SN74AUC2G34DBVRE4 datasheet, PDF

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SN74AUC2G34DBVRE4: DescriptionBuffers & Line Drivers 18-Bit Univ Bus Drv With 3-State Outputs; Categorylogic logic; File Size1MB，19 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74AUC2G34DBVRE4 Overview

Buffers & Line Drivers 18-Bit Univ Bus Drv With 3-State Outputs

SN74AUC2G34DBVRE4 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
entfamilyid	891913
Maker	Texas Instruments
Objectid	2068909217
Parts packaging code	SOT-23
package instruction	LSSOP, TSOP6,.11,37
Contacts	6
Reach Compliance Code	unknow
compound_id	940995
series	AUC
JESD-30 code	R-PDSO-G6
JESD-609 code	e4
length	2.9 mm
Load capacitance (CL)	15 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.005 A
Humidity sensitivity level	1
Number of functions	2
Number of entries	1
Number of terminals	6
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LSSOP
Encapsulate equivalent code	TSOP6,.11,37
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
method of packing	TR
Peak Reflow Temperature (Celsius)	260
power supply	1.2/2.5 V
Prop。Delay @ Nom-Su	3.4 ns
propagation delay (tpd)	3.4 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	1.45 mm
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	0.8 V
Nominal supply voltage (Vsup)	1.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	0.95 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	1.6 mm

SN74AUC2G34DBVRE4 Related Products

	SN74AUC2G34DBVRE4	SN74AUC2G34YEPR
Description	Buffers & Line Drivers 18-Bit Univ Bus Drv With 3-State Outputs	Buffers & Line Drivers DUAL BUFFER GATE
Is it Rohs certified?	conform to	incompatible
Maker	Texas Instruments	Texas Instruments
Parts packaging code	SOT-23	BGA
package instruction	LSSOP, TSOP6,.11,37	VFBGA, BGA6,2X3,20
Contacts	6	6
Reach Compliance Code	unknow	_compli
series	AUC	AUC
JESD-30 code	R-PDSO-G6	R-XBGA-B6
length	2.9 mm	1.4 mm
Load capacitance (CL)	15 pF	15 pF
Logic integrated circuit type	BUFFER	BUFFER
MaximumI(ol)	0.005 A	0.005 A
Number of functions	2	2
Number of entries	1	1
Number of terminals	6	6
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	LSSOP	VFBGA
Encapsulate equivalent code	TSOP6,.11,37	BGA6,2X3,20
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TR	TR
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED
power supply	1.2/2.5 V	1.2/2.5 V
Prop。Delay @ Nom-Su	3.4 ns	3.4 ns
propagation delay (tpd)	3.4 ns	3.4 ns
Certification status	Not Qualified	Not Qualified
Schmitt trigger	NO	NO
Maximum seat height	1.45 mm	0.5 mm
Maximum supply voltage (Vsup)	2.7 V	2.7 V
Minimum supply voltage (Vsup)	0.8 V	0.8 V
Nominal supply voltage (Vsup)	1.2 V	1.2 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	BALL
Terminal pitch	0.95 mm	0.5 mm
Terminal location	DUAL	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	1.6 mm	0.9 mm

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