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SN74AUC1G04YZAR

Description
Inverters Single
Categorylogic    logic   
File Size296KB,12 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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SN74AUC1G04YZAR Overview

Inverters Single

SN74AUC1G04YZAR Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeDSBGA
package instructionVFBGA, BGA5,2X3,20
Contacts5
Reach Compliance Codecompli
Factory Lead Time1 week
seriesAUC
JESD-30 codeR-XBGA-B5
length1.4 mm
Logic integrated circuit typeINVERTER
MaximumI(ol)0.005 A
Number of functions1
Number of entries1
Number of terminals5
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeVFBGA
Encapsulate equivalent codeBGA5,2X3,20
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.2/2.5 V
propagation delay (tpd)3 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)0.8 V
Nominal supply voltage (Vsup)1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width0.9 mm

SN74AUC1G04YZAR Related Products

SN74AUC1G04YZAR SN74AUC1G04YEAR SN74AUC1G04YEPR
Description Inverters Single Inverters Single. Inverters SINGLE INVERTER GATE
Is it Rohs certified? conform to incompatible incompatible
Maker Texas Instruments Texas Instruments Texas Instruments
Parts packaging code DSBGA DSBGA BGA
package instruction VFBGA, BGA5,2X3,20 VFBGA, BGA5,2X3,20 VFBGA, BGA5,2X3,20
Contacts 5 5 5
Reach Compliance Code compli _compli _compli
Factory Lead Time 1 week 1 week 1 week
series AUC AUC AUC
JESD-30 code R-XBGA-B5 R-XBGA-B5 R-XBGA-B5
length 1.4 mm 1.4 mm 1.4 mm
Logic integrated circuit type INVERTER INVERTER INVERTER
MaximumI(ol) 0.005 A 0.005 A 0.005 A
Number of functions 1 1 1
Number of entries 1 1 1
Number of terminals 5 5 5
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code VFBGA VFBGA VFBGA
Encapsulate equivalent code BGA5,2X3,20 BGA5,2X3,20 BGA5,2X3,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing TAPE AND REEL TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 1.2/2.5 V 1.2/2.5 V 1.2/2.5 V
propagation delay (tpd) 3 ns 3 ns 3 ns
Certification status Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO
Maximum seat height 0.5 mm 0.5 mm 0.5 mm
Maximum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V
Minimum supply voltage (Vsup) 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) 1.2 V 1.2 V 1.2 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL
Terminal pitch 0.5 mm 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 0.9 mm 0.9 mm 0.9 mm
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