dual power SCR outputs. This device features Rapid
Turn-On (non-zero-cross) control of the output SCRs,
which makes it ideal for precisely switching AC loads
independent of the load voltage phase.
The optically coupled input and output circuits
provide 3750V
rms
of isolation and noise immunity
between the control and load circuits. As a result, the
CPC1966BX8 is well suited for industrial environments
where electromagnetic interference would disrupt the
operation of plant facility communication and control
systems.
Features
•
•
•
•
•
•
•
•
•
•
Load Current up to 3A
rms
800V
P
Blocking Voltage
Rapid Turn-On (Non-Zero-Cross Turn-On)
5mA Sensitivity
Creepage Distance:
5.7 mm (0.224 inches)
DC Control, AC Output
Optically Isolated
Low EMI and RFI Generation
High Noise Immunity
Flammability Rating UL 94 V-0
Approvals
•
UL Recognized Component: File E69938
•
CSA Certified Component: Certificate 1172007
Ordering Information
Part #
CPC1966BX8
Description
8-Pin Power SOIC (25/Tube)
Applications
•
•
•
•
•
•
•
•
•
•
•
•
Lighting
HVAC (Heating, Ventilation, Air Conditioning)
Programmable Control
Process Control
Power Control Panels
Remote Switching
Gas Pump Electronics
Contactors
Large Relays
Solenoids
Motors
Heaters
Pin Configuration
AC Load
8
7
AC Load
6
5
R
1
N/C
2
+ LED
3
– LED
4
N/C
Rapid Turn-On (Non-Zero-Cross) Waveforms
Control
AC Load
Voltage
Load
Current
Voltage
Across
Relay
DS-CPC1966BX8-R01
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1
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
i
2
t Fusing Current
(1/2 Sine Wave, 60Hz)
ESD, Human Body Model
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
CPC1966BX8
Symbol
V
DRM
I
F
-
P
D
-
-
V
IO
T
A
T
A
Ratings
800
5
50
1
150
2400
8
4
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
A
2
s
kV
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufa turing testing requirements.
Derate linearly 1.33 mW / ºC
Derate linearly 20 mW / ºC
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current, Continuous
Maximum Surge Current
Off State Leakage Current
On-State Voltage Drop
Critical Rate of Rise of On-State Current
Off-State dV/dt
Switching Speeds
Turn-on
Turn-on
Turn-off
Holding Current
Latching Current
Operating Frequency
Input Characteristics
Input Control Current to Activate
1
Input Drop-out Voltage
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
Conditions
V
L
=20-240V
rms
t < 16ms
V
DRM
I
L
=2A
P
-
Symbol
I
L
I
P
I
LEAK
-
di/dt
dV/dt
t
on
t
off
I
H
I
L
Min
0.1
-
-
-
-
1000
-
-
-
-
-
20
-
0.8
0.9
-
-
Typ
-
-
-
0.88
-
-
45
-
-
44
48
-
-
-
1.2
-
1
Max
3
30
100
1.1
75
-
-
20
0.5
50
75
500
5
-
1.4
10
-
Units
A
rms
A
A
P
V
P
A/s
V/s
s
cycles
mA
mA
Hz
mA
V
V
A
pF
-
I
F
= 5mA, Resistive, V
L
=20V
I
F
= 15mA, Resistive, V
L
=20V
-
-
-
-
-
I
F
=5mA
V
R
=5V
V
IO
=0V, f=1MHz
I
F
-
V
F
I
R
C
IO
For high-noise environments, or for high-frequency operation, use I
F
> 10mA.
2
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
LED Forward Voltage Drop
vs. Temperature
1.6
Forward Voltage (V)
LED Current (mA)
1.5
1.4
I
F
=30mA
1.3
1.2
1.1
1.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=10mA
I
F
=5mA
0.75
-40
-20
0
20
40
60
Temperature (C)
80
100
I
F
=50mA
1.75
CPC1966BX8
Typical I
F
for Switch Operation
vs. Temperature
125
Holding Current (mA)
100
75
50
25
0
-40
Holding Current vs. Temperature
(I
F
=0mA)
1.50
1.25
1.00
-20
0
20
40
60
Temperature (ºC)
80
100
Turn-On Time vs. LED Current
(I
L
=1A)
35
30
Turn-On Time ( s)
25
20
15
10
5
0
0
10
20
30
40
LED Forward Current (mA)
50
Turn-On Time ( s)
30
25
20
15
10
5
0
-40
-20
Typical Turn-On Time
vs. Temperature
(I
F
=5mA, I
L
=1A)
0
20
40
60
Temperature (ºC)
80
100
Load Current vs. Load Voltage
(I
F
=5mA)
3
2
Load Current (A)
Voltage Drop (V)
1
0
-1
-2
-3
-1.0
-0.5
0.0
Load Voltage (V)
0.5
1.0
0.50
1.00
1.25
Output Voltage Drop vs. Temperature
4.0
I
L
=3A
Load Current (A)
I
L
=2A
I
L
=1A
0.75
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
Maximum Load Current
vs. Temperature
(I
F
=5mA)
-20
0
20
40
60
Temperature (ºC)
80
100
Blocking Voltage vs. Temperature
1100
Blocking Voltage (V
P
)
1050
1000
950
900
850
800
-40
-20
0
20
40
60
Temperature (ºC)
80
100
10000
Leakage Current (nA)
Typical Leakage Current
vs. Temperature
1000
V
L
=800V
100
V
L
=300V
10
1
-40
-20
0
20
40
60
Temperature (ºC)
80
100
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R01
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Manufacturing Information
Moisture Sensitivity
CPC1966BX8
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
CPC1966BX8
Moisture Sensitivity Level (MSL) Classification
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (T
C
) of this product and the maximum dwell time the
body temperature of this device may be (T
C
- 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of
J-STD-020
must be observed.
Device
CPC1966BX8
Classification Temperature (T
c
)
245ºC
Dwell Time (t
p
)
30 seconds
Max Reflow Cycles
3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
4
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MECHANICAL DIMENSIONS
CPC1966BX8
21.082 ± 0.381
(0.830 ± 0.015)
Pin 8
16.764 ± 0.381
(0.660 ± 0.015)
Pin 1
0.762 ± 0.102
(0.030 ± 0.004)
5.080 ± 0.127
(0.200 ± 0.005)
7.622 ± 0.127
(0.300 ± 0.005)
CPC1966BX8
Recommended PCB Pattern
3.302 ± 0.051
(0.130 ± 0.002)
0.127 ± 0.076
(0.005 ± 0.003)
15.90
(0.626)
0.889 ± 0.127
(0.035 ± 0.005)
1.016 ± 0.127
(0.040 ± 0.005)
1.651 ± 0.102
(0.065 ± 0.004)
5.080 ± 0.127
(0.200 ± 0.005)
0.381 ± 0.025
(0.015 ± 0.001)
5.080
(0.200)
7.622
(0.300)
5.080
(0.200)
0.95
(0.037)
10.160 ± 0.254
(0.400 ± 0.010)
2.00
(0.079)
1.524 typ
(0.060)
Dimensions
Unless Otherwise Noted
mm
Note: Pin-to-pin tolerances are non-cumulative.
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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