DATASHEET
ISL8216M
Complete High Voltage 80V, 4A DC/DC Power Module
The ISL8216M is a simple and easy to use, high voltage DC/DC
module and is ideal for a wide variety of applications. It
eliminates design and manufacturing risks while dramatically
improving time to market.
The simplicity is in the "Off-The-Shelf" unassisted
implementation. All you need is the ISL8216M, input and
output capacitors, and one resistor to program the output
voltage and you have a complete high voltage power design
ready for the market.
The ISL8216M is packaged in a thermally enhanced, compact
(15mm×15mm×3.6mm) over-molded High-Density Array
(HDA) Package, which permits full load operation without heat
sink or fans. The package is suitable for automated assembly
by standard surface mount equipment. The small amount of
external components reduce the PCB to a component layer
and a simple ground layer.
FN8607
Rev 2.00
May 9, 2014
Features
• Complete switch mode power supply in one package
• Wide input voltage range: 10V to 80V
• Output current 4A
• Programmable soft-start
• Compliant with EN 55022 Class B (see
AN1907)
• SYNC and adjustable frequency 200kHz to 600kHz
• Single resistor sets V
OUT
+2.5V up to +30V
• Setpoint accuracy ±1.5%
• Programmable overcurrent protection
• RoHS compliant with exemption
• Small footprint, low profile (15mm×15mm×3.6mm)
Related Literature
•
AN1907
“ISL8216MEVAL1Z Evaluation Board User’s Guide”
Applications
• Servers
• 48V telecom and datacom applications
• 12V and 42V automotive and industrial equipment
• Distributed power converters and point-of-load (POL)
regulation
• General purpose step-down DC/DC
16V TO 80V
VIN
2.2µF×4
VIN
VDD
VOUT
PCOMPX
12V @ 4A
VOUT
22µF×6
C
SS
0.1µF
ENSS
PVCC
ISL8216M
SYNC
FB
R
FB
1.24k
10µF
SGND
PGND
3.6mm
15m
m
m
15m
NOTE: ALL PINS NOT SHOWN ARE FLOATING
FIGURE 1. TYPICAL APPLICATION CIRCUIT
FIGURE 2. SMALL FOOTPRINT PACKAGE WITH LOW PROFILE (3.6mm)
FN8607 Rev 2.00
May 9, 2014
Page 1 of 29
ISL8216M
Table of Contents
Internal Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended Operating Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Efficiency Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Transient Response Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Start-Up Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Short Circuit Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Programming the Output Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Enable/Soft-Start. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Oscillator and Frequency Synchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Overcurrent Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Resistor Between BOOT and V
IN
for Charging The Bootstrap Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power-Good . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Capacitor Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Capacitor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Considerations and Current Derating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
11
11
12
13
14
14
14
15
15
15
Typical Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Power Loss Curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Derating Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Layout Guide. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Package Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
PCB Layout Pattern Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Vias. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stencil Pattern Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reflow Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
22
22
22
23
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
About Intersil . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
FN8607 Rev 2.00
May 9, 2014
Page 2 of 29
ISL8216M
Internal Block Diagram
PGOOD
SYNC
VDD
PVCC
PGND
OCSET
RT/CT
OSCILLATOR
INTERNAL
REGULATOR
VIN
SOFT- START
AND FAULT
LOGIC
UGATE
SGND
-
BOOT
ENSS
+
COMP
PWM
ZCOMP
-
FB
+
GM
GATE CONTROL
LOGIC
PHASE
INTERNAL
REFERENCE
D1
ZCOMP
VOUT
5.6µH
D1
PGND
PCOMX
CONTROLLER
VOUT
Ordering Information
PART NUMBER
(Notes
1, 2, 3)
ISL8216MIRZ
ISL8216MEVAL1Z
NOTES:
1. Add “-T*” suffix for tape and reel. Please refer to
TB347
for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate -
e4 termination finish, which is RoHS compliant by EU exemption 7C-I and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-
free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020
3. For Moisture Sensitivity Level (MSL), please see product information page for
ISL8216M.
For more information on MSL, please see tech brief
TB363
ISL8216M
Evaluation Board
PART
MARKING
TEMP RANGE
(°C)
-40 to +85
PACKAGE
(RoHS Compliant)
22 Ld HDA
PKG.
DWG. #
Y22.15x15
FN8607 Rev 2.00
May 9, 2014
Page 3 of 29
ISL8216M
Pin Configuration
ISL8216M
(22 LD HDA)
TOP VIEW
UGATE
ENSS
PGND
PAD2
VIN
OCSET
PGND
SYNC
PVCC
BOOT
PAD5
PGND
RTCT
1
SGND
FB
FB
COMP
PGOOD
PCOMPX
2
3
4
5
6
VDD
7
8
9
10 11 12 13 14
A
B
C
D
E
F
RTCT
PAD1
SGND
PAD3
VOUT
PAD4
PHASE
FN8607 Rev 2.00
May 9, 2014
Page 4 of 29
ISL8216M
Pin Descriptions
PIN
NUMBER
A1
A3, B3
PIN
NAME
SGND
RTCT
TYPE
I
PIN DESCRIPTION
Frequency setting pin.
