Digital Output Ground Voltage (OGND) ........ –0.3V to 1V
Analog Input Voltage (Note 3) ...... –0.3V to (V
DD
+ 0.3V)
Digital Input Voltage..................... –0.3V to (V
DD
+ 0.3V)
Digital Output Voltage ................ –0.3V to (OV
DD
+ 0.3V)
Power Dissipation .............................................1500mW
Operating Temperature Range
LTC2242C-10 ........................................... 0°C to 70°C
LTC2242I-10.........................................–40°C to 85°C
Storage Temperature Range .................. –65°C to 150°C
orDer inForMaTion
LEAD FREE FINISH
LTC2242CUP-10#PBF
LTC2242IUP-10#PBF
LEAD BASED FINISH
LTC2242CUP-10#PBF
LTC2242IUP-10#PBF
TAPE AND REEL
LTC2242CUP-10#TRPBF
LTC2242IUP-10#TRPBF
TAPE AND REEL
LTC2242CUP-10#TR
LTC2242IUP-10#TR
PART MARKING*
LTC2242UP-10
LTC2242UP-10
PART MARKING*
LTC2242UP-10
LTC2242UP-10
PACKAGE DESCRIPTION
64-Lead (9mm × 9mm) Plastic QFN
64-Lead (9mm × 9mm) Plastic QFN
PACKAGE DESCRIPTION
64-Lead (9mm × 9mm) Plastic QFN
64-Lead (9mm × 9mm) Plastic QFN
TEMPERATURE RANGE
0°C to 70°C
–40°C to 85°C
TEMPERATURE RANGE
0°C to 70°C
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *Temperature grades are identified by a label on the shipping container.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
temperature range, otherwise specifications are at T
A
= 25°C. (Note 4)
PARAMETER
Resolution (No Missing Codes)
Integral Linearity Error
Differential Linearity Error
Offset Error
Gain Error
CONDITIONS
converTer characTerisTics
The
l
denotes the specifications which apply over the full operating
MIN
●
ENC
+
17
ENC
–
18
SHDN 19
OE
20
DNC 21
DNC 22
DNC/DB0 23
DNC/DB1 24
OGND 25
OV
DD
26
D0
–
/DB2 27
D0
+
/DB3 28
D1
–
/DB4 29
D1
+
/DB5 30
D2
–
/DB6 31
D2
+
/DB7 32
TYP
±0.4
±0.2
±5
±0.7
MAX
1
0.7
17
3.5
UNITS
Bits
LSB
LSB
mV
%FS
10
–1
–0.7
–17
–3.5
Differential Analog Input (Note 5)
Differential Analog Input
(Note 6)
External Reference
●
●
●
●
224210fd
2
LTC2242-10
temperature range, otherwise specifications are at T
A
= 25°C. (Note 4)
PARAMETER
Offset Drift
Full-Scale Drift
Transition Noise
Internal Reference
External Reference
SENSE = 1V
CONDITIONS
converTer characTerisTics
The
l
denotes the specifications which apply over the full operating
MIN
TYP
±10
±60
±45
0.18
MAX
UNITS
µV/C
ppm/C
ppm/C
LSB
RMS
analog inpuT
The
●
denotes the specifications which apply over the full operating temperature range, otherwise
specifications are at T
A
= 25°C. (Note 4)
SYMBOL
V
IN
V
IN, CM
I
IN
I
SENSE
I
MODE
I
LVDS
t
AP
t
JITTER
PARAMETER
Analog Input Range (A
IN+
– A
IN–
)
Analog Input Common Mode (A
IN+
+ A
IN–
)/2
Analog Input Leakage Current
SENSE Input Leakage
MODE Pin Pull-Down Current to GND
LVDS Pin Pull-Down Current to GND
Sample and Hold Acquisition Delay Time
Sample and Hold Acquisition Delay Time Jitter
Full Power Bandwidth
Figure 8 Test Circuit
CONDITIONS
2.375V < V
DD
< 2.625V (Note 7)
Differential Input (Note 7)
0 < A
IN+
, A
IN–
< V
DD
0V < SENSE < 1V
●
●
●
●
MIN
1.2
–1
–1
TYP
±0.5 to ±1
1.25
MAX
1.3
1
1
UNITS
V
V
µA
µA
µA
µA
ns
fs
RMS
MHz
7
7
0.4
95
1200
DynaMic accuracy
SYMBOL
SNR
PARAMETER
The
●
denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at T
A
= 25°C. A
IN
= –1dBFS. (Note 4)
CONDITIONS
10MHz Input
70MHz Input
140MHz Input
240MHz Input
l
MIN
59.2
TYP
60.6
60.5
60.5
60.4
78
MAX
UNITS
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dBc
Signal-to-Noise Ratio (Note 10)
SFDR
Spurious Free Dynamic Range
2nd or 3rd Harmonic
