A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
When using modelsim simulation , there are some red and blue lines in the waveform window. What do they mean?The answer is simple:Red line: no drive Blue line: high impedance,...
[hide]Multi-crystal packaging has become a solution that the industry is considering. In this regard, the advantages and disadvantages of single-crystal or multi-crystal packaging are compared. The ar...
Cadillac is a famous car brand with a long history. Domestic consumers have always had the impression that American cars are luxurious and spacious. However, Cadillac also incorporates the most popula...
[i=s]This post was last edited by Moiiiiilter on 2022-5-27 14:15[/i][Problem description]【Error reason】
When downloading or debugging, the core (RISC-V/ARM) of the chip corresponding to the target pro...
[i=s] This post was last edited by dontium on 2015-1-23 13:38 [/i] I used CCS2000 to compile a project and used the following statements:.ref F$$ITOF, F$$DIV, F$$MUL.ref F$$FTOI, F$$ADD, F$$LTOF, F$$S...
Core point: The automotive industry chain and the humanoid robot industry have collaborative advantages in hardware, software, and scenarios. Upstream and downstream companies in the automotive ind...[Details]
Pure electric vehicles, structurally speaking, have components such as a power battery. In addition to the power battery, a small battery also powers some low-voltage electrical components and even...[Details]
With the advent of the electric car era, the number of pure electric vehicles has increased significantly, but many car owners do not know how to properly maintain pure electric vehicles. In additi...[Details]
Keysight Technologies is combining its electromagnetic simulator with Synopsys' AI-driven RF design migration flow to create an integrated design flow for migrating from TSMC's N6RF+ process techno...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
Plessey Semiconductors has been acquired by Haylo Labs, which was established in March last year with a $100 million, five-year loan from Chinese technology company Goertek.
Haylo Labs w...[Details]
"We have successfully launched the first version of our dedicated chip for EMB brake-by-wire. Second-generation samples have also been successfully completed, and we are actively planning a third-g...[Details]
Introduction: In digital circuit calculations, there is no concept of decimal points. You know where the decimal is, but the circuit does not know where the decimal point is. Therefore, you need to...[Details]
Facial recognition, a biometric technology that uses facial features to authenticate identity, has rapidly become a global market hotspot in recent years as the technology has entered practical use...[Details]
The Importance of Intelligent Motion Control in Smart Manufacturing
Intelligent motion control is a core building block of smart manufacturing, enabling highly flexible and efficient manufactu...[Details]
Annual increases in global carbon emissions are leading to global warming and melting polar glaciers, necessitating urgent environmental solutions. Countries around the world are seeking better sol...[Details]
Mr. Wang, a BYD owner, recently experienced a "5-minute charge" at a highway service area, boasting a 400-kilometer range. He marveled at the rapid evolution of new energy technol...[Details]
Why does the xenon lamp not light up?
There are many reasons why a xenon lamp might not light up. Poor contact, a damaged component, or a blown bulb are all possible reasons. This requires a l...[Details]
The input of a power amplifier is a DC voltage, while the input of a voltage amplifier is a current.
The transistor outputs signals in the following ways:
DC output: The transistor will g...[Details]
1. Introduction to power amplifier circuit
1. Generally speaking, the main function of a power amplifier circuit is to allow the load to obtain maximum power without distorting the signal or c...[Details]
FPGA/CPLD
京公网安备 11010802033920号
EEWORLD