This pin sets the frequency of the sawtooth oscillator. The module has a resistor and a capacitor
internally, which set the default frequency to 300kHz. Connect an external resistor to VIN and an external capacitor to SGND
to change the frequency of the sawtooth oscillator. See
“Oscillator and Frequency Synchronization” on page 12.
Range: 0V to
V
IN
.
Signal synchronization.
The switching frequency can be synchronized to an external clock through this pin. When the sync
function is not used, this pin must be tied to ground. If the sync function is used, the RTCT natural frequency must be set to a
frequency lower than the sync input frequency. See
“Oscillator and Frequency Synchronization” on page 12.
Range: 0V to 5V.
PWR
Control signal ground.
All voltage levels are measured with respect to this pin.
A5
SYNC
I
A7
A8
A11, F8
A12
A14
B1, C1
C11
VDD
OCSET
PGND
PVCC
UGATE
FB
BOOT
PWR
Power connection for the internal controller.
Tie to VIN directly. A decoupling ceramic capacitor between this pin and
signal ground (SGND) is optional.
I
Current limit sensing pin.
The current limit can be reduced by placing a resistor, R
OCSET_EX
, between this pin and VIN. See
“Overcurrent Protection” on page 13.
Range: 0V to V
IN
.
PWR
Power ground.
These pins provides the power ground to the internal controller IC. Tie these pins to the power ground plane
through the lowest impedance connection. These pins are not internally connected to PAD5.
PWR
Internal linear regulator output.
Typical: 11V.
-
I
Test pin.
This pin must be floating. Avoid routing any trace close to this pin, as voltage on this pin can be as high as 100V.
Feedback pin.
Output voltage is set by an external resistor between FB to SGND. Refer to
Equation 1
and
Table 1
on page 10.
Typical: 1.2V
PWR
Floating bootstrap supply pin for the MOSFET gate driver.
The module has a bootstrap diode and a bootstrap capacitor
internally. This pin can be used to provide an additional current path for charging the internal bootstrap capacitor; the charging
current is derived from VIN through a resistor. See
Figure 23, on page 14.
Range: 0V to 92V.
I/O
Error amplifier output.
This pin is connected to the output of the transconductance error amplifier and may be used to
compensate the feedback loop. Range: 0V to 12V.
O
Power good.
Provides a power good status. An open drain output is asserted when the voltage at the FB pins is within ±14%
of the reference voltage. See
“Power-Good” on page 14.
Range: 0V to 12V.
D1
E1
E14
COMP
PGOOD
ENSS
I/O
Enable and soft-start pin.
This pin provides enable/disable functionality and soft-start timing functionality for the PWM
output. Connect a capacitor to SGND to set the soft-start time. See
“Enable/Soft-Start” on page 11.
The module is disabled
when this pin is held below 0.5V. To use this pin as an enable control pin, connect to a device with open drain output, or
alternatively to an external enable control circuit, as shown in
Figure 18.
Range: 0V to 5V.
I
Compensation adjustment pin.
Short this pin to VOUT if the output capacitors are all ceramic capacitors. Connect a lower
than 1kΩ resistor to VOUT if the output capacitors are tantalum capacitors, polymer capacitors, or aluminum electrolytic
capacitors. Range: 1.2V to 30V.
F1
PCOMPX
PAD1
PAD2
PAD3
SGND
VIN
VOUT
PWR
Signal ground of the internal controller.
All voltage levels are measured with respect to this pad. This pad is electrically
isolated. Connect this pad to the signal ground plane using multiple vias for a robust thermal conduction path.
PWR
Power input pin.
Apply input voltage between VIN and PGND (PAD5). It is recommended to place an input decoupling capacitor
directly between VIN pin and PGND. The input capacitor should be placed as closely as possible to the module. Range: 10V to 80V.
PWR
Power output pin.
Apply output load between VOUT and PGND (PAD5). Place a high frequency output decoupling capacitor
directly between VOUT and PGND (PAD5). The output capacitor should be placed as closely to the module as possible. Range:
1.2V to 30V.
PWR
Phase node.
The PHASE pin should be floating. To achieve better thermal performance, the phase planes can also be used
for heat removal with thermal vias connected to large inner layers.
PWR
Power Ground.
Power ground pins for both input and output returns. Connect to power ground plane immediately below the
module to maximize heat dissipation and to minimize the effect of switching noise and power loss due to the impedance of
the copper traces.
PAD4
PAD5
PHASE
PGND
FN8607 Rev 2.00
May 9, 2014
Page 5 of 29
京公网安备 11010802033920号
EEWORLD