(Note 11)
10MHz Input
70MHz Input
140MHz Input
240MHz Input
10MHz Input
70MHz Input
140MHz Input
240MHz Input
10MHz Input
70MHz Input
140MHz Input
240MHz Input
f
IN1
= 135MHz, f
IN2
= 140MHz
l
l
l
63
75
74
73
85
Spurious Free Dynamic Range
4th Harmonic or Higher
(Note 11)
71
85
85
85
60.4
S/(N+D)
Signal-to-Noise Plus
Distortion Ratio
(Note 12)
58.2
60.4
60.3
60.2
81
IMD
Intermodulation Distortion
224210fd
3
LTC2242-10
inTernal reFerence characTerisTics
PARAMETER
V
CM
Output Voltage
V
CM
Output Tempco
V
CM
Line Regulation
V
CM
Output Resistance
2.375V < V
DD
< 2.625V
–1mA < I
OUT
< 1mA
CONDITIONS
I
OUT
= 0
(Note 4)
MIN
1.225
TYP
1.25
±35
3
2
MAX
1.275
UNITS
V
ppm/°C
mV/V
Ω
DigiTal inpuTs anD DigiTal ouTpuTs
SYMBOL
V
ID
V
ICM
R
IN
C
IN
V
IH
V
IL
I
IN
C
IN
OV
DD
= 2.5V
C
OZ
I
SOURCE
I
SINK
V
OH
V
OL
OV
DD
= 1.8V
V
OH
V
OL
V
OD
V
OS
High Level Output Voltage
Low Level Output Voltage
Differential Output Voltage
Output Common Mode Voltage
I
O
= –500µA
I
O
= 500µA
Hi-Z Output Capacitance
Output Source Current
Output Sink Current
High Level Output Voltage
Low Level Output Voltage
OE
= High (Note 7)
V
OUT
= 0V
V
OUT
= 2.5V
I
O
= –10µA
I
O
= –500µA
I
O
= 10µA
I
O
= 500µA
PARAMETER
Differential Input Voltage
Common Mode Input Voltage
Input Resistance
Input Capacitance
High Level Input Voltage
Low Level Input Voltage
Input Current
Input Capacitance
(Note 7)
V
DD
= 2.5V
V
DD
= 2.5V
V
IN
= 0V to V
DD
(Note 7)
CONDITIONS
(Note 7)
ENCODE INPUTS (ENC
+
, ENC
–
)
The
●
denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at T
A
= 25°C. (Note 4)
MIN
●
●
TYP
MAX
UNITS
V
0.2
1.2
1.5
1.5
4.8
2
2.0
Internally Set
Externally Set (Note 7)
V
V
kΩ
pF
V
LOGIC INPUTS (OE, SHDN)
●
●
●
1.7
0.7
–10
3
10
V
µA
pF
LOGIC OUTPUTS (CMOS MODE)
3
37
23
2.495
2.45
0.005
0.07
1.75
0.07
●
●
pF
mA
mA
V
V
V
V
V
V
454
1.375
mV
V
LOGIC OUTPUTS (LVDS MODE)
100Ω Differential Load
100Ω Differential Load
247
1.125
350
1.250
224210fd
4
LTC2242-10
power requireMenTs
SYMBOL
V
DD
P
SLEEP
P
NAP
OV
DD
I
VDD
I
OVDD
P
DISS
OV
DD
I
VDD
P
DISS
PARAMETER
Analog Supply Voltage
Sleep Mode Power
Nap Mode Power
Output Supply Voltage
Analog Supply Current
Output Supply Current
Power Dissipation
Output Supply Voltage
Analog Supply Current
Power Dissipation
(Note 8)
(Note 7)
The
●
denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at T
A
= 25°C. (Note 9)
CONDITIONS
(Note 8)
SHDN = High,
OE
= High, No CLK
SHDN = High,
OE
= Low, No CLK
(Note 8)
●
●
●
●
●
MIN
2.375
TYP
2.5
1
28
MAX
2.625
UNITS
V
mW
mW
LVDS OUTPUT MODE
2.375
2.5
285
58
858
0.5
2.5
285
740
2.625
320
70
975
2.625
320
V
mA
mA
mW
V
mA
mW
CMOS OUTPUT MODE
●
●
TiMing characTerisTics
SYMBOL
f
S
t
L
t
H
t
AP
t
OE
t
D
t
C
PARAMETER
Sampling Frequency
ENC Low Time (Note 7)
ENC High Time (Note 7)
Sample-and-Hold Aperture Delay
Output Enable Delay
ENC to DATA Delay
ENC to CLKOUT Delay
DATA to CLKOUT Skew
Rise Time
Fall Time
Pipeline Latency
CMOS OUTPUT MODE
t
D
t
C
Pipeline
Latency
ENC to DATA Delay
ENC to CLKOUT Delay
DATA to CLKOUT Skew
Full Rate CMOS
Demuxed Interleaved
Demuxed Simultaneous
The
●
denotes the specifications which apply over the full operating temperature
Most control systems use voltage monitoring or watchdog circuits to ensure stable operation of the system. With hardware reset, the system can be reset at any time by pressing a key switch, and the pr...
[font=宋体][b][font=宋体]Introduction[/font] [/b] [font=宋体]With the continuous improvement of the cost-effectiveness of digital signal processing chips, the application field of digital signal processing ...
