F-219
MEC8–110–02–L–VP
MEC8–140–02–L–VP
(0.80 mm) .0315"
MEC8-VP SERIES
PRESS-FIT MICRO EDGE CARD SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MEC8-VP
Insulator Material:
Liquid Crystal
Polymer
Contact Material:
Copper
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
Current Rating:
3.3 A per pin
(2 adjacent pins powered)
Voltage Rating:
188 VAC/265 VDC
RoHS Compliant:
Yes
Mates with:
(1.60 mm) .062" thick card
Mates with (1.60 mm)
.062" thick card
(0.80 mm)
.0315" pitch
Variety of
lead counts
HIGH-SPEED CHANNEL PERFORMANCE
MEC8-VP
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
14
G b p s
Press-fit tails
on staggered pattern
MEC8
1
POSITIONS
PER ROW
CARD
THICKNESS
PLATING
OPTION
TAIL
10, 20, 30, 40
= (1.60 mm) .062"
thick card
–02
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
–L
= Press-fit
–VP
(39.80) 1.567
(36.60) 1.441
(18.90) .744
(2.00) .0787
(4.00) .157
40 POSITIONS
No. of Positions x (0.80) .0315 + (4.60) .181
(1.80)
.071
(4.40) (8.60)
.339
.173
Notes:
Patent Pending
While optimized for
50
W
applications, this
connector with alternative
signal/ground patterns may
also perform well in certain
75
W
applications.
Some sizes, styles and
options are non-standard,
non-returnable.
No. of Positions x (0.80) .0315 + (1.40) .055
(1.40)
.055
(8.80)
.346
(0.59)
.023
(1.23)
.048
(6.60)
.260
(8.20) .323
(1.20) .047
(0.80) .0315
10, 20, 30 POSITIONS
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM