PROPERTIES OF SOLDERS
This data sheet lists the most popular solders
supplied as solid or flux-cored wire, bar, stick or
cream. We are always pleased to receive enquiries
for alternative specifications.
properties tend to fall off with the reduced tin
content.
TIN/LEAD ALLOYS
From the following diagram, it can be seen that
most tin/lead solders have a plastic range, i.e. on
heating they are pasty between the solid and liquid
states. The solders are solid at 183°C (361°F).
According to the alloy composition they have
different plastic ranges. 60/40 tin/lead alloy for
example becomes liquid at 188°C (370°F) and
therefore has a plastic range of 5°C (9°F), 40/60
tin/lead has a plastic range of 51°C (92°F).
As far as obtaining a low melting point is
concerned, there is no advantage in using a higher
tin content than 63/37, since the higher tin content
alloys have higher melting points and cost more.
ERSIN MULTICORE SAVBIT ALLOY
l
SAVES Copper and Iron-plated Soldering
Iron Bits
l
SAVES failure of soldered joints as Savbit
prevents erosion of copper wires and copper
plating
l
SAVES costs and improves reliability
Ersin Multicore Savbit Solder is produced
especially to overcome the problem of ordinary
tin/lead solders dissolving copper. It is an alloy to
which a precise amount of copper has been added
so that no further copper absorption should take
place during soldering.
The breakage time of 0.067mm copper wire in
various solders as a function of temperature is
shown below.
For applications such as wave soldering of
electronic assemblies, the requirement for a solder
with a relatively low melting point in conjunction
with a short freezing range leads to the choice of
63/37 or 60/40 Sn/Pb alloy. Although 63/37 is the
eutectic alloy, 60/40 is often used in practice as the
slightly higher 5°C freezing range of 60/40 is of no
practical significance and 60/40 is a little cheaper
than 63/37. Under conditions of slow cooling,
60/40 may give duller joints than 63/37 but this is a
purely cosmetic effect.
Lowering the tin content increases the pasty
range and raises the liquidus temperature whilst of
course reducing the cost of the alloy. Wetting
Savbit solder has been used by leading electronics
manufacturers throughout the world for over forty
years. Savbit was originally used to increase the
life of copper soldering iron bits. Soldering speed
and efficiency are increased by keeping the iron in
good condition. Iron-plated bits having a longer life
than plain copper tips are now commonly used but
they also fail eventually (usually by cracking of the
plating) and then erode rapidly unless Savbit solder
is used.
It has also been proved that the use of Savbit
alloy can improve the strength and reliability of
soldered joints very considerably. This is because
ordinary tin/lead alloys can erode thin copper wires
(as used for leads of electronic components) and
thin copper films (as used on printed circuit
boards.) This erosion is between 50 and 100 times
slower at normal soldering temperatures when
Savbit alloy is used.
Savbit solder with Ersin 362 flux has special
M.O.D. approval DTD 900/4535. At high soldering
temperatures (above 350°C) Multicore HMP alloy
gives the best strength.
Creep strength of HMP alloy:
From information
supplied, it is clear that an outstanding feature is its
very great improvement in resistance to creep by
comparison with the tin/lead solders, both at
normal and at elevated temperatures. At 150°C for
example, a 50/50 tin/lead solder will fail under a
load of 0.7 N mm-2 in approximately 10 hours. The
following results were obtained with HMP alloy at
the same temperature.
Load (N mm-2)
3.4
1.7
0.7
Time to failure
150 hours
about 1 year
no creep
HMP SOLDER
The presence of 1.5% silver substantially improves
strength and wetting power compared to 5/95
Sn/Pb solder.
96S TIN/SILVER SOLDER
Multicore 96S alloy is the pure tin/silver eutectic
alloy; like pure tin, it is bright, hardly tarnishes, is
lead-free and non-toxic, but unlike pure tin it is
relatively strong.
It has higher electrical conductivity than other soft
solders and a melting point approximately 40°C
higher than either 60/40, 63/37 or LMP alloys. For
one or more of these reasons it finds uses, despite
its higher cost, in the form of ERSIN Multicore
Solder Wire usually in Electronics applications. The
alloy itself is however used more extensively for
non-electrical applications in the form of Multicore
ARAX Acid-cored Solder, particularly for soldering
stainless steel.
96S has better wetting power on stainless steel
than other solders. Note the silver in 96S does not
suppress absorption of silver from silver plated
surfaces or metallisations into the solder, so 96S is
not suitable for soldering to such surfaces.
Applications
Making nearby soldered joints:
A useful
application of a high melting point alloy is the
soldering of joints close to each other in such a
way that the first joint is not re-melted while the
later joint, or joints, are being made. The first joint
is made with HMP alloy (296-301°C) and the
further joints are made with successively lower
melting point alloys, for example - 60/40 tin/lead
alloy (183-188°C) and good control of soldering
temperatures.
Service at high temperatures:
The maximum
safe service temperature for any solder alloy
subjected to stress is about 40°C below the solidus
melting temperature, HMP alloy can therefore be
relied upon in service up to about 255°C compared
with about 145°C for the common tin/lead alloys.
HMP alloy is consequently particularly suitable for
soldering electric motors, car radiators, high
temperature lamps and other products which are
likely to meet relatively high temperatures during
their working life.
