NEW
Ultra-small, power/signal contact design for Board-to-Board/FPC-to-Board providing 3A max current
BM29 Series
20% reduction in size compared with alternate Hirose’s products
3.16mm
BM29
6 contacts
3.55mm
Prior generation
product :
BM23
6 contacts
The narrower and shorter, yet flexible design
allows tight installation.
1.5mm
Oct.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
1.98mm
Fig.1
■Features
1. Space-saving design
Compact and flexible design ideal for mobile
devices. (Fig.1)
・
Pitch : 0.35mm, Depth : 1.5mm, Stacking height : 0.6mm
Combination Power / Signal contact design
2. Equipped with power contacts capable of
handling up to 3A current.
(Fig.2)
・
Rated current : 3A (power contact), 0.3A (signal
contact)
3. The proprietary metal guide prevents the
connector from being damaged against
offset mating.
(Fig.3)
4. A tactile click ensures secure mating.
(Fig.4)
5. 2-points of contact offer high contact
reliability.
Metal
guides
Fig.2
Contacts mating is designed to reduce
connector damage even if mated incorrectly.
Fig.3
The contact is
designed to
provide a tactile
click.
Click!
Click!
Locking
groove
The load
plummets.
A tactile
click
Metal locks
Fig.4
In cases where the application will demand a high level of reliability, such as automotive,
please contact a company representative for further information.
2016.4
q
1
BM29 Series●Ultra-small, power/signal contact design for Board-to-Board/FPC-to-Board providing 3A max current
■Product
Specifications
Rated current
Rated voltage
Items
1. Insulation resistance
Power contact : 3A
Signal contact : 0.3A
30V AC/DC
Operation
Storage
-40 to 85°C (Note 1)
temperature range
temperature range
Operation
90% RH or below
Storage
humidity range
(Note 3)
humidity range
Specifications
Minimum of 1000Mø
-10 to 60ç (Note 2)
90% RH or below
(Notes 2 and 3)
Conditions
Measured at 100V DC
150V AC for 1 minute
Measured at 20mV AC, 1kHz, and 1mA
Frequency : 10 to 55 Hz, Half amplitude : 0.75mm, in
3 axis directions for 10 cycles each (5 minutes/cycle)
Temperature : 40±2ç, Humidity : 90 to 95%,
left as it is for 96 hours
(-55ç for 30 minutes
➝
5 to 35°C for 10 minutes
➝
85°C for 30 minutes
➝
5 to 35°C for 10 minutes)
in 5 cycles
Mating times : 10 times
Reflow : according to the Recommended temperature profile
Hand soldering : temperature of soldering iron at 350°C for
within 3 seconds
Oct.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
2. Withstanding voltage There shall be no flashover or dielectric breakdown.
Signal contact : 100mø max.
3. Contact resistance
Power contact : 30mø max.
There shall be no instantaneous power failure
4. Vibration resistance
lasting for a minimum of 1µs.
Contact resistance : Signal contact : 100mø max.
5. Moisture resistance
Power contact : 30mø max.
Insulation resistance : 100Mø min.
Contact resistance : Signal contact : 100mø max.
Power contact : 30mø max.
6. Temperature cycle
Insulation resistance : 100Mø min.
7. Mating durability
8. Soldering heat
resistance
Contact resistance : 100mø max.
There shall be no dissolution of the resin part
affecting the performance.
Note 1 : Includes temperature rise caused by current flow.
Note 2 : Storage refers to long-term-storage of unused items before they are mounted on the PCB.
Operating temperature / humidity range applies to the state of temporary storage such as non-powered after mounting on the
PCB, and during transportation, etc.
Note 3 : Avoid a high humidity environment.
■Materials
/ Finish
Product
Receptacle
Header
Part
Insulator
Signal contact
Power contact
Material
LCP
Phosphor bronze
Finish
Black
Gold plated
UL specification
UL94V-0
-- ---
--- --
-- ---
--- --
■Product
Number Structure
Refer to the chart below when determining the product specifications from the product number.
Please select from the product numbers listed in this catalog when placing orders.
●Receptacle
BM 29B 0.6 −
*
DS/ 2 − 0.35 V (51)
❹
Series Name : BM
Series No. : 29B
Stacking height
Number of Signal Contacts : 2
❺
❻
❼
½
Connector type DS : Receptacle
Number of Power Contacts : 2
Contact Pitch : 0.35mm
Terminal shape V : Straight SMT
Gold plating specification and
packaging
(51) : Gold plating thickness 0.05µm
Emboss tape packaging (20,000 pcs/
reel)
●Header
BM 29B −
*
DP/ 2 − 0.35 V (51)
❹
Series Name : BM
Series No. : 29B
Number of Signal Contacts : 2
Connector type DP : Header
Number of Power Contacts : 2
❺
❻
❼
½
Contact Pitch : 0.35mm
Terminal shape V : Straight SMT
Gold plating specification and packaging
(51) : Gold plating thickness 0.05µm
Emboss tape packaging (20,000 pcs/reel)
2
BM29 Series●Ultra-small, power/signal contact design for Board-to-Board/FPC-to-Board providing 3A max current
■Receptacle
A
B
C
P=0.35
Oct.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Recommended PCB pattern diagram
P=0.35±0.02
D±0.02
E±0.02
C±0.02
D
E
0.6
０
1.82
＋０．５
０
1.18
-0.05
0.98
-0.05
Insulation area
０
０
Recommended metal mask thickness : 100µm, Aperture ratio : 100%
0.3±0.02
0.46±0.02
0.18±0.02
1.5
Unit
：mm
No. of Contacts
Part No.
