Division’s patented OptoMOS architecture while the
optically coupled output is controlled by a highly
efficient GaAlAs infrared LED.
IXYS Integrated Circuits Division’s state of the art
double-molded vertical construction packaging
enables the CPC1018N to be one of the world’s
smallest relays. It offers board space savings of at
least 20% over the competitor’s larger 4-lead SOP
relay.
Features
•
Designed for Use in Security Systems Complying
with EN50130-4
•
Only 1mA of LED Current Required to Operate
•
1500V
rms
Input/Output Isolation
•
Small 4-Lead SOP Package
•
TTL/CMOS Compatible Input
•
No Moving Parts
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
No EMI/RFI Generation
•
Immune to Radiated EM Fields
•
SMD Pick & Place, Wave Solderable
•
Tape & Reel Version Available
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1172007
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
Applications
•
Security
•
Passive Infrared Detectors (PIR)
•
Data Signalling
•
Sensor Circuitry
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment—Patient/Equipment Isolation
•
Aerospace
•
Industrial Controls
Ordering Information
Part #
CPC1018N
CPC1018NTR
Description
4-Lead SOP (100/tube)
4-Lead SOP (2000/reel)
Pin Configuration
+ Control
1
4
Load
– Control
2
3
Load
Switching Characteristics
of Normally Open Devices
Form-A
I
F
90%
I
LOAD
t
on
10%
t
off
Pb
DS-CPC1018N-R11
e
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Total Power Dissipation
1
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
CPC1018N
Ratings
60
5
50
1
70
400
1500
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 3.33 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous
1
Peak
On-Resistance
2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
1
2
3
Conditions
Symbol
Min
Typ
Max
Units
I
F
=2mA
t =10ms
I
L
=100mA
V
L
=60V
P
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
-
-
-
-
-
-
-
-
-
0.1
0.9
-
-
-
-
0.58
-
0.47
0.22
40
0.2
0.2
1.2
-
1
600
±1
0.8
1
3
2
-
1
-
1.4
10
-
mA
rms
/ mA
DC
A
P
µA
I
F
=5mA, V
L
=10V
V
L
=50V, f=1MHz
I
L
=600mA
-
I
F
=5mA
V
R
=5V
-
ms
pF
mA
mA
V
µA
pF
Load current derates linearly from 600mA @ 25
o
C to 480mA @80
o
C.
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60
o
C) a LED drive current of 3mA is recommended.
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PERFORMANCE DATA*
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=100mA, T
A
=25ºC)
25
20
15
10
5
0
0.35
0.40
0.45 0.50 0.55
Turn-On (ms)
0.60
0.65
CPC1018N
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=100mA, T
A
=25ºC)
30
25
Device Count (N)
20
15
10
5
0
0.55
0.65
0.75
0.85
Turn-Off (ms)
0.95
1.05
Device Count (N)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
F
=1mA, I
L
=0.6A, T
A
=25ºC)
Device Count (N)
0.505 0.510 0.515 0.520 0.525 0.530 0.535
On-Resistance ( )
Typical I
F
for Switch Operation
(N=50, I
L
=600mA, T
A
=25ºC)
25
Device Count (N)
20
15
10
5
0
0.16
0.18
0.20 0.22 0.24
LED Current (mA)
0.26
0.28
Typical I
F
for Switch Dropout
(N=50, I
L
=600mA, T
A
=25ºC)
25
20
15
10
5
0
0.16
0.18
0.20
0.22
0.24
LED Current (mA)
0.26
Typical Blocking Voltage Distribution
(N=50, T
A
=25ºC)
35
30
Device Count (N)
25
20
15
10
5
0
63.5
64.0
64.5 65.0 65.5 66.0
Blocking Voltage (V
P
)
66.5
Device Count (N)
25
20
15
10
5
0
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA, T
A
=25ºC)
Device Count (N)
1.250
1.255 1.260 1.265 1.270
LED Forward Voltage (V)
1.275
50
LED Forward Current (mA)
40
LED Forward Voltage vs. Current
(T
A
=25ºC)
Typical Turn-On
vs. LED Forward Current
(I
L
=80mA)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
0.7
0.6
Turn-Off (ms)
0.5
0.4
0.3
0.2
0.1
0
0
5
Typical Turn-Off
vs. LED Forward Current
(I
L
=80mA)
30
20
10
0
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55
LED Forward Voltage(V)
Turn-On (ms)
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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PERFORMANCE DATA*
Typical LED Forward Voltage Drop
vs. Temperature
1.6
LED Forward Voltage (V)
1.5
1.4
1.3
1.2
1.1
1.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=5mA
I
F
=2mA
I
F
=1mA
I
F
=50mA
I
F
=20mA
I
F
=10mA
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40
CPC1018N
Typical Turn-On vs. Temperature
(I
L
=80mA)
I
F
=5mA
I
F
=10mA
-20
0
20
40
60
80
100
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
-40
Typical Turn-Off vs. Temperature
(I
L
=80mA)
Turn-On (ms)
Turn-Off (ms)
I
F
=5mA
I
F
=10mA
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
0.36
0.34
0.32
0.30
0.28
0.26
0.24
0.22
0.20
0.18
0.16
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=480mA)
-20
0
20
40
60
Temperature (ºC)
80
100
0.36
0.34
0.32
0.30
0.28
0.26
0.24
0.22
0.20
0.18
0.16
-40
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=480mA)
Typical On-Resistance vs. Temperature
(I
L
=480mA)
0.9
0.8
On-Resistance ( )
0.7
Steady State
0.6
0.5
0.4
0.3
-40
-20
0
20
40
60
80
100
I
F
=5mA
I
F
=10mA
LED Current (mA)
LED Current (mA)
-20
0
20
40
60
Temperature (ºC)
80
100
Temperature (ºC)
600
Load Current (mA)
400
Typical Load Current vs. Load Voltage
(I
F
=1mA, T
A
=25ºC)
Typical Maximum Load Current
vs. Temperature
0.80
0.75
Load Current (A)
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0.35
I
F
=10mA
I
F
=5mA
-40
-20
0
20
40
60
80
100
120
Blocking Voltage (V
P
)
72
70
68
66
64
62
60
58
-40
Typical Blocking Voltage
vs. Temperature
200
0
-200
-400
-600
-0.3
-0.2
-0.1
0
0.1
Load Voltage (V)
0.2
0.3
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
0.016
0.014
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(V
L
=60V)
0.010
0.008
0.006
0.004
0.002
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Load Current (A)
Leakage (µA)
0.012
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
10μs 100μs 1ms 10ms 100ms
Time
Energy Rating Curve
(I
F
=1mA)
1s
10s 100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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Manufacturing Information
Moisture Sensitivity
CPC1018N
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
CPC1018N
Moisture Sensitivity Level (MSL) Rating
MSL 3
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
CPC1018N
Maximum Temperature x Time
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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