If HMP is used to solder tin/lead coated
components, the resulting soldered joint will be a
new alloy with a lower melting point than HMP
alloy. This will depend on the thickness and
composition of the coating. The coating itself could
therefore be HMP alloy if necessary.
Service at very low temperatures:
Tin/Lead
alloys containing more than 20% of tin become
brittle at temperatures below about -70°C. The
HMP alloy containing 5% of tin remains ductile
(non-brittle) down to below -200°C. Multicore HMP
alloy is also recommended therefore for service in
extremely cold conditions.
Sn62 SOLDERS
Applications
Soldering silver-plated surfaces:
The presence
of the 2% silver in Sn62 alloys suppresses
absorption of silver from silver-plated surfaces into
the solder. A good joint is thus obtained. If an
ordinary tin/lead alloy is used on silver-plated
surfaces, the silver can be lifted from the surface
and dissolved into the solder so that a good joint is
unlikely. The attachment of terminations in the
manufacture of silver ceramic capacitors is a
typical application.
95A, 97Cu AND 99C SOLDERS
Applications
Lead-free plumbing solders:
97Cu and 99C are
lead-free (non toxic) plumbing solders with superior
wetting and capillary filling characteristics.
Lead-free high temperature solder:
95A is a high
melting point solder suitable for general purpose
soldering where a lead-free alloy is require
NOMINAL COMPOSITIONS AND SPECIFICATIONS
Alloy
Pure Tin
63EN
60EN
50EN
45EN
40EN
35EN
30EN
20/80
15/85
Sn63
Sn60
Sn50
Sn40
95A
97Cu
99C
Sav1
HMP
Sn62
96S
Tin
100
63
60
50
45
40
35
30
20
15
63
60
50
40
95
97
99.3
50
5
62
96.3
Lead
-
balance
balance
balance
balance
balance
balance
balance
balance
balance
balance
balance
balance
balance
balance
balance
balance
balance
balance
balance
balance
Antimony
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Copper
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Silver
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Specification
EN 29453 and J-STD-006
EN 29453 and J-STD-006
EN 29453 and J-STD-006
EN 29453 and J-STD-006
EN 29453 and J-STD-006
EN 29453 and J-STD-006
EN 29453 and J-STD-006
EN 29453 and J-STD-006
BS219
BS219
EN 29453 and J-STD-006
EN 29453 and J-STD-006
EN 29453 and J-STD-006
EN 29453 and J-STD-006
EN 29453 and J-STD-006
EN 29453
EN 29453
EN 29453
EN 29453
EN 29453 and J-STD-006
EN 29453 and J-STD-006
TENSILE STRENGTHS, DENSITY AND ELECTRICAL CONDUCTIVITY
Ersin Multicore Solder
Ultimate Tensile Strength
(N mm-2)
36
31
12
49
54
51
49
47
47
55
45
47
48
48
67
90
(tons in-2)
2.3
2.0
0.8
3.2
3.5
3.3
3.2
3.1
3.1
3.5
2.9
3.1
3.1
3.1
4.3
5.9
Density
(g cc-1)
11.1
7.2
7.3
10.2
7.5
10.0
9.7
9.3
9.1
8.9
8.9
8.9
8.5
8.5
8.4
8.5
Electrical conductivity
(% IACS)
8.0
10.8
13.9
8.5
13.9
8.7
9.3
10.1
10.5
10.9
10.9
10.9
11.5
11.5
11.9
11.5
HMP
95A
Pure Tin
15/85
96S
20/80
30EN
40EN
45EN
Sav1
Sn50
50EN
Sn60
60EN
Sn63
Sn62
The UTS listed above refers to the bulk solder. The values give a guide to the relative strengths at room temperature of identical
joints made with different solder alloys, but should not be used to calculate absolute joint strengths, which depend primarily on the
conditions of test; thanks are due to the International Tin Research Institute for their co-operation in arriving at values all determined
under the same conditions, viz specimens freshly cast at 50°C above liquidus, unmachined, tested at 20°C at 1/16in. per minute
strain rate. 1N mm-2 = 145 psi = 0.102 kg mm-2 = 0.065 tons in-2.
COLOUR CODES FOR WIRE, TEMPERATURES AND USES
Alloy
Sn63
60EN
Sav1
50EN
45EN
40EN
30EN
20/80
15/85
Sn62
Pure Tin
HMP
95A
96S
Multicore
Black on white
Red on white
Green on white
Black on white
Black on white
Green on white
Black on white
Purple on white
Orange on white
Red on blue
Red on green
Blue on white
Black on white
Black on white
Melting
Solidus
(°C)
183
183
183
183
183
183
183
183
227
179
232
296
236
221
Recommended
Liquidus (°C)
183
188
215
212
224
234
255
275
288
179
232
301
243
221
Uses
243
248
275
272
284
294
315
335
348
239
292
361
303
281
High quality work requiring low melting point alloy.
Hand soldering radio, telephone and electrical equipment;
batteries.
Fuses, motors, radiators and lamps.
Lamps.
Lamps.
Particularly useful when soldering ceramics or other silver-
coated surfaces.
Used when a lead-free solder is required.
Special High Melting Point solder.
High melting lead-free alloy.
Bright, strong, non-toxic lead-free solder
Microcontroller MCU
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