2. Wavelength value is traceable to CIE127-2007 standards.
3. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
ABSOLUTE MAXIMUM RATINGS at T
A
=25°C
Parameter
Symbol
Value
Unit
Power Dissipation
Reverse Voltage
Junction Temperature
Operating Temperature
Storage Temperature
DC Forward Current
Peak Forward Current
Thermal Resistance (Junction / Ambient)
Thermal Resistance (Junction / Solder point)
P
D
V
R
T
j [1]
T
op
T
stg
I
F [1]
I
FM [2]
R
th JA [1]
R
th JS [1]
2.8
5
115
-40 to +100
-40 to +115
700
1000
10
5
W
V
°C
°C
°C
mA
mA
°C/W
°C/W
Notes:
1. Results from mounting on metal core PCB, mounted on pc board-metal core PCB is recommend for lowest thermal resistance.
2. 1/10 Duty Cycle, 0.1ms Pulse Width.
3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is
more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone
encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the
side surfaces by using forceps or
appropriate tools.
2. Do not directly touch or handle the silicone lens
surface. It may damage the internal circuitry.
3. Do not stack together assembled
PCBs containing exposed LEDs.
Impact may scratch the silicone lens
or damage the internal circuitry.
4-1. There should be enough space inside the nozzle to avoid contact with the dome lens during pick up.
4-2. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4-3. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4-4. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure
precise pickup and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H
2
S might corrode silver
plating of lead-frame. Special care should be taken if an LED with silicone encapsulation is to be used near such
substances.
Designing the Position of LED on a Board
1. No twist / warp / bent / or other stress shall be applied to the board after
mounting LED with solder to avoid a crack of LED package.
Refer to the following recommended position and direction of LED.
2. Depending on the position and direction of LED,
the mechanical stress on the LED package can be changed.
Refer to the following figure.
Appropriate LED mounting is to place perpendicularly against the stress affected side
.
3. Do not split board by hand. Split with exclusive special tool.
4. If an aluminum circuit board is used, a large stress by thermal shock might cause a solder crack.
For this reason, it is recommended an appropriate verification should be taken before use.
JEDEC Moisture Sensitivity
Soak Requirements
Level
Floor Life
Standard
Time
1
Unlimited
Conditions
Time (hours)
168
+5/-0
Conditions
85 °C / 85% RH
Accelerated Equivalent
Time (hours)
-
Conditions
-
≤
30 °C / 85% RH
Kingbright recommends keeping the LEDs in the sealed moisture-barrier packaging until immediately prior to use. Any unused
LEDs should be returned to the moisture-barrier bag and closed immediately after use.
Electric static discharge can result when static-sensitive products come in contact with the operator or other conductors.
The following procedures may decrease the possibility of ESD damage:
1. Minimize friction between the product and surroundings to avoid static buildup.
2. All production machinery and test instruments must be electrically grounded.
3. Operators must wear anti-static bracelets.
4. Wear anti-static suit when entering work areas with conductive machinery.
5. Set up ESD protection areas using grounded metal plating for component handling.
6. All workstations that handle IC and ESD-sensitive components must maintain an electrostatic potential of 150V or less.
7. Maintain a humidity level of 50% or higher in production areas.
8. Use anti-static packaging for transport and storage.
9. All anti-static equipment and procedures should be periodically inspected and evaluated for proper functionality.
Heat Generation
1. Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design.
The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this
specification.
2. Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot of Permissible Forward
Current vs. Ambient temperature on characteristics in this specification.
Please also take measures to remove heat from the area near the LED to improve the operational characteristics on the LED.
3. The equation
①
indicates correlation between T
j
and T
a
, and the equation
②
indicates correlation between T
j
and T
s
T
j
= T
a
+ R
th JA
*W ………
①
T
j
= T
s
+ R
th JS
*W ………
②
T
j
= dice junction temperature: °C
T
a
= ambient temperature: °C
T
s
= solder point temperature: °C
R
th JA
= heat resistance from dice junction temperature to ambient temperature: °C / W
R
th JS
= heat resistance from dice junction temperature to Ts measuring point: °C / W
W = inputting power (I
F
x V
F
): W
REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS
Notes:
1. Don't cause stress to the LEDs while it is exposed to high temperature.
2. The maximum number of reflow soldering passes is 2 times.
3. Reflow soldering is recommended. Other soldering methods are not recommended as they might
京公网安备 11010802033920号
EEWORLD
