F-219
BSH–060–01–F–D–RA–WT
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 50 µ" GOLD
BSH–030–01–L–D–RA–WT
(0.50 mm) .0197"
BSH–090–01–L–D–A
BSH–060–01–F–D–A
BSH SERIES
BASIC BLADE & BEAM SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?BSH
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
2 A per pin
(2 pins powered)
Flammability Rating:
UL 94 VO
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
175 VAC
Max Cycles:
100
RoHS Compliant:
Yes
BSH
Mates with:
BTH
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
A
OTHER
OPTION
–030, –050, –060,
–090, –120, –150
No. of Positions x (0.50) .01969
+ (6.27) .247
02
= Gold Flash
on contact,
Matte Tin on tail
–F
–L
= Tape & Reel
(120 positions
maximum)
–TR
(6.22)
.245
01
(3.81) (7.24)
.150 .285
(0.50)
.01969
(3.25)
.128
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (030-090)
(0.15 mm) .006" max (120-150)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
Board Stacking:
For applications requiring more
than two connectors per board
or 90 positions or higher,
contact ipg@samtec.com
(3.05)
.120
(0.15)
.006
(0.89)
.035
DIA
(0.76)
.030
= Electro-Polished
Selective
50 µ" (1.27 µm) min Au
over 150 µ" (3.81 µm) Ni
on Signal Pins in contact
area, Matte Tin over
50 µ" (1.27 µm) min
Ni on all solder tails
*Note:
–C Plating passes
10 year MFG testing
–C*
POWER/SIGNAL
APPLICATION
MATED HEIGHT
LEAD STYLE MATED HEIGHT*
–01
(5.00) .197
*Processing conditions will
affect mated height.
Compatible with
UMPT/UMPS for
flexible two-piece
power/signal solutions
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
FILE NO. E111594
BSH
Mates with:
BTH
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
RA
WT
OTHER
OPTION
ALSO AVAILABLE
(MOQ Required)
• 30 µ" (0.76 µm) Gold
• Edge Mount Capability
• 8 mm, 11 mm, 16 mm,
19 mm and 22 mm Stack
Height (Caution: Some
automatic placement/
inspection machines may
have component height
restrictions. Please consult
machinery specifications.)
(11 mm, 16 mm, 19 mm
and 22 mm not available
with 50 positions)
–030, –060, –090
= Gold Flash on contact, Matte Tin on tail
–F
–L
= Guide Post
–GP
= 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail
No. of Positions x (0.50) .01969 + (10.88) .428
(13.59)
.535
01
(7.24)
.285
(1.32) (1.10)
.052 x .043
(0.15)
.006
(0.50)
.01969
02
(8.82)
.347
(0.64)
.025
SQ
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
(1.32)
.052
DIA
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
