EEWORLDEEWORLDEEWORLD

Part Number

Search

ATS-19B-132-C2-R0

Description
HEATSINK 60X60X25MM XCUT T766
CategoryThermal management products   
File Size134KB,1 Pages
ManufacturerERP
Environmental Compliance
Download Datasheet Parametric View All

ATS-19B-132-C2-R0 Overview

HEATSINK 60X60X25MM XCUT T766

ATS-19B-132-C2-R0 Parametric

Parameter NameAttribute value
typetop installation
cooling packageClassification (BGA, LGA, CPU, ASIC...)
Joining methodPush your feet
shapesquare, fins
length2.362"(60.00mm)
width2.362"(60.00mm)
diameter-
Height from base (fin height)0.984"(25.00mm)
Power dissipation at different temperature rises-
Thermal resistance at different forced airflows2.66°C/W @ 100 LFM
Thermal resistance under natural conditions-
Materialaluminum
Material platingblue anodized
pushPIN™ Heat Sink Assembly
ATS Part#:
ATS-19B-132-C2-R0
Description:
pushPIN™ HS ASMBLY,COARSE-PITCH,XCUT, HOLE PATTERN:4-CORNER,BLUE,T766
Heat Sink Type:
pushPIN™ Heat Sink Assembly
Heat Sink Attachment:
pushPIN™ / Spring Kit
Features & Benefits
»
Quick Attachment – Push pins feature a flexible barb at the end designed to
engage with pre-drilled holes in a PCB.
»
Compression Springs add the necessary force to hold the assembly together
for secure attachment. Select from over 21 different springs to achieve
precise force required.
»
Push Pin Material available in brass or plastic in 10 sizes ranging from 9-
20mm in length. Stainless steel hardware kit available for more secure
attachment. Visit www.qats.com for available options.
»
Heat Sinks Designed for All Airflow Conditions. Select from over 112 fine
pitch HS designed for high velocity air flows and 98 course pitch HS
designed for low velocity air flow conditions.
»
Pre-assembled with phase-changing material for increased thermal
performance. Double-sided thermal tape and no TIM options available to
meet application-specific requirements.
»
Lightweight, aluminum HS extruded from AL6063 provide optimal heat
transfer with a blue anodized finish.
»
All components are RoHS and REACH compliant.
»
Industry standard hole pattern. Recommended through hole size is 3.175mm
For Illustration Purposes ONLY.
Bill of Material
Heat Sink:
ATS-CPX060060025-132-C2-R0
Push Pin:
Springs:
ATS-PP-02
ATS-PPS-19
Qty
1
2
2
Thermal Performance
100
AIR VELOCITY - LFM (m/s)
(0.5)
Thermal Resistance
°C/W
Unducted Flow
Ducted Flow
2.66
1.37
200
(1.0)
1.39
0.99
300
(1.5)
1.09
0.84
400
(2.0)
0.93
0.75
500
(2.5)
0.84
0.69
600
(3.0)
0.77
0.64
700
(3.5)
0.72
0.60
Fin
Pitch
COARSE-
PITCH
Fin
Type
XCUT
Hole
Pattern
4-CORNER
Product Detail
P/N
ATS-19B-132-C2-R0
A
60
Dimensions
B
C
E
60
25
53
F
53
NOTES:
Push Pin
ATS-PP-02
Spring
ATS-PPS-19
TIM
T766
Finish
BLUE ANODIZED
1) Dimension A is the length of the heat sink in the direction of the flow.
2) Dimension B is the width of the heat sink perpendicular to the flow direction.
3) Dimension C is the heat sink height from the bottom of the base to the top of the fin
field.
4) Dimension E is the distance between holes perpendicular to the direction of flow.
5) Dimension F is the distance between holes in the direction of flow.
6) Thermal performance data are provided for reference only. Actual performance may
vary by application.
7) ATS reserves the right tp update or change its products without notice to improve the
design or performance.
8) ATS certifies that this heat sink assemby is RoHS-6 and REACH compliant.
9) Contact ATS to learn about custom options available.
For Illustration Purposes ONLY.
For further technical information, please contact Advanced Thermal Solutions, Inc.
89-27 ACCESS ROAD, NORWOOD, MA 02062 USA | T: 781.769. 2800 F: 781.769.9979 | WWW.QATS.COM
R2-0917
MSP430 driver ADS1115 source code
...
snoweaglemcu Microcontroller MCU
STM32AHB_FSMC and APB1_I2C1 conflict issues
I am adjusting the IIC communication function of STM32. IIC communication is normal without any problem. However, if RCC_AHBPeriphClockCmd(RCC_AHBPeriph_FSMC, ENABLE) is added to void RCC_Configuratio...
auto_dut stm32/stm8
AC current source
Can anyone help me take a look? I don't know where I'm wrong!!! I think there's nothing wrong with the theory. There's nothing wrong with the simulation! But I don't know why the NE5534B explodes as s...
anowxf Analog electronics
Where is the file manager of WinCe6.0?
The class view is empty; the solution explorer only has project.bib, project.dat, project.db, project.reg and files in the installation directory. The class view in VC++6.0 has all the files generated...
boyfly Embedded System
Homemade smart car
I made a small car in my spare time. Here is the picture to prove it[[i]This post was last edited by realone on 2011-4-25 22:49[/i]]...
realone MCU
What are the functions of the sensor test socket?
? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ?...
Aforcecn优力 Analog electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 725  2603  1515  2827  1065  15  53  31  57  22 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号