BM29B0.6-2DS/2-0.35V(51)
BM29B0.6-6DS/2-0.35V(51)
BM29B0.6-10DS/2-0.35V(51)
HRS No.
673-7001-0 51
Under development
Under development
Signal
2
6
10
Power
2
2
2
A
2.46
3.16
3.86
B
0.7
1.44
2.14
C
−
D
2.08
2.78
3.48
E
0.98
1.68
2.38
0.7
1.4
Note 1 : Please place your orders for full reel quantities of embossed tape packages.
Note 2 : This connector has no polarity.
■Header
P=0.35
F
G
H
1.4
0.12
0.19
Recommended PCB pattern diagram
(0.53)
P=0.35±0.02
G±0.02
H±0.02
０
1.61
＋０．５
０
0.55
Recommended metal mask thickness : 100µm, Aperture ratio : 80%
0.25±0.02
0.18±0.02
Part No.
BM29B-2DP/2-0.35V(51)
BM29B-6DP/2-0.35V(51)
BM29B-10DP/2-0.35V(51)
HRS No.
673-7002-0 51
Under development
Under development
No. of Contacts
Signal
2
6
10
Power
2
2
2
F
1.81
2.51
3.21
G
0.77
1.47
2.17
0.41
Unit
：mm
H
−
0.7
1.4
Note 1 : Please place your orders for full reel quantities of embossed tape packages.
Note 2 : This connector has no polarity.
3
BM29 Series●Ultra-small, power/signal contact design for Board-to-Board/FPC-to-Board providing 3A max current
Embossed Tape Dimensions (conforms to JIS C 0806)
●Receptacle
4±0.1
2±0.1
4±0.1
K
1.75±0.1
●Reel
dimensions
Ø1.5
+0.1
0
Product label
Ø1
5.5±0.1
0°
12
3±
0.2
Ø1.5 feed hole
diameter
Ø380±2
Ø80±1
13.5±0.5
17.5±1
Ø1.5 feed hole
diameter
Ø380±2
Ø80±1
13.5±0.5
17.5±1
K-K
2±0.5
Ø2
0.8
1±
12
0°
Oct.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
K
0.2±0.1
J
J-J
J
0.74±0.15
●Header
1.75±0.1
12±0.3
●Reel
dimensions
Ø1.5
2±0.1
4±0.1
4±0.1
5.5±0.1
12±0.3
0°
L
L-L
L
M
0.2±0.1
0.55±0.15
4
12
Ø1
3±
0.2
M
M-M
Product label
2±0.5
+0.1
0
Ø2
0.8
1±
12
0°
BM29 Series●Ultra-small, power/signal contact design for Board-to-Board/FPC-to-Board providing 3A max current
Precautions
1.Recommended
temperature profile
250
220
Temperature ℃）
（
200
180
150℃
180℃
220℃
MAX 250℃
150
Oct.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
100
50
25
0
Start
Time (seconds)
25℃
（60 seconds）
90 to 120 seconds
Preheating time
（60 seconds）
Soldering time
[Conditions]
1. Peak temperature
2. Heating unit
3. Preheating unit
4. Number of times
: 250ç
: No less than 220ç for no more than 60 seconds
: 150 to 180ç for 90 to 120 seconds
: No more than 2 times
Note 1 : The temperature is the surface temperature of the PCB in the vicinity of the connector
lead part.
Note 2 : When you use nitrogen reflow, please mount the product with the oxygen concentration
at a minimum of 1,000 [ppm].
Please contact us if the concentration is below 1,000 [ppm].
2. Recommended hand
soldering conditions
3. Recommended screen
thickness/aperture ratio
(pattern area ratio)
4. Warpage of the PCB
5. Cleaning
Soldering iron temperature : 340 ± 10°C,
Soldering time : within 3 seconds
Thickness : 0.1mm
Aperture ratio : 100% on the DS side ; 80% on the DP side
A maximum of 0.02mm at the center part of the connector based on both ends of the connector.
Not recommended. If you clean this product, please evaluate the performance before using it.
(Cleaning may cause a change in the mating/unmating property and its resistance to
environment)
Care should be taken that mating/unmating operation when the product is not mounted on the
PCB could cause damage or deformation, etc. of the contact.
Avoid supporting the PCB only by connectors, and support it by other means than connectors.
Care should be taken that excessive prying mating/unmating could cause damage.
During hand soldering, do not apply flux which will cause flux oozing on connector.
This product may differ in hue due to production lot variability, but it doesn’t have any
influence on the performance.
Please refer to the next page for the precautions for mating/unmating.
Considering the possibility of disengagement due to the counterforce caused by the drop, impact
and routing of FPC, fix the mated state by the use of housings and cushion materials, etc.
Caution! Do not use the connector in non-recommended conditions (i.e., rated current, rated
voltage, PCB design and operating environment, etc.). Such usage could lead to material
outgassing, ignition, or short-circuit, etc.
Refer to the specifications and the guidelines for board pattern dimensions, board cautions,
and connector treatment.
Pleasae contact Hirose if using the connector under conditions other than those described in
the specifications and the guidelines is being considered.
6. Notes
5
京公网安备 11010802033920号
EEWORLD
