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53261-0390

Description
CONN HEADER 3POS 1.25MM R/A SMD
CategoryThe connector   
File Size739KB,17 Pages
ManufacturerMolex Premise Network
Download Datasheet Parametric View All

53261-0390 Overview

CONN HEADER 3POS 1.25MM R/A SMD

53261-0390 Parametric

Parameter NameAttribute value
Connector typeConnector
Contact typeMale plug type
Spacing - Mating0.049"(1.25mm)
Number of pins3
Number of rows1
Line spacing - patching-
Number of pins loadedall
styleBoard to cable/wire
shieldCovered - 4 walls
Installation typeSurface mount, right angle
Terminationwelding
Fastening typepin lock
Contact Length - Mating-
Contact length - terminal-
Overall contact length-
Insulation height0.134"(3.40mm)
Contact shaperectangle
Contact surface treatment - matingTin - Lead
Contact Surface Treatment Thickness - Mating39.4µin(1.00µm)
Contact Surface Preparation - Column-
Contact materialPhosphor bronze
Insulation MaterialsPolyamide (PA46), Nylon 46
characteristicFixed solder tail
Operating temperature-
Intrusion protection-
Material flammability ratingUL94 V-0
Insulation colornatural
Rated current-
Rated voltage-
Joint stack height-
Contact Surface Treatment Thickness - Column-
applicationAutomotive, General, Industrial, Medical
LANGUAGE
PRODUCT SPECIFICATION
【1.適用範囲
SCOPE】
本仕様書は、
殿 に納入する
1.25mmピッチ SMT電線対基板用
コネクタ について規定する。
This specification covers the 1.25mm PITCH WIRE TO BOARD SMT CONNECTOR series.
【2.½品名称及び型番
PRODUCT NAME AND PART NUMBER】
½ 品 名 称
Product Name
ターミナル
Male Terminal(AWG #26-28)
ターミナル
Male Terminal(AWG #28-32)
ハウジング
Housing
ウェハー アッセンブリ
Wafer Assembly (R/A)
53261-**19テーピング梱包品
(乾燥剤入り、ハイバリア梱包)
Embossed Tape Package for 53261-**19
(High barrier package including desiccant)
ウェハー アッセンブリ 黒
Wafer Assembly (R/A) BLACK
53261-**17テーピング梱包品
(乾燥剤入り、ハイバリア梱包)
Embossed Tape Package for 53261-**17
(High barrier package including desiccant)
ウェハー アッセンブリ
Wafer Assembly (ST.)
53398-**19テーピング梱包品
(乾燥剤入り、ハイバリア梱包)
Embossed Tape Package for 53398-**19
(High barrier package including desiccant)
½ 品 型 番
Part Number
50079-8*00
50058-8*00
51021-**00
53261-**19
JAPANESE
ENGLISH
53261-**71
53261-**17
53261-**27
53398-**19
53398-**71
* :
図面参照
Refer to the drawing.
R
T
SHEET
1-14 1-17
REV.
REVISE ON PC ONLY
TITLE:
U
変 更
REVISED
116810
‘17/05/12 R.TANAKA
WRITTEN
BY:
E.SUZUKI
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
½品仕様書
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DESIGN CONTROL
STATUS
J
DOCUMENT NUMBER
CHECKED
BY:
K.TOJO
APPROVED
BY:
M.SASAO
DATE:
YR/MO/DAY
2004/02/05
FILE NAME
PS51021024.doc
SHEET
1 OF 17
PS-51021-024
EN-037(2015-11 rev.1)
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