FNP Series
High Power Precision Shunt Resistor, Up to 500W
FEATURES AND BENEFITS
•
Temperature coefficient of resistance (TCR)
+25°C to +60°C, 25°C ref.:
0 ±1 ppm/°C
–25°C to +125°C, 25°C ref.:
0 ±5 ppm/°C
• Utilizing Ni-Cr Bulk Metal
®
Foil Technology for realizing
low TCR
• Low thermal resistance with Copper plate
• Improved to 0.1°C/W from 0.3°C/W (conventional
model)
• Maximum rated power up to 500W on heat sink
• Extended max. ambient temperature to 125°C
(85°C with conventional model)
• Built-in Pt100 sensor monitor temperature of resistive
element
• Easily define size of suitable heat sink
• As safety function for continuous operation
Made in
Japan
CONTRUCTION OF MATERIALS
• Base plate: Nickel-plated Copper
• Current terminal: Nickel-plated Copper (T = 1.0 mm)
• Voltage and Pt terminals: Nickel-plated Copper
(T = 0.5 mm)
• Package: PPS Injection-molded case
APPLICATIONS
• Output reference of precision power supply
• Reference of charge-discharge test for high capacity
batteries
CONFIGURATION—Dimensions
in millimeters
COMPOSITION OF MODEL NUMBER
hexagonal nut
M6
FNP Z R0100 B
Example:
Tolerance
Resistance Value*
TCR
Type
*
R is a dual-purpose letter that designates both the value
range (R for ohmic) and the location of decimal point.
TCR
(ppm/°C)
0 ±1 (Z)
0 ±2.5 (Y)
(+25°C to 60°C)
0 ±5 (X)
(–25°C to 125°C)
Resistance
Range
(Ω)
Tolerance
(%)
±0.05 (A)
±0.1 (B)
±0.5 (D)
±1.0 (F)
Rated
Power
(W)
500
(on heat
sink*)
V1
C1
C2
0.001 to 1**
V2
* Keep temperature of element surface less than 125°C.
** Please contact us for higher resistance value
Document No.: 67050
Revision: 11-Jun-2016
For any questions, contact
sales-alpha@alpha-elec.co.jp
Pt100
TCR—RESISTANCE VS. TOLERANCE
Tolerance of Built-in Pt100 Sensor:
±[0.8 + 0.008(t)]°C
www.alpha-elec.co.jp
1
FNP Series
POWER DERATING CURVE
(%)
100
TEMPERATURE CHARACTERISTICS OF
RESISTANCE
Temperature Characteristics of Resistance
400
300
+2.5 ppm/°C
+1 ppm/°C
Rated Power Percentage
80
200
∆R/R25 (°C)
100
0
–100
–200
TCR Curve, Typical
–1 ppm/°C
–2.5 ppm/°C
0°C
25°C
50°C
75°C
Ambient Temperature (°C)
100°C
125°
C
60
R ≤ 10 mΩ
R > 10 mΩ
40
20
25
75
125
–300
–400
(°C)
0
0
20
40
60
80
Ambient Temperature
100
120
–25
°C
TABLE 2—PERFORMANCE
PARAMETERS
Maximum Rated Operating Temperature
Working Temperature Range
Maximum Working Current
Single Pulse Power Load
Dielectric Withstanding Voltage
Inductance
Internal Thermal Resistance
(element/base plate)
Life (200 W, Element Temperature 100°C)
High Temperature Exposure (125°C)
SPECIFICATION
25°C (R ≤10 mΩ)
–55°C to +125°C
320 A
50 J (tp <10 msec)
AC 500 V
<10 nH
R
θ
<0.1°C/W (R >10 mΩ)
R
θ
<0.2°C/W (R ≤10 mΩ)
±0.2% (2000 h)
±0.2% (2000 h)
75°C (R >10 mΩ)
LIFE (200 W, ELEMENT TEMPERATURE
+100°C)
Life (200W, Element Temperature +100°C)
0.3
HIGH TEMPERATURE EXPOSURE (+125°C)
Long-Term Stability at 125°C
0.5
Resistance Change (%)
0.4
0.3
0.2
0.1
0
–0.1
–0.2
–0.3
–0.4
–0.5
0
500
1500
1000
Time (h)
2000
2500
Resistance Change (%)
0.2
0.1
0
–0.1
–0.2
–
0.3
0
500
1000
1500
2000
2500
Time (h)
www.alpha-elec.co.jp
2
For any questions, contact
sales-alpha@alpha-elec.co.jp
Document No.: 67050
Revision: 11-Jun-2016
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NXP MCU
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