EEWORLDEEWORLDEEWORLD

Part Number

Search

ATS-08C-117-C3-R0

Description
HEATSINK 45X45X10MM XCUT T412
CategoryThermal management products   
File Size134KB,1 Pages
ManufacturerERP
Environmental Compliance
Download Datasheet Parametric View All

ATS-08C-117-C3-R0 Overview

HEATSINK 45X45X10MM XCUT T412

ATS-08C-117-C3-R0 Parametric

Parameter NameAttribute value
typetop installation
cooling packageClassification (BGA, LGA, CPU, ASIC...)
Joining methodPush your feet
shapesquare, fins
length1.772"(45.00mm)
width1.772"(45.00mm)
diameter-
Height from base (fin height)0.394"(10.00mm)
Power dissipation at different temperature rises-
Thermal resistance at different forced airflows10.58°C/W @ 100 LFM
Thermal resistance under natural conditions-
Materialaluminum
Material platingblue anodized
pushPIN™ Heat Sink Assembly
ATS Part#:
ATS-08C-117-C3-R0
Description:
pushPIN™ HS ASMBLY,COARSE-PITCH,XCUT, HOLE PATTERN:4-CORNER,BLUE,T412
Heat Sink Type:
pushPIN™ Heat Sink Assembly
Heat Sink Attachment:
pushPIN™ / Spring Kit
Features & Benefits
»
Quick Attachment – Push pins feature a flexible barb at the end designed to
engage with pre-drilled holes in a PCB.
»
Compression Springs add the necessary force to hold the assembly together
for secure attachment. Select from over 21 different springs to achieve
precise force required.
»
Push Pin Material available in brass or plastic in 10 sizes ranging from 9-
20mm in length. Stainless steel hardware kit available for more secure
attachment. Visit www.qats.com for available options.
»
Heat Sinks Designed for All Airflow Conditions. Select from over 112 fine
pitch HS designed for high velocity air flows and 98 course pitch HS
designed for low velocity air flow conditions.
»
Pre-assembled with phase-changing material for increased thermal
performance. Double-sided thermal tape and no TIM options available to
meet application-specific requirements.
»
Lightweight, aluminum HS extruded from AL6063 provide optimal heat
transfer with a blue anodized finish.
»
All components are RoHS and REACH compliant.
»
Industry standard hole pattern. Recommended through hole size is 3.175mm
For Illustration Purposes ONLY.
Bill of Material
Heat Sink:
ATS-CPX045045010-117-C3-R0
Push Pin:
Springs:
ATS-PP-03
ATS-PPS-08
Qty
1
2
2
Thermal Performance
100
AIR VELOCITY - LFM (m/s)
(0.5)
Thermal Resistance
°C/W
Unducted Flow
Ducted Flow
10.58
5.07
200
(1.0)
5.88
3.77
300
(1.5)
4.63
3.20
400
(2.0)
4.00
2.84
500
(2.5)
3.59
2.60
600
(3.0)
3.30
2.41
700
(3.5)
3.07
2.26
Fin
Pitch
COARSE-
PITCH
Fin
Type
XCUT
Hole
Pattern
4-CORNER
Product Detail
P/N
ATS-08C-117-C3-R0
A
45
Dimensions
B
C
E
45
10
38
F
38
NOTES:
Push Pin
ATS-PP-03
Spring
ATS-PPS-08
TIM
T412
Finish
BLUE ANODIZED
1) Dimension A is the length of the heat sink in the direction of the flow.
2) Dimension B is the width of the heat sink perpendicular to the flow direction.
3) Dimension C is the heat sink height from the bottom of the base to the top of the fin
field.
4) Dimension E is the distance between holes perpendicular to the direction of flow.
5) Dimension F is the distance between holes in the direction of flow.
6) Thermal performance data are provided for reference only. Actual performance may
vary by application.
7) ATS reserves the right tp update or change its products without notice to improve the
design or performance.
8) ATS certifies that this heat sink assemby is RoHS-6 and REACH compliant.
9) Contact ATS to learn about custom options available.
For Illustration Purposes ONLY.
For further technical information, please contact Advanced Thermal Solutions, Inc.
89-27 ACCESS ROAD, NORWOOD, MA 02062 USA | T: 781.769. 2800 F: 781.769.9979 | WWW.QATS.COM
R2-0917
No MSP430
After one or two months of study, I basically mastered the use of MSP430, but when I really wanted to develop a project, I found the biggest disadvantage of MSP430 - it was too expensive! Therefore, I...
ryzhou Microcontroller MCU
How to implement a sleep-like function in DDK (urgent, online, etc.)
As the title says, I used KeWaitForSingleObject to implement the millisecond sleep function, but the result was a blue screen. I searched the DDK help but couldn't find a solution. I hope an expert ca...
jscaptain Embedded System
DJYOS for LM3S8962 transplantation
LM3S8962 is a cortex-m3 MCU . Thanks to the architectural advantages of the cortex-m3 processor, the porting process of LM3S8962 is quite simple. The only things that need to be modified are: 1. Link ...
youki12345 Microcontroller MCU
On-chip memory resources of RSL10
[i=s]This post was last edited by cruelfox on 2021-4-27 23:31[/i]  There are two processors inside RSL10, in addition to the main ARM Cortex-m3, there is also a dedicated LPDSP32. The two processors h...
cruelfox onsemi and Avnet IoT Innovation Design Competition
[Transfer] How to add TM4C chip to Keil arm?
Kei MDK V4.60/4.70/4.72 are all supported. If it is convenient, upgrade to the new version. In addition, if it is TM4C123X series, it is renamed from LM4Fxxx. If you can find the LM4Fxxx model, it is ...
sacq Microcontroller MCU
The 51 development board I made is back... Haha!!!
The soldering is not finished yet. Two large chips, one is STC 52, the other is 8255. This development board is mainly designed for students to learn microcomputer principles, because serial port, tim...
youki12345 51mcu

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2447  2035  2446  455  513  50  41  10  11  13 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号