ 27
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MLX75023 Time-of-Flight Sensor Array
Product Datasheet
1. Datasheet Changelog
Version
1.1 - 1.13
1.14
Date
2014-2016
17.1.2017
Changes
Internal release(s)
Document updated to the new Melexis template
Added industrial product variant with code S
Add chief ray angle and bad pixel count limit and definition
Added test row and test column specifications
Updated electrical specifications
Other miscellaneous, minor improvements
BAB-00x variants recommended for new designs in section 2
Renamed CRA to max. light acceptance angle in section 6.7
Added relative sensitivity in function of incident light angle graph in section 6.7
Updated ArrayBias description in section 6.5
Added Package Marking Information in section 9.2
1.15
18.4.2018
Table 2: Changelog
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MLX75023 Time-of-Flight Sensor Array
Product Datasheet
2. Ordering Information
Product
MLX75023
MLX75023
MLX75023
MLX75023
MLX75023
MLX75023
MLX75023
MLX75023
Temperature Code
R
R
S
S
R
R
S
S
Package
TF
TF
TF
TF
TF
TF
TF
TF
Option Code
BAA-000
BAA-001
BAA-000
BAA-001
BAB-000
BAB-001
BAB-000
BAB-001
1
1
1
1
Packing Form
TR
TR
TR
TR
TR
TR
TR
TR
Table 3: Product ordering code(s)
Note : Recommended for new designs
1
Legend:
Temperature Code
(see section 11)
Package Code
Option Code
R : -40°C to 105°C
S : -20°C to 85°C
TF : Glass BGA Package, 44pins
BAx-000 : without cover tape
BAx-001 : with cover tape (see section 9.1)
BAA-00x : not recommended for new designs
BAB-00x : default product configuration
Packing Form
Ordering Example
TR : Tray
MLX75023RTF-BAB-001-TR
Table 4: Option code(s)
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