CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
2. Maximum power dissipation, including load conditions, must be designed to maintain the maximum junction temperature below +175°C for the
can packages, and below +150°C for the plastic packages.
3. For
JA
is measured with the component mounted on an evaluation PC board in free air.
4. ForJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
PARAMETER
INPUT CHARACTERISTICS
Offset Voltage
Average Offset Voltage Drift
Bias Current
Input Resistance
Input Noise Voltage
TRANSFER CHARACTERISTICS
Voltage Gain
(V
OUT
=
10V)
V
SUPPLY
=
12V
to
15V,
R
S
= 50, R
L
= 1k C
L
= 10pF, Unless Otherwise Specified
TEST
CONDITIONS
TEMP
(°C)
25
Full
Full
25
Full
Full
10Hz-1MHz
R
L
= 50
R
L
= 100
R
L
= 1k
R
L
= 1k
25
25
25
25
Full
25
25
R
L
= 100
R
L
= 1k, V
S
=
15V
R
L
= 1k, V
S
=
12V
25
Full
Full
25
Full
V
IN
= 1V
RMS
, f = 10kHz
25
25
25
25
25
25
To 0.1%
R
L
= 500
R
L
= 500
25
25
25
HA-5002-2
MIN
-
-
-
-
-
1.5
-
-
-
-
0.980
-
-
10
10
10
-
-
-
-
-
-
-
1.0
-
-
-
TYP
5
10
30
2
3.4
3
18
0.900
0.971
0.995
-
110
40
10.7
13.5
10.5
220
3
<0.005
20.7
3.6
2
30
1.3
50
0.06
0.22
MAX
20
30
-
7
10
-
-
-
-
-
-
-
-
-
-
-
-
10
-
-
-
-
-
-
-
-
-
MIN
-
-
-
-
-
1.5
-
-
-
-
0.980
-
-
10
10
10
-
-
-
-
-
-
-
1.0
-
-
-
HA-5002-5, -9
TYP
5
10
30
2
2.4
3
18
0.900
0.971
0.995
-
110
40
11.2
13.9
10.5
220
3
<0.005
20.7
3.6
2
30
1.3
50
0.06
0.22
MAX
20
30
-
7
10
-
-
-
-
-
-
-
-
-
-
-
-
10
-
-
-
-
-
-
-
-
-
UNITS
mV
mV
V/°C
A
A
M
V
P-P
V/V
V/V
V/V
V/V
MHz
A/mA
V
V
V
mA
%
MHz
ns
ns
%
V/ns
ns
%
°
-3dB Bandwidth
AC Current Gain
OUTPUT CHARACTERISTICS
Output Voltage Swing
V
IN
= 1V
P-P
Output Current
Output Resistance
Harmonic Distortion
TRANSIENT RESPONSE
Full Power Bandwidth (Note 5)
Rise Time
Propagation Delay
Overshoot
Slew Rate
Settling Time
Differential Gain
Differential Phase
V
IN
=
10V,
R
L
= 40
FN2921 Rev 12.00
October 18, 2013
Page 3 of 12
HA-5002
Electrical Specifications
PARAMETER
POWER REQUIREMENTS
Supply Current
Power Supply Rejection Ratio
NOTE:
Slew Rate
5.
FPBW
= --------------------------
; V = 10V
-
2V P
EAK
P
A
V
= 10V
25
Full
Full
-
-
54
8.3
-
64
-
10
-
-
-
54
8.3
-
64
-
10
-
mA
mA
dB
V
SUPPLY
=
12V
to
15V,
R
S
= 50, R
L
= 1k C
L
= 10pF, Unless Otherwise Specified
(Continued)
TEST
CONDITIONS
TEMP
(°C)
HA-5002-2
MIN
TYP
MAX
MIN
HA-5002-5, -9
TYP
MAX
UNITS
Test Circuit and Waveforms
+15V
R
S
IN
V
1
-
-15V
V
2
-
V
1
+
V
2
+
OUT
R
L
FIGURE 1. LARGE AND SMALL SIGNAL RESPONSE
V
IN
V
IN
V
OUT
V
OUT
R
S
= 50, R
L
= 100
SMALL SIGNAL WAVEFORMS
R
S
= 50, R
L
= 1k
SMALL SIGNAL WAVEFORMS
V
IN
V
IN
V
OUT
V
OUT
R
S
= 50, R
L
= 100
LARGE SIGNAL WAVEFORMS
R
S
= 50, R
L
= 1k
LARGE SIGNAL WAVEFORMS
FN2921 Rev 12.00
October 18, 2013
Page 4 of 12
HA-5002
Schematic Diagram
V
1
+
R
8
Q
19
Q
25
R
10
Q
9
Q
10
R
5
Q
21
Q
11
Q
15
Q
23
IN
Q
7
Q
4
Q
27
Q
26
Q
20
Q
18
R
4
Q
3
Q
6
R
11
OUT
R
N2
Q
5
Q
22
Q
8
Q
24
Q
16
R
12
Q
17
R
6
Q
14
R
3
V
1
-
R
2
V
2
-
Q
13
R
N3
Q
2
R
1
Q
12
Q
1
R
9
R
N1
V
2
+
R
7
Application Information
Layout Considerations
The wide bandwidth of the HA-5002 necessitates that high
frequency circuit layout procedures be followed. Failure to
follow these guidelines can result in marginal performance.
Probably the most crucial of the RF/video layout rules is the
use of a ground plane. A ground plane provides isolation and
minimizes distributed circuit capacitance and inductance which
will degrade high frequency performance.
Other considerations are proper power supply bypassing and
keeping the input and output connections as short as possible
which minimizes distributed capacitance and reduces board
space.
Short Circuit Protection
The output current can be limited by using the following circuit:
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RF/Wirelessly
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