This is the famous Quantum hard drive. Quantum Corporation of the United States was founded in 1980 and is the originator of the hard drive industry. It has been leading the hard drive industry trend ...
The core of a machine vision system is image acquisition and processing. All information comes from images, and image quality is crucial to the entire vision system. A good image can improve the st...[Details]
Abstract:
With the increasing complexity of smart vehicle electrical and electronic architectures, the full lifecycle management of vehicle electronic control components faces multiple challe...[Details]
introduction
Bluetooth technology is a short-range wireless communication technology designed to replace wired cables. It is a wireless communication technology standard developed by the SIG, ...[Details]
1. Introduction
Electronic scales are gradually replacing traditional measuring tools like springs and balances in everyday life, such as electronic price computing scales and electronic weigh...[Details]
With the increasing number of new energy vehicles on the road, the deployment of supporting facilities for these vehicles has accelerated, and new energy vehicles have gradually entered the vision ...[Details]
According to Nikkei, Japan has performed poorly in responding to China's power semiconductor challenges.
There are five major companies in Japan's power chip market: Mitsubishi Electric,...[Details]
Over the past decade, the narrative surrounding fuel vehicles has been one of decline and replacement. Under the onslaught of new energy vehicles, traditional automakers have been forced to acceler...[Details]
Electric vehicles will revolutionize transportation, changing fuel consumption, carbon emissions, costs, maintenance, and driving habits. Currently, a major selling point for electric vehicles is t...[Details]
Civilian internal combustion engines operate in the range of approximately 1000-4000 rpm. This results in the engine's kinetic energy being ineffective at low or high rpm, making starting difficult...[Details]
New version helps developers build secure and trustworthy embedded systems
Shanghai, China—August 21, 2025—
QNX, a division of BlackBerry Ltd., today announced the release of QNX...[Details]
introduction
With the development of society, people's requirements for the quality of refrigerated and frozen foods are constantly improving. The changes in food appearance and nutritional co...[Details]
For self-driving cars, LiDAR is the sensory organ that allows them to "see the road." Simply put, its operating principle involves sending out a laser beam, receiving the echo, and ultimately gener...[Details]
With the continuous development of ultrasonic technology, ultrasound has been widely used in fields such as inspection, cleaning, welding, and medical treatment, and has even found its way into tex...[Details]
Pure electric vehicles have experienced rapid growth in recent years, and many consumers now consider them as a top choice when purchasing a car. But do you know how to choose a satisfactory and sa...[Details]
The drive shaft is the shaft in a universal joint that transmits power. As a high-speed, low-support rotating body, its dynamic balance is crucial. Generally, drive shafts undergo dynamic balancing...[Details]
DSP and ARM Processors
京公网安备 11010802033920号
EEWORLD
