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MT47H32M16CC-37E IT:B TR

Description
IC DRAM 512M PARALLEL 84FBGA
Categorystorage   
File Size9MB,139 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Environmental Compliance
Download Datasheet Parametric View All

MT47H32M16CC-37E IT:B TR Overview

IC DRAM 512M PARALLEL 84FBGA

MT47H32M16CC-37E IT:B TR Parametric

Parameter NameAttribute value
memory typeVolatile
memory formatDRAM
technologySDRAM - DDR2
storage512Mb (32M x 16)
Clock frequency267MHz
Write cycle time - words, pages15ns
interview time500ps
memory interfacein parallel
Voltage - Power1.7 V ~ 1.9 V
Operating temperature-40°C ~ 95°C(TC)
Installation typesurface mount
Package/casing84-TFBGA
Supplier device packaging84-FBGA(12x12.5)
512Mb: x4, x8, x16 DDR2 SDRAM
Features
DDR2 SDRAM
MT47H128M4 – 32 Meg x 4 x 4 banks
MT47H64M8 – 16 Meg x 8 x 4 banks
MT47H32M16 – 8 Meg x 16 x 4 banks
Features
Vdd = +1.8V ±0.1V, VddQ = +1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
4 internal banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency - 1
t
CK
Selectable burst lengths: 4 or 8
Adjustable data-output drive strength
64ms, 8,192-cycle refresh
On-die termination (ODT)
Industrial temperature (IT) option
Automotive temperature (AT) option
RoHS compliant
Supports JEDEC clock jitter specification
Options
1
Configuration
256 Meg x 4 (32 Meg x 4 x 4 banks)
128 Meg x 8 (16 Meg x 8 x 4 banks)
64 Meg x 16 (8 Meg x 16 x 4 banks)
FBGA package (Pb-free) – x16
84-ball FBGA (12mm x 12.5mm) Rev. B
84-ball FBGA (10mm x 12.5mm) Rev. D
84-ball FBGA (8mm x 12.5mm) Rev. F
FBGA package (Pb-free) – x4, x8
60-ball FBGA (12mm x 10mm) Rev. B
60-ball FBGA (10mm x 10mm) Rev. D
60-ball FBGA (8mm x 10mm) Rev. F
FBGA package (lead solder) – x16
84-ball FBGA (12mm x 12.5mm) Rev. B
84-ball FBGA (10mm x 12.5mm) Rev. D
84-ball FBGA (8mm x 12.5mm) Rev. F
FBGA package (lead solder) – x4, x8
60-ball FBGA (12mm x 10mm) Rev. B
60-ball FBGA (10mm x 10mm) Rev. D
60-ball FBGA (8mm x 10mm) Rev. F
Timing – cycle time
2.5ns @ CL = 5 (DDR2-800)
2.5ns @ CL = 6 (DDR2-800)
3.0ns @ CL = 4 (DDR2-667)
3.0ns @ CL = 5 (DDR2-667)
3.75ns @ CL = 4 (DDR2-533)
5.0ns @ CL = 3 (DDR2-400)
Self refresh
Standard
Low-power
Operating temperature
Commercial (0°C
T
C
85°C)
Industrial (–40°C
T
C
95°C;
–40°C
T
A
85°C)
Automotive, Revision :D only
(–40°C
T
C
, T
A
105°C)
Revision
Note:
Marking
128M4
64M8
32M16
CC
BN
HR
CB
B6
CF
GC
FN
HW
GB
F6
JN
-25E
-25
-3E
-3
-37E
-5E
None
L
None
IT
AT
:B/:D/:F
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on
www.micron.com
for
product offerings and availability.
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
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