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TK7A60W,S4VX

Description
MOSFET N CH 600V 7A TO-220SIS
Categorysemiconductor    Discrete semiconductor   
File Size238KB,10 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Environmental Compliance
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TK7A60W,S4VX Overview

MOSFET N CH 600V 7A TO-220SIS

TK7A60W,S4VX Parametric

Parameter NameAttribute value
FET typeN channel
technologyMOSFET (metal oxide)
Drain-source voltage (Vdss)600V
Current - Continuous Drain (Id) at 25°C7A(Ta)
Drive voltage (maximum Rds On, minimum Rds On)10V
Rds On (maximum value) when different Id, Vgs600 milliohms @ 3.5A, 10V
Vgs (th) (maximum value) when different Id3.7V @ 350µA
Gate charge (Qg) at different Vgs (maximum value)15nC @ 10V
Vgs (maximum value)±30V
Input capacitance (Ciss) at different Vds (maximum value)490pF @ 300V
FET functionsuper knot
Power dissipation (maximum)30W(Tc)
Operating temperature150°C(TJ)
Installation typeThrough hole
Supplier device packagingTO-220SIS
Package/casingTO-220-3 whole package
TK7A60W
MOSFETs
Silicon N-Channel MOS (DTMOS)
TK7A60W
1. Applications
Switching Voltage Regulators
2. Features
(1)
(2)
(3)
Low drain-source on-resistance: R
DS(ON)
= 0.5
(typ.)
by used to Super Junction Structure : DTMOS
Easy to control Gate switching
Enhancement mode: V
th
= 2.7 to 3.7 V (V
DS
= 10 V, I
D
= 0.35 mA)
3. Packaging and Internal Circuit
1: Gate
2: Drain
3: Source
TO-220SIS
25
4. Absolute Maximum Ratings (Note) (T
a
= 25
unless otherwise specified)
Characteristics
Drain-source voltage
Gate-source voltage
Drain current (DC)
Drain current (pulsed)
Power dissipation
Single-pulse avalanche energy
Avalanche current
Reverse drain current (DC)
Reverse drain current (pulsed)
Channel temperature
Storage temperature
Isolation voltage (RMS)
Mounting torque
(t = 1.0 s)
(Note 1)
(Note 1)
(T
c
= 25)
(Note 2)
(Note 1)
(Note 1)
Symbol
V
DSS
V
GSS
I
D
I
DP
P
D
E
AS
I
AR
I
DR
I
DRP
T
ch
T
stg
V
ISO(RMS)
TOR
Rating
600
±30
7.0
28
30
92
1.8
7.0
28
150
-55 to 150
2000
0.6
V
Nm
W
mJ
A
A
Unit
V
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Start of commercial production
1
2012-09
2014-01-05
Rev.2.0

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