EEWORLDEEWORLDEEWORLD

Part Number

Search

ATS-11D-207-C2-R0

Description
HEATSINK 60X60X12MM XCUT T766
CategoryThermal management products   
File Size134KB,1 Pages
ManufacturerERP
Environmental Compliance
Download Datasheet Parametric View All

ATS-11D-207-C2-R0 Overview

HEATSINK 60X60X12MM XCUT T766

ATS-11D-207-C2-R0 Parametric

Parameter NameAttribute value
typetop installation
cooling packageClassification (BGA, LGA, CPU, ASIC...)
Joining methodPush your feet
shapesquare, fins
length2.362"(60.00mm)
width2.362"(60.00mm)
diameter-
Height from base (fin height)0.472"(12.00mm)
Power dissipation at different temperature rises-
Thermal resistance at different forced airflows6.39°C/W @ 100 LFM
Thermal resistance under natural conditions-
Materialaluminum
Material platingblue anodized
pushPIN™ Heat Sink Assembly
ATS Part#:
ATS-11D-207-C2-R0
Description:
pushPIN™ HS ASMBLY,COARSE-PITCH,XCUT, HOLE PATTERN:4-CORNER,BLUE,T766
Heat Sink Type:
pushPIN™ Heat Sink Assembly
Heat Sink Attachment:
pushPIN™ / Spring Kit
Features & Benefits
»
Quick Attachment – Push pins feature a flexible barb at the end designed to
engage with pre-drilled holes in a PCB.
»
Compression Springs add the necessary force to hold the assembly together
for secure attachment. Select from over 21 different springs to achieve
precise force required.
»
Push Pin Material available in brass or plastic in 10 sizes ranging from 9-
20mm in length. Stainless steel hardware kit available for more secure
attachment. Visit www.qats.com for available options.
»
Heat Sinks Designed for All Airflow Conditions. Select from over 112 fine
pitch HS designed for high velocity air flows and 98 course pitch HS
designed for low velocity air flow conditions.
»
Pre-assembled with phase-changing material for increased thermal
performance. Double-sided thermal tape and no TIM options available to
meet application-specific requirements.
»
Lightweight, aluminum HS extruded from AL6063 provide optimal heat
transfer with a blue anodized finish.
»
All components are RoHS and REACH compliant.
»
Industry standard hole pattern. Recommended through hole size is 3.175mm
For Illustration Purposes ONLY.
Bill of Material
Heat Sink:
ATS-CPX060060012-207-C2-R0
Push Pin:
Springs:
ATS-PP-04
ATS-PPS-11
Qty
1
2
2
Thermal Performance
100
AIR VELOCITY - LFM (m/s)
(0.5)
Thermal Resistance
°C/W
Unducted Flow
Ducted Flow
6.39
4.70
200
(1.0)
4.48
3.52
300
(1.5)
3.70
2.96
400
(2.0)
3.24
2.62
500
(2.5)
2.92
2.38
600
(3.0)
2.68
2.20
700
(3.5)
2.50
2.05
Fin
Pitch
COARSE-
PITCH
Fin
Type
XCUT
Hole
Pattern
4-CORNER
Product Detail
P/N
ATS-11D-207-C2-R0
A
60
Dimensions
B
C
E
60
12
53
F
53
NOTES:
Push Pin
ATS-PP-04
Spring
ATS-PPS-11
TIM
T766
Finish
BLUE ANODIZED
1) Dimension A is the length of the heat sink in the direction of the flow.
2) Dimension B is the width of the heat sink perpendicular to the flow direction.
3) Dimension C is the heat sink height from the bottom of the base to the top of the fin
field.
4) Dimension E is the distance between holes perpendicular to the direction of flow.
5) Dimension F is the distance between holes in the direction of flow.
6) Thermal performance data are provided for reference only. Actual performance may
vary by application.
7) ATS reserves the right tp update or change its products without notice to improve the
design or performance.
8) ATS certifies that this heat sink assemby is RoHS-6 and REACH compliant.
9) Contact ATS to learn about custom options available.
For Illustration Purposes ONLY.
For further technical information, please contact Advanced Thermal Solutions, Inc.
89-27 ACCESS ROAD, NORWOOD, MA 02062 USA | T: 781.769. 2800 F: 781.769.9979 | WWW.QATS.COM
R2-0917
Which kindhearted person has the tutorial of DP-51pro comprehensive simulation experiment instrument?
Which kind-hearted person has the tutorial of DP-51pro comprehensive simulation experiment instrument? Which kind-hearted person has the tutorial of DP-51pro comprehensive simulation experiment instru...
leejiee Embedded System
A small problem using quartus
Can the 9.1sp2 version of Quartus2 be used with the 6.5e version of ModuleSim-Altera?...
eeleader FPGA/CPLD
TIVA C Launchpad Weekly Plan - Week 3 (5110 LCD Screen)
Use the Energia development environment to drive the 5110 LCD screen. The buttons on the board control the backlight switch. The program was found on GitHub. It seems to be written by the people who m...
nwcheroes Microcontroller MCU
A question about the program of atmega8 voltage detection
The problem is that sometimes it works normally after power on, but sometimes it doesn't. The code is as follows: #include #include#define high 0x005d #define low 0x003b unsigned int adc[]; unsigned i...
p54862555 Microchip MCU
[ESP32-Korvo Review] 07 Compile the first project hello world
It took me a week and several nights to finally set up the ESP-IDF development environment. In order to verify whether there are any problems, I compiled a project to see.After ESP-IDF is installed, m...
天意无罪 Domestic Chip Exchange
Or Simon's story?
Chapter 1: The Real and the Fake Ximen. They tried every possible means to catch the expert, but it turned out to be a fake. The man was bald, wearing a tiger-skin coat, and had a very dark skin. His ...
西门 Talking

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 833  1195  2105  651  2011  17  25  43  14  41 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号