(Note1) In the case of mounting 4 layer glass epoxy base-plate of 70mm×70mm×1.6mm, 37.6mW is reduced at 1°C above Ta=25°C.
(Note2) Wide VF variation of LED increases loss at the driver, which results in rise in package temperature. Therefore, the board needs to be designed
with attention paid to heat radiation.
(Note3) This current value is per 1ch. It needs be used within a range not exceeding Pd.
Caution:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the
absolute maximum ratings.
1.7 Thermal Resistance
(Note 1)
Parameter
HTSSOP-B40
Junction to Ambient
Junction to Top Characterization Parameter
(Note 2)
Symbo
l
θ
JA
Ψ
JT
Thermal Resistance (Typ)
1
層基板
(Note 3)
99.8
5
4
層基板
(Note 4)
26.0
2
Unit
°C/W
°C/W
(Note 1)Based on JESD51-2A(Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
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