MT48H16M32LFCM-75:B TR datasheet, PDF

Datasheet> All Categories > storage> MT48H16M32LFCM-75:B TR

MT48H16M32LFCM-75:B TR: DescriptionIC DRAM 512M PARALLEL 90VFBGA; Categorystorage; File Size2MB，86 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

Download Datasheet Parametric View All

MT48H16M32LFCM-75:B TR Overview

IC DRAM 512M PARALLEL 90VFBGA

MT48H16M32LFCM-75:B TR Parametric

Parameter Name	Attribute value
memory type	Volatile
memory format	DRAM
technology	SDRAM - Mobile LPSDR
storage	512Mb （16M x 32）
Clock frequency	133MHz
Write cycle time - words, pages	15ns
interview time	5.4ns
memory interface	in parallel
Voltage - Power	1.7 V ~ 1.95 V
Operating temperature	0°C ~ 70°C（TA）
Installation type	surface mount
Package/casing	90-VFBGA
Supplier device packaging	90-VFBGA（10x13）

Preview

Download Datasheet

View All

512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM

Features

Mobile Low-Power SDR SDRAM

MT48H32M16LF – 8 Meg x 16 x 4 banks

MT48H16M32LF/LG – 4 Meg x 32 x 4 banks

Features

•

DDQ

= 1.7–1.95V

•

Fully synchronous; all signals registered on positive

edge of system clock

•

Internal, pipelined operation; column address can

be changed every clock cycle

•

Four internal banks for concurrent operation

•

Programmable burst lengths: 1, 2, 4, 8, and continu-

ous

•

Auto precharge, includes concurrent auto precharge

•

Auto refresh and self refresh modes

•

LVTTL-compatible inputs and outputs

•

On-chip temperature sensor to control self refresh

rate

•

Partial-array self refresh (PASR)

•

Deep power-down (DPD)

•

Selectable output drive strength (DS)

•

64ms refresh period

•

DDQ

: 1.8V/1.8V

•

Addressing

–

Standard addressing option

–

Reduced page-size option

•

Configuration

–

32 Meg x 16 (8 Meg x 16 x 4 banks)

–

16 Meg x 32 (4 Meg x 32 x 4 banks)

•

Plastic “green” packages

–

54-ball VFBGA (8mm x 9mm)

–

90-ball VFBGA (10mm x 13mm)

•

Timing – cycle time

–

6ns at CL = 3

–

7.5ns at CL = 3

•

Power

–

Standard I

DD2

DD7

–

Low-power I

DD2

DD71

•

Operating temperature range

–

Commercial (0˚C to +70˚C)

–

Industrial (–40˚C to +85˚C)

•

Revision

Notes:

Options

Marking

32M16

16M32

-6

-75

None

1. Contact factory for availability.

2. Available only for x16 configuration.

3. Available only for x32 configuration.

Table 1: Configuration Addressing

Architecture

Number of banks

Bank address balls

Row address balls

Column address balls

Note: 1. Contact factory for availability

32 Meg x 16

BA0, BA1

A[12:0]

A[9:0]

16 Meg x 32

BA0, BA1

A[12:0]

A[8:0]

16 Meg x 32 Reduced

Page-Size Option

BA0, BA1

A[13:0]

A[7:0]

Table 2: Key Timing Parameters

Clock Rate (MHz)

Speed Grade

-6

Note:

CL = 2

104

CL = 3

166

133

CL = 2

8ns

Access Time

CL = 3

5ns

5.4ns

-75

104

1. CL = CAS (READ) latency

PDF: 09005aef82ea3742

512mb_mobile_sdram_y47m.pdf – Rev. H 12/09 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM

General Description ......................................................................................................................................... 8

Functional Block Diagram ................................................................................................................................ 9

Ball Assignments and Descriptions ................................................................................................................. 10

Package Dimensions ...................................................................................................................................... 13

Electrical Specifications .................................................................................................................................. 15

Absolute Maximum Ratings ........................................................................................................................ 15

Electrical Specifications – I

Parameters ........................................................................................................ 17

Electrical Specifications – AC Operating Conditions ......................................................................................... 20

Output Drive Characteristics ........................................................................................................................... 23

Functional Description ................................................................................................................................... 26

Commands .................................................................................................................................................... 27

COMMAND INHIBIT .................................................................................................................................. 28

NO OPERATION (NOP) .............................................................................................................................. 28

LOAD MODE REGISTER (LMR) ................................................................................................................... 28

ACTIVE ...................................................................................................................................................... 28

READ ......................................................................................................................................................... 29

WRITE ....................................................................................................................................................... 30

PRECHARGE .............................................................................................................................................. 31

BURST TERMINATE ................................................................................................................................... 31

AUTO REFRESH ......................................................................................................................................... 31

SELF REFRESH ........................................................................................................................................... 32

DEEP POWER-DOWN ................................................................................................................................ 32

Truth Tables ................................................................................................................................................... 33

Initialization .................................................................................................................................................. 38

Mode Register ................................................................................................................................................ 40

Burst Length .............................................................................................................................................. 41

Burst Type ................................................................................................................................................. 41

CAS Latency ............................................................................................................................................... 43

Operating Mode ......................................................................................................................................... 43

Write Burst Mode ....................................................................................................................................... 43

Extended Mode Register ................................................................................................................................. 44

Temperature-Compensated Self Refresh ..................................................................................................... 44

Partial-Array Self Refresh ............................................................................................................................ 45

Output Drive Strength ................................................................................................................................ 45

Bank/Row Activation ...................................................................................................................................... 46

READ Operation ............................................................................................................................................. 47

WRITE Operation ........................................................................................................................................... 56

Burst Read/Single Write .............................................................................................................................. 63

PRECHARGE Operation .................................................................................................................................. 64

Auto Precharge ........................................................................................................................................... 64

AUTO REFRESH Operation ............................................................................................................................. 76

SELF REFRESH Operation .............................................................................................................................. 78

Power-Down .................................................................................................................................................. 80

Deep Power-Down ......................................................................................................................................... 81

Clock Suspend ............................................................................................................................................... 82

Revision History ............................................................................................................................................. 85

Rev. H, Production – 12/09 .......................................................................................................................... 85

Rev. G, Production – 8/09 ............................................................................................................................ 85

Rev. F, Production – 4/09 ............................................................................................................................ 85

Rev. E, Production – 3/09 ............................................................................................................................ 85

Contents

PDF: 09005aef82ea3742

512mb_mobile_sdram_y47m.pdf – Rev. H 12/09 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM

Table 1: Configuration Addressing ................................................................................................................... 1

Table 2: Key Timing Parameters ...................................................................................................................... 1

Table 3: VFBGA Ball Descriptions .................................................................................................................. 12

Table 4: Absolute Maximum Ratings .............................................................................................................. 15

Table 5: DC Electrical Characteristics and Operating Conditions ..................................................................... 15

Table 6: Capacitance ..................................................................................................................................... 16

Table 7: I

Specifications and Conditions (x16) ............................................................................................ 17

Table 8: I

Specifications and Conditions (x32) ............................................................................................ 17

Table 9: I

DD7

Specifications and Conditions (x16 and x32) ............................................................................... 18

Table 10: Electrical Characteristics and Recommended AC Operating Conditions ............................................ 20

Table 11: AC Functional Characteristics ......................................................................................................... 21

Table 12: Target Output Drive Characteristics (Full Strength) .......................................................................... 23

Table 13: Target Output Drive Characteristics (Three-Quarter Strength) .......................................................... 24

Table 14: Target Output Drive Characteristics (One-Half Strength) ................................................................. 25

Table 15: Truth Table – Commands and DQM Operation ................................................................................ 27

Table 16: Truth Table – Current State Bank

Command to Bank

................................................................. 33

Table 17: Truth Table – Current State Bank n, Command to Bank

................................................................ 35

Table 18: Truth Table – CKE .......................................................................................................................... 37

Table 19: Burst Definition Table .................................................................................................................... 42

List of Tables

PDF: 09005aef82ea3742

512mb_mobile_sdram_y47m.pdf – Rev. H 12/09 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Recommended Resources

The ammeter is connected to circuit b through the current transformer

Using a constant current source to complete the level shift circuit diagram

Right leg driven electrocardiogram amplification circuit

One-way motor proportional drive circuit

Attach musical time signal circuit diagram to electronic watch

Constant current source using operational amplifier TAA861

【CN0171】Low noise, low distortion single-ended input driver circuit for differential input intermediate frequency sampling ADC: CIRCUIT FUNCTION AND BENEFITSThe circuit shown in Figure 1 uses the ADL5535/ADL5536 single-ended intermediate frequency (IF) low noise 50 Ω gain block to drive the AD9268 16-bit differential input ana...; EEWORLD社区 ADI Reference Circuit

The DS12C887 clock 12864 LCD seconds can only jump for 1 second and then stop: ;P3^6; //LCD read/write control sbit LCDEN = ; P3 ^ 4 ; // LCD enable control sbit LCDPSB = ; P3^ 7; //serial/parallel control sbit wela = ;P2^6; sbit dula = ;P2^7; sbit dddd=P2^ 5 ; sbit dscs=P2^0; s...; eeleader-mcu MCU

Problems with Lingte's buck-boost chip LTC1517ES5-3.3: Problems with Lingte's buck-boost chip LTC1517ES5-3.3I want to know clearly at what V the battery voltage LTC1517ES5-3.3 (Linte/ADI buck-boost chip) starts to boost to 3.3V or buck toWhich 3.3V has be...; QWE4562009 Power technology

The stepping program cannot be stopped?: #include#define uint unsigned int #define uchar unsigned char uchar code FFW[]={ 0x01,0x03,0x02,0x06,0x04,0x0c,0x08,0x09 }; sbit K1 = P3^0;//Start button sbit K3 = P3^2; //Stop button void DelayMS(uin...; wrlsohu MCU

The eeworld forum is not well done! It makes people very unhappy! I hope the designer will work harder!: The download interface popped up, I clicked cancel, and the second time it said that the points were not enough! What the hell, this is garbage...; icad Embedded System

28335flash initialization problem: When I am debugging 28335, why does the board not work properly if I place the InitFlash() function before the MemCopy(&RamfuncsLoadStart, &RamfuncsLoadEnd, &RamfuncsRunStart) function? Why must I pla...; YWE Microcontroller MCU